NUP3112UPMU D

NUP3112UPMU,
SZNUP3112UPMU
Quad Transient Voltage
Suppressor Array
ESD Protection Diodes with Ultra−Low
(0.7 pF) Capacitance
http://onsemi.com
The three−line voltage transient suppressor array is designed to protect
voltage−sensitive components that require ultra−low capacitance from
ESD and transient voltage events. This device features a common anode
design which protects three independent high speed data lines and a VCC
power line in a single six−lead UDFN low profile package.
Excellent clamping capability, low capacitance, low leakage, and fast
response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as a USB 2.0 high speed.
D1
D2
D3
VCC
Features
•
•
•
•
•
•
•
•
•
Low Capacitance Data Lines (0.7 pF Typical)
Protects up to Three Data Lines Plus a VCC Pin
UDFN Package, 1.6 x 1.6 mm
Low Profile of 0.50 mm for Ultra Slim Design
ESD Rating: IEC61000−4−2: Level 4
− Contact (14 kV)
VCC Pin = 15 V Protection
D1, D2, and D3 Pins = 5.2 V Minimum Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
This is a Pb−Free Device
Typical Applications
•
•
•
•
Rating
1
P5
M
G
P5 MG
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
D1 1
GND
D3 3
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
1
UDFN6 1.6x1.6
MU SUFFIX
CASE 517AP
6
D2 2
USB 2.0 High−Speed Interface
Cell Phones
MP3 Players
SIM Card Protection
Symbol
MARKING
DIAGRAM
6
VCC
5
NC
4
NC
ORDERING INFORMATION
Value
Unit
TJ
Operating Junction Temperature Range
−40 to 125
°C
Device
Package
Shipping†
TSTG
Storage Temperature Range
−55 to 150
°C
NUP3112UPMUTAG
TL
Lead Solder Temperature – Maximum
(10 seconds)
260
°C
UDFN6
(Pb−Free)
3000 / Tape &
Reel
SZNUP3112UPMUTAG
UDFN6
(Pb−Free)
3000 / Tape &
Reel
ESD
IEC 61000−4−2 Contact
14000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2014
April, 2014− Rev. 1
1
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NUP3112UPMU/D
NUP3112UPMU, SZNUP3112UPMU
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
IF
Working Peak Reverse Voltage
VC VBR VRWM
Maximum Reverse Leakage Current @ VRWM
VBR
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
Ppk
Peak Power Dissipation
V
IR VF
IT
Breakdown Voltage @ IT
IT
C
I
Parameter
IPP
Uni−Directional TVS
Max. Capacitance @ VR = 0 and f = 1.0 MHz
ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Reverse Working Voltage (D1, D2, and D3)
(Note 1)
VRWM1
−
−
4.0
V
Reverse Working Voltage (V1)
(Note 1)
VRWM2
−
−
12
V
Breakdown Voltage (D1, D2, and D3)
IT = 1 mA, (Note 2)
VBR
5.2
5.5
−
V
Breakdown Voltage (VCC)
IT = 5 mA, (Note 2)
VBR2
13.5
15
15.8
V
Reverse Leakage Current (D1, D2, and D3)
@ VRWM
IR
−
−
1.0
mA
Reverse Leakage Current (VCC)
@ VRWM2
IR
−
−
1.0
mA
Capacitance (D1, D2, and D3)
VR = 0 V, f = 1 MHz (Line to GND)
CJ
−
0.7
0.9
pF
1. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
2. VBR is measured at pulse test current IT.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC61000−4−2
http://onsemi.com
2
NUP3112UPMU, SZNUP3112UPMU
IEC61000−4−2 Waveform
IEC 61000−4−2 Spec.
Ipeak
Level
Test Voltage (kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1
2
7.5
4
2
2
4
15
8
4
3
6
22.5
12
6
4
8
30
16
8
100%
90%
I @ 30 ns
I @ 60 ns
10%
tP = 0.7 ns to 1 ns
Figure 3. IEC61000−4−2 Spec
ESD Gun
Oscilloscope
TVS
50 W
Cable
50 W
Figure 4. Diagram of ESD Test Setup
The following is taken from Application Note
AND8308/D − Interpretation of Datasheet Parameters
for ESD Devices.
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC61000−4−2 waveform. Since the
IEC61000−4−2 was written as a pass/fail spec for larger
% OF PEAK PULSE CURRENT
100
PEAK VALUE IRSM @ 8 ms
tr
90
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
0
20
40
t, TIME (ms)
60
Figure 5. 8 X 20 ms Pulse Waveform
http://onsemi.com
3
80
NUP3112UPMU, SZNUP3112UPMU
PACKAGE DIMENSIONS
UDFN6, 1.6x1.6, 0.5P
CASE 517AP
ISSUE O
2X
0.10 C
2X
E
DETAIL A
OPTIONAL
CONSTRUCTION
ÉÉÉ
ÉÉÉ
0.10 C
A
(A3)
DETAIL B
0.05 C
A1
DETAIL A
6X
A3
DETAIL B
OPTIONAL
CONSTRUCTION
0.05 C
SIDE VIEW
DIM
A
A1
A3
b
D
E
e
D2
E2
K
L
L1
MOLD CMPD
EXPOSED Cu
TOP VIEW
6X
L
L1
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
C
A1
SEATING
PLANE
SOLDERMASK DEFINED
MOUNTING FOOTPRINT*
D2
L
1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.20
0.30
1.60 BSC
1.60 BSC
0.50 BSC
1.10
1.30
0.45
0.65
0.20
−−−
0.20
0.40
0.00
0.15
1.26
3
E2
6X
6X
K
6
5
e
BOTTOM VIEW
6X
0.52
b
0.61 1.90
0.10 C A B
0.05 C
NOTE 3
1
0.50 PITCH
6X
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUP3112UPMU/D