PIC18F2585/2680/4585/4680 PIC18F2585/2680/4585/4680 Data Sheet Errata In the PIC18F2585/2680/4585/4680 Device Data Sheet (DS39625C), the following clarifications and corrections should be noted. Any silicon issues related to these devices will be reported in a separate silicon errata. Please check the Microchip web site for any existing issues. 1. Module: Electrical Characteristics (Power-Down and Supply Current) The eight-page table in Section 27.2 “DC Characteristics: Power-Down and Supply Current” is updated, on three pages, with the corrections noted in bold text. On page 419, the second page of the table, the Units column is changed for the top row entry: 27.2 DC Characteristics: Power-Down and Supply Current PIC18F2585/2680/4585/4680 (Industrial) PIC18LF2585/2680/4585/4680 (Industrial) (Continued) PIC18LF2585/2680/4585/4680 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2585/2680/4585/4680 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device PIC18LFX585/X680 PIC18LFX585/X680 All devices PIC18FX585/X680 Legend: Note 1: 2: 3: 4: Typ Max Units Conditions 0.53 1.10 mA -40°C 0.55 1.10 mA +25°C 0.56 1.10 mA +85°C 0.94 1.20 mA -40°C 0.90 1.20 mA +25°C 0.88 1.20 mA +85°C 1.80 2.30 mA -40°C 1.70 2.30 mA +25°C 1.60 2.30 mA +85°C 2.60 3.60 mA +125°C VDD = 2.0V VDD = 3.0V FOSC = 1 MHz (RC_RUN mode, Internal oscillator source) VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. © 2007 Microchip Technology Inc. DS80272B-page 1 PIC18F2585/2680/4585/4680 On page 423, the sixth page of the table, the Units column is changed for the top three row entries: 27.2 DC Characteristics: Power-Down and Supply Current PIC18F2585/2680/4585/4680 (Industrial) PIC18LF2585/2680/4585/4680 (Industrial) (Continued) PIC18LF2585/2680/4585/4680 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2585/2680/4585/4680 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max μA -40°C 650.00 715.00 μA +25°C μA +85°C 660.00 715.00 All devices PIC18FX585/X680 2: 3: 4: Conditions PIC18LFX585/X680 640.00 715.00 PIC18LFX585/X680 Legend: Note 1: Units 0.98 1.40 mA -40°C 1.00 1.40 mA +25°C 1.00 1.40 mA +85°C 1.90 2.20 mA -40°C 1.90 2.20 mA +25°C 1.90 2.20 mA +85°C 2.10 2.40 mA +125°C VDD = 2.0V VDD = 3.0V FOSC = 4 MHz (PRI_IDLE mode, EC oscillator) VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. DS80272B-page 2 © 2007 Microchip Technology Inc. PIC18F2585/2680/4585/4680 On page 425, the last page of the eight-page table, the temperature is changed for the bottom row and the punctuation fixed for the Conditions text: 27.2 DC Characteristics: Power-Down and Supply Current PIC18F2585/2680/4585/4680 (Industrial) PIC18LF2585/2680/4585/4680 (Industrial) (Continued) PIC18LF2585/2680/4585/4680 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2585/2680/4585/4680 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. D026 (ΔIAD) Device A/D Converter Legend: Note 1: 2: 3: 4: Typ Max Units Conditions 1.0 2.0 μA -40°C to +85°C VDD = 2.0V 1.0 2.0 μA -40°C to +85°C VDD = 3.0V 1.0 2.0 μA -40°C to +85°C 2.0 8.0 μA +125°C A/D on, not converting VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. © 2007 Microchip Technology Inc. DS80272B-page 3 PIC18F2585/2680/4585/4680 2. Module: ECAN™ Technology The first paragraph of Section 23.6.1 “Initiating Transmission” is modified as shown. 23.6.1 INITIATING TRANSMISSION For the MCU to have write access to the message buffer, the TXREQ bit must be clear, indicating that the message buffer is clear of any pending message to be transmitted. Note: The time between the clearing of the TXREQ bit and when the TX buffer has write access can be as long as four instruction cycles. At a minimum, the SIDH, SIDL and DLC registers must be loaded. If data bytes are present in the message, the data registers must also be loaded. If the message is to use extended identifiers, the EIDH:EIDL registers must also be loaded and the EXIDE bit set. 3. Module: Electrical Characteristics A row is changed in Table 27-24. The new and modified content is indicated by bold text. TABLE 27-24: A/D CONVERTER CHARACTERISTICS:PIC18F2585/2680/4585/4680 (INDUSTRIAL) PIC18LF2585/2680/4585/4680 (INDUSTRIAL) Param No. Sym Characteristic Min Typ Max Units Conditions <±1 LSb ΔVREF ≥ 3.0V ... EDL Differential Linearity Error — — A06 EOFF Offset Error — — <±2 LSb VREF = VSS and VDD A07 EGN Gain Error — — <±1 LSb ΔVREF ≥ 3.0V A04 ... Note 1: 2: 3: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. VREFH current is from RA3/AN3/VREF+ pin or AVDD, whichever is selected as the VREFH source. VREFL current is from RA2/AN2/VREF- pin or AVSS, whichever is selected as the VREFL source. DS80272B-page 4 © 2007 Microchip Technology Inc. PIC18F2585/2680/4585/4680 4. Module: Master Synchronous Serial Port (MSSP) – Serial Peripheral Interface (SPI) The following note has been added to the end of Section 17.3.3 “Enabling SPI I/O”. Note: When the module is enabled and in Master mode (CKE, SSPSTAT<6> = 1), a small glitch of approximately half a TCY may be seen on the SCK pin. To resolve this, keep the SCK pin as an input while setting SPEN. Then, configure the SCK pin as an output (TRISC<3> = 0). © 2007 Microchip Technology Inc. 5. Module: Enhanced Capture/Compare/PWM (ECCP1) Module The following note has been added to the end of Section 16.4.6 “Programmable Dead-Band Delay”. Note: If the dead-band delay value is increased after the dead-band time has elapsed, that new value takes effect immediately. This happens even if the PWM pulse is high and can appear to be a glitch. Dead-band values must be changed during the dead-band time or before the ECCP1 module is active. DS80272B-page 5 PIC18F2585/2680/4585/4680 REVISION HISTORY Rev A Document (05/2006) First revision of this document, split from DS80202 (previous “PIC18F2585/2680/4585/4680 Rev. A1 Silicon/Data Sheet Errata”). Includes previous data sheet clarification issues 1 (DC Characteristics) and 2 (MOVFF Instruction), reordered as issues 1 (Instruction Set) and 2 (DC Characteristics). Added issues 3 (DC Characteristics: Power-Down and Supply Current), 4 (DC Characteristics – Voltage-Frequency Graph) and 5 (Table 27-6: External Clock Timing Requirements). Rev B Document (11/2007) Removed data sheet clarification issues 1 (Instruction Set), 2 (DC Characteristics), 4 (DC Characteristics – Voltage-Frequency Graph and 5 (External Clock Timing Requirements). Removed portions of issue 3 – now issue 1 (Electrical Characteristics) – that had been updated in the data sheet, but retained changes that had not been incorporated. Added data sheet clarification issues 2 (ECAN™ Technology), 3 (Electrical Characteristics), 4 (Master Synchronous Serial Port (MSSP) – Serial Peripheral Interface (SPI)) and 5 (Enhanced Capture/Compare/PWM (ECCP1) Module). DS80272B-page 6 © 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. 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