PIC18F66K80 FAMILY 28/40/44/64-Pin, High-Temperature, Enhanced Flash Microcontrollers with ECAN™ and nanoWatt XLP Technology High-Temperature Features: ECAN Bus Module Features (Continued): • Ambient Temperature Range of -40°C to +150°C • Six Programmable Receive/Transmit Buffers • Three Dedicated Transmit Buffers with Prioritization • Two Dedicated Receive Buffers • 16 Full, 29-Bit Acceptance Filters with Dynamic Association • Three Full, 29-Bit Acceptance Masks • Automatic Remote Frame Handling • Advanced Error Management Features Power-Managed Modes: • • • • • • • • • • Run: CPU on, Peripherals on Idle: CPU off, Peripherals on Sleep: CPU off, Peripherals off Two-Speed Oscillator Start-up Fail-Safe Clock Monitor (FSCM) Power-Saving Peripheral Module Disable (PMD) Ultra Low-Power Wake-up Fast Wake-up, 1 µs, Typical Low-Power WDT, 300 nA, Typical Run mode Currents Down to Very Low 3.8 µA, Typical • Idle mode Currents Down to Very Low 880 nA, Typical • Sleep mode Currents Down to Very Low 13 nA, Typical Special Microcontroller Features: • • • • • • • ECAN Bus Module Features: • Conforms to CAN 2.0B Active Specification • Three Operating modes: - Legacy mode (full backward compatibility with existing PIC18CXX8/FXX8 CAN modules) - Enhanced mode - FIFO mode or programmable TX/RX buffers • Message Bit Rates up to 1 Mbps • DeviceNet™ Data Byte Filter Support 2012 Microchip Technology Inc. ECAN™ MSSP BORMV/LVD DSM 1,024 1,024 1,024 1,024 1,024 1,024 I/O Comparators 3,648 3,648 3,648 3,648 3,648 3,648 Pins EUSART 32 Bytes 64 Bytes 32 Bytes 64 Bytes 32 Bytes 64 Bytes Data Data Memory EE (Bytes) (Bytes) Timers 8-Bit/16-Bit Program Memory CCP/ ECCP PIC18F25K80 PIC18F26K80 PIC18F45K80 PIC18F46K80 PIC18F65K80 PIC18F66K80 DEVICE COMPARISON 12-Bit A/D Channels Device • • • CTMU TABLE 1: • On-Chip 3.3V Regulator Operating Speed up to 64 MHz 3.6 Kbytes of General Purpose Registers (SRAM) Three Internal Oscillators: - LF-INTOSC (31 kHz) - MF-INTOSC (500 kHz) - HF-INTOSC (16 MHz) Priority Levels for Interrupts 8 x 8 Single-Cycle Hardware Multiplier Extended Watchdog Timer (WDT): - Programmable period from 4 ms to 4,194s In-Circuit Serial Programming™ (ICSP™) via Two Pins In-Circuit Debug via Two Pins Programmable BOR Programmable LVD 28 28 40/44 40/44 64 64 24 24 35 35 54 54 1 1 1 1 1 1 8-ch 8-ch 11-ch 11-ch 11-ch 11-ch 4/1 4/1 4/1 4/1 4/1 4/1 2/3 2/3 2/3 2/3 2/3 2/3 2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1 Yes Yes Yes Yes Yes Yes No No No No Yes Yes DS30509A-page 1 PIC18F66K80 FAMILY Peripheral Highlights: • Five CCP/ECCP modules: - Four Capture/Compare/PWM (CCP) modules - One Enhanced Capture/Compare/PWM (ECCP) module • Five 8/16-Bit Timer/Counter modules: - Timer0: 8/16-bit timer/counter with 8-bit programmable prescaler - Timer1, Timer3: 16-bit timer/counter - Timer2, Timer4: 8-bit timer/counter • Two Analog Comparators • Configurable Reference Clock Output • Charge Time Measurement Unit (CTMU): - Capacitance measurement - Time measurement with 1 ns typical resolution - Integrated voltage reference DS30509A-page 2 • Up to Four External Interrupts • One Master Synchronous Serial Port (MSSP) module: - 3/4-wire SPI (supports all four SPI modes) - I2C™ Master and Slave modes • Two Enhanced Addressable USART modules: - LIN/J2602 support - Auto-Baud Detect (ABD) • 12-Bit A/D Converter with up to 11 Channels: - Auto-acquisition and Sleep operation - Differential Input mode of operation • Data Signal Modulator module: - Select modulator and carrier sources from various module outputs • Integrated Voltage Reference 2012 Microchip Technology Inc. PIC18F66K80 FAMILY Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 Special Features of the CPU........................................................................................................................................................ 7 3.0 Electrical Characteristics .............................................................................................................................................................. 9 Appendix A: Revision History............................................................................................................................................................... 