View detail for Parallel EEPROM Die Products

Parallel EEPROM
Die Products
OVERVIEW
Features
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High Performance CMOS Technology
Low Power Dissipation – Active and Standby
Hardware and Software Data Protection Features
DATA Polling for End of Write Detection
High Reliability
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Endurance:104 Cycles
Extended Endurance: 105 Cycles (Option)
Data Retention: 10 Years
Single 5V ± 10% Supply
Single 3V ± 10% Supply
CMOS Compatible Inputs and Outputs
-40°C to +85°C Operating Range
Typical Die Thickness of 22mil
Military Product Performance (-55°C to +125°C) Available
Element Evaluation Program Available
Description
The Atmel® Parallel EEPROMs are available in die form. All die products are
100% electrically tested in wafer form and visually inspected after saw and clean.
The Atmel EEPROM die products are processed with an advanced CMOS
floating gate technology. As with all Atmel products, they are designed and tested
to ensure high quality and manufacturability. The devices include such features as
internal error correction for extended endurance and improved data retention
characteristics.
Atmel offers a full line of 5.5V die products (see Section 2., “Die Product
Offering”). An optional Element Evaluation test flow, which entails sample
packaging and electrical screening in accordance with MIL-STD 883 M5008, is
available for military grade applications. Standard shipping methods for Atmel die
products include protective waffle and wafer carriers. Optional packaging
methods are available, including wafer ring mounting and wafer orientation to
accommodate the customer’s manufacturing equipment.
Atmel-0554G-PEEPROM-Die-Products-Overview_072014
1.
Testing
Reference Parallel EEPROM Die Product Test Flow. Die product Sort Test includes checks for DC parameters
such as ICC and input leakage as well as for AC switching parameters. Data pattern testing, several oxide
stress tests, and data retention high temperature bake tests are performed on a 100% basis to guard against
pattern sensitivity, infant mortality, and ensure integrity of the core cell oxides. Contact Atmel sales for a detailed
die product test flow diagram, including all test conditions.
Atmel also supplies die product processed to the Element Evaluation Test Flow which includes wafer lot
assembly and test in accordance with MIL-STD 883 M5004 (reference Atmel Military MIL-STD 883 Test Flow,
Section 7).
Figure 1-1.
Standard Parallel EEPROM Die Product Test Flow
FAB
E-TEST (25˚C/100%)
DIE SORT 1 (25˚C/100%)
AC/DC Datasheet Parameters, ICC, Leakage
Programming Characteristics (0,1,CKB,/CKB)
Page Mode Characteristics
Exit – Die Programmed
RETENTION BAKE
250˚C/24 Hours
DIE SORT 2 (25˚C/100%)
Verify Pattern (CBK)
AC/DC Datasheet Parameters, ICC, Leakage
Byte Cycling (Diagonal)
Exit – Blank
SAW AND CLEAN OPTICAL INSP
100%
MIL-STD883 M2010
ELEMENT EVALUATION
(Optional Process Flow – Contact
Factory to Specify)
Lot Sample Assembled and Tested
MIL-STD883 M5004/5005
PACKAGING
WAFFLE PACK/WAFER CARRIER
QA
Visual/Documentation
INVENTORY
2
Parallel EEPROM Die Products [OVERVIEW]
Atmel-0554G-PEEPROM-Die-Products-Overview_072014
2.
Die Product Offering
Table 2-1.
Die Product Offering — Battery Volt and 5V
Atmel Ordering Code
3.
Device TAA
Operation Range
AT28C64B-DWF
200ns
Industrial Temperature
(-40°C to +85°C)
AT28C010-DWFM
150ns
Military Temperature
(-55C to 125C)
AT28C256-DWF
120ns
Industrial Temperature
(-40°C to +85°C)
AT28C256-DWFM
200ns
Military Temperature
(-55C to 125C)
AT28HC64BF-DWF
120ns
Industrial Temperature
(-40°C to +85°C)
AT28HC256-DWF
120ns
Industrial Temperature
(-40°C to +85°C)
AT28HC256-DWFM
120ns
Military Temperature
(-55C to 125C)
Package
Voltage
Die
4.5V to 5.5V
Die Information
Table 3-1.
Die Information(1)
Description
Handling
Instructions for Parallel EEPROM die products are available from Atmel.
Backside Condition
Silicon (Grind)
Connection
Connect substrate to ground.
Note:
4.
1.
Please contact Atmel sales for die maps and coordinates.
Revision History
Doc. Rev.
Date
0554G
07/2014
0554F
10/2005
Comments
Remove AT28BV64B and AT28C16 die codes which are no longer available.
Update template, Atmel logos, disclaimer page, and implemented revision history.
Parallel EEPROM Die Products [OVERVIEW]
Atmel-0554G-PEEPROM-Die-Products-Overview_072014
3
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