13 The Microchip Web Site ....................................................................................................................................................................... 15 Customer Change Notification Service ................................................................................................................................................ 15 Customer Support ................................................................................................................................................................................ 15 Reader Response ................................................................................................................................................................................ 16 Product Identification System .............................................................................................................................................................. 17 2012 Microchip Technology Inc. DS30509A-page 3 PIC18F66K80 FAMILY TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS30509A-page 4 2012 Microchip Technology Inc. PIC18F66K80 FAMILY 1.0 DEVICE OVERVIEW This document contains device-specific information for the following devices, operating in an ambient temperature range between -40°C and +150°C: • PIC18F25K80 • PIC18F46K80 • PIC18F26K80 • PIC18F65K80 • PIC18F45K80 • PIC18F66K80 The primary differentiating features and specifications of the high-temperature PIC18F66K80 family devices are: • Above +125°C, writes are not allowed for Flash program memory • All AC timing specifications are increased by 15% This derating factor includes parameters, such as TPWRT • Maximum HS frequency of operation is 64 MHz Note: This data sheet documents only the devices’ features and specifications that are in addition to the features and specifications of the non-specialty PIC18F66K80 devices. For information on the features and specifications shared by this document’s hightemperature devices and the non-specialty devices, see the “PIC18F66K80 Family Data Sheet” (DS39977). Note: The test duration for AEC-Q100 reliability testing for devices operating at +150°C is 1,000 hours. Any design operating at +125°C to +150°C for longer than that period is not warranted without prior written approval from Microchip Technology Inc. This family of devices offers the advantages of all PIC18 microcontrollers; namely, high computational performance at an economical price. In addition to these features, the PIC18F66K80 family introduces design enhancements that make these microcontrollers a logical choice for many high-performance, power-sensitive applications. 2012 Microchip Technology Inc. DS30509A-page 5 PIC18F66K80 FAMILY NOTES: DS30509A-page 6 2012 Microchip Technology Inc. PIC18F66K80 FAMILY 2.0 SPECIAL FEATURES OF THE CPU 2.1 The Device ID registers are read-only registers. They identify the device type and revision for device programmers and can be read by firmware using table reads. Note: For additional details on the Configuration bits, refer to Section 28.1 “Configuration Bits” in the “PIC18F66K80 Family Data Sheet” (DS39977). Device ID information presented in this section is for the high-temperature PIC18F66K80 family devices only. TABLE 2-1: Device ID Registers DEVICE IDs File Name Bit 7 3FFFFEh DEVID1(1) DEV2 DEV1 DEV0 REV4 REV3 REV2 3FFFFFh DEVID2(1) DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 Legend: Note 1: Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 0 Default/ Unprogrammed Value REV1 REV0 xxxx xxxx DEV4 DEV3 xxxx xxxx Bit 1 x = unknown; u = unchanged,;— = unimplemented. See Register 2-1 and Register 2-2 for DEVIDx values. DEVIDx registers are read-only and cannot be programmed by the user. REGISTER 2-1: DEVID1: DEVICE ID REGISTER 1 R R R R R R R R DEV2(1) DEV1(1) DEV0(1) REV4 REV3 REV2 REV1 REV0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 DEV<2:0>: Device ID bits(1) 111 = PIC18F66K80 100 = PIC18F25K80 011 = PIC18F45K80 010 = PIC18F65K80 001 = PIC18F26K80 000 = PIC18F46K80 bit 4-0 REV<4:0>: Revision ID bits These bits are used to indicate the device revision. Note 1: x = Bit is unknown These DEV<2:0> values may be shared with other devices. The specific device is always identified by using the entire DEV<10:0> bit sequence. 2012 Microchip Technology Inc. DS30509A-page 7 PIC18F66K80 FAMILY REGISTER 2-2: DEVID2: DEVICE ID REGISTER 2 R R R R R R R R DEV10(1) DEV9(1) DEV8(1) DEV7(1) DEV6(1) DEV5(1) DEV4(1) DEV3(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DEV<10:3>: Device ID bits(1) 0110 0000 = PIC18F66K80 0110 0001 = PIC18F46K80, PIC18F26K80, PIC18F65K80, PIC18F45K80, PIC18F25K80 These DEV<10:3> values may be shared with other devices. The specific device is always identified by using the entire DEV<10:0> bit sequence. DS30509A-page 8 2012 Microchip Technology Inc. PIC18F66K80 FAMILY 3.0 ELECTRICAL CHARACTERISTICS Note: Other than some basic data, this section documents only the high-temperature PIC18F66K80 family devices’ specifications that differ from those of the non-specialty PIC18F66K80 family devices. For detailed information on the electrical specifications shared by the high-temperature and non-specialty devices, see the “PIC18F66K80 Family Data Sheet” (DS39977). Unless otherwise noted, this section’s parameters assume a minimum voltage of 4.0V. 3.1 Absolute Maximum Ratings(†) Ambient temperature under bias........................................................................................................................... +150°C Maximum current out of VSS pin .............................................................................................................................60 mA Maximum current into VDD pin ................................................................................................................................60 mA Maximum output current sunk by any I/O pin(1) ........................................................................................................1 mA Maximum output current sourced by any I/O pin(1) ...................................................................................................1 mA Maximum current sunk by all ports combined(1) .....................................................................................................10 mA Maximum current sourced by all ports combined(1) ................................................................................................10 mA Note 1: Maximum allowable current is a function of device maximum power dissipation (see Section 31.0 “Electrical Characteristics” in the “PIC18F66K80 Family Data Sheet”. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. FIGURE 3-1: PIC18F66K80 VOLTAGE-FREQUENCY GRAPH (HIGH TEMPERATURE) 6.0V 5.5V 5.0V 4.5V Voltage 4.0V 4.0V 3.5V 3.0V 2.5V 2.0V 64 MHz Frequency High-Temperature Devices 2012 Microchip Technology Inc. DS30509A-page 9 PIC18F66K80 FAMILY 3.2 DC Characteristics: Supply Voltage (High Temperature) PIC18F66K80 Family (High Temperature) Param Symbol No. D001 3.3 Standard Operating Conditions (unless otherwise stated) Operating temperature +125°C TA +150°C for high temperature Characteristic Supply Voltage VDD Min Typ Max Units 4.0 — 5.5 V Conditions For F devices DC Characteristics: Power Down and Supply Current (High Temperature) PIC18F66K80 Family (High Temperature) Param No. Device PIC18FXXK80 Standard Operating Conditions (unless otherwise stated) Operating temperature +125°C TA +150°C for high temperature Typ Max Units Conditions Power-Down Current (IPD)(1) 10 28 µA +150°C VDD = 5V, Sleep mode Module Differential Currents 12 29 µA +150°C VDD = 5V, Watchdog Timer Current: ΔIWDT 12 28 µA +150°C VDD = 5V, A/D Current: ΔIAD 12 28 µA +150°C VDD = 5V, High/Low-Voltage Detect: ΔIHLVD Supply Current (IDD)(2,3) Note 1: 2: 3: 10 32 mA +150°C VDD = 5V, FOSC = 64 MHz (PRI_RUN mode) — 8 mA +150°C VDD = 5V, FOSC = 4 MHz (PRI_RUN mode) — 3 mA +150°C VDD = 5V, FOSC = 1 MHz (PRI_RUN mode) — 8 mA +150°C VDD = 5V, FOSC = 64 MHz (PRI_IDLE mode) — 1.8 mA +150°C VDD = 5V, FOSC = 4 MHz (PRI_IDLE mode) — 1 mA +150°C VDD = 5V, FOSC = 1 MHz (PRI_IDLE mode) — 28 mA +150°C VDD = 5V, FOSC = 64 MHz (PRI_RUN mode, 16 MHz w/PLL) — 8 mA +150°C VDD = 5V, FOSC = 16 MHz (PRI_RUN mode, 4 MHz w/PLL) The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in a high-impedance state and tied to VDD or VSS, and all features that add delta current are disabled (such as WDT, secondary oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = External square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT is enabled/disabled as specified. DS30509A-page 10 2012 Microchip Technology Inc. PIC18F66K80 FAMILY 3.4 DC Characteristics: PIC18F66K80 Family (High Temperature) PIC18F66K80 Family (High Temperature) Standard Operating Conditions (unless otherwise stated) Operating temperature +125°C TA +150°C for high temperature Param Symbol No. Characteristic Min Typ Max Units Conditions D031 VIL I/O Ports with Schmitt Trigger Buffer VSS — 0.25 VDD V VDD = 5.0V D032 VIL MCLR VSS — 0.25 VDD V VDD = 5.0V D041 VIH I/O Ports with Schmitt Trigger Buffer 0.85 VDD — VDD V VDD = 5.0V D042 VIH MCLR, OSC1 (EC mode) 0.85 VDD — VDD V VDD = 5.0V D060 IIL Input Leakage Current I/O Ports — — ±2 µA VSS ≤ VPIN ≤ VDD, Pin at high-impedance 3.5 DC Characteristics: Memory Programming Requirements PIC18F66K80 Family (High Temperature) Param Symbol No. Standard Operating Conditions (unless otherwise stated) Operating temperature +125°C TA +150°C for high temperature Characteristic Min Typ Max D120 ED Data EEPROM Memory Byte Endurance 50K — — D121 VDRW VDD for Read/Write 4.0 — 5.5 D123 VRETD Characteristic Retention 1 — — 2012 Microchip Technology Inc. Units Conditions E/W +125°C to +150°C V Using EECON to read/write PIC18FXXKXX devices Year Provided no other specifications are violated DS30509A-page 11 PIC18F66K80 FAMILY 3.6 AC Characteristics Internal RC Accuracy (INTOSC) PIC18F66K80 Family (High Temperature) Param No. Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +150°C Min Typ Max Units Conditions INTOSC Accuracy @ Freq = 16 MHz, 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz(1) OA1 -20 — ±20 % +125°C to +150°C, VDD = 4.0-5.5V — ±25 % VDD = 4.0-5.5V OA2 LF_INTOSC Accuracy @ 31 kHz OA2 Note 1: -25 Frequency is calibrated at +25°C. The OSCTUNE register can be used to compensate for temperature drift. TABLE 3-1: DC CHARACTERISTICS: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS PIC18F66K80 Family (High Temperature) Param No. D420 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +150°C Characteristic HLVD Voltage on VDD, Transition High-to-Low DS30509A-page 12 Min Typ Max Units HLVDL<3:0> = 1101 4.00 4.44 4.88 V HLVDL<3:0> = 1110 4.28 4.75 5.23 V 2012 Microchip Technology Inc. PIC18F66K80 APPENDIX A: REVISION HISTORY Revision A (February 2012) Original mini data sheet for the high-temperature devices in the PIC18F66K80 family. DS30509A-page 13 2012 Microchip Technology Inc. PIC18F66K80 NOTES: DS30509A-page 14 2012 Microchip Technology Inc. PIC18F66K80 FAMILY THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2012 Microchip Technology Inc. DS30509A-page 15 PIC18F66K80 FAMILY READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: PIC18F66K80 Family Literature Number: DS30509A Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS30509A-page 16 2012 Microchip Technology Inc. PIC18F66K80 FAMILY PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Device(1,2) PIC18F25K80/26K80, PIC18F45K80/46K80, PIC18F65K80/66K80, PIC18F25K80/26K80T, PIC18F45K80/46K80T, PIC18F65K80/ 66K80T VDD range 4.0V to 5.5V Temperature Range I E H = = = Package PT MR SS MM ML = = = = = Pattern -40C to -40C to -40C to +85C +125C +150C Examples: a) PIC18F46K80T-H/PT = High Temperature, TQFP package in tape and reel configuration (Industrial) (Extended) (High Temperature) TQFP Thin Quad Flatpack QFN Plastic Quad Flat, No Lead Package SSOP Plastic Shrink Small Outline QFN Plastic Quad Flat, No Lead Package QFN Plastic Quad Flat, No Lead Package Note 1: 2: 3: F = Standard Voltage Range LF = Wide Voltage Range T = In Tape and Reel PLCC, and TQFP packages only QTP, SQTP, Code or Special Requirements (blank otherwise) 2012 Microchip Technology Inc. DS30509A-page 17 PIC18F66K80 FAMILY NOTES: DS30509A-page 18 2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-016-1 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2012 Microchip Technology Inc. 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