EVAL-ADuM3150Z User Guide UG-719 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Evaluating the iCoupler ADuM3150 with the EVAL-ADuM3150Z Evaluation System FEATURES GENERAL DESCRIPTION Access to all six data channels Access to the DCLK delayed clock Multiple connection options Support for Tektronix active probes Provision for cable terminations Support for PCB edge-mounted coaxial connectors Easy configuration Installed SPIsolator® digital isolator: ADuM3150BRSZ in the 20-lead SSOP package The EVAL-ADuM3150Z supports the ADuM3150ARSZ and ADuM3150BRSZ, which are, 6-channel SPIsolator isolators optimized for use in SPI applications. They include two low speed channels and a clock delay channel for implementation of 40 MHz SPI data transfers. The evaluation board provides a JEDEC standard 20-lead SSOP pad layout, support for signal distribution, loopback, and loads referenced to VDDx or GNDx, as well as optimal bypass capacitance. Signal sources can be wired onto the board as well as brought onto the board through edgemounted SMA connectors (sold separately) or terminal blocks for power connections. The board includes 200 mil header positions for compatibility with Tektronix active probes. SUPPORTED SPIsolator MODELS ADuM3150ARSZ ADuM3150BRSZ The board follows best printed circuit board (PCB) design practices for 4-layer boards, including a full power and ground plane on each side of the isolation barrier. No other EMI or noise mitigation design features are included on this board. In cases of very high speed operation or when ultralow emissions are required, refer to the AN-1109 application note for additional board layout techniques. PHOTOGRAPH OF THE EVALUATION BOARD Figure 1. EVAL-ADuM3150Z Evaluation Board PLEASE SEE THE LAST PAGE FOR AN IMPORTANT WARNING AND LEGAL TERMS AND CONDITIONS. Rev. 0 | Page 1 of 9 UG-719 EVAL-ADuM3150Z User Guide TABLE OF CONTENTS Features .............................................................................................. 1 Power Input ....................................................................................3 Supported SPIsolator Models .......................................................... 1 Data I/O Structures .......................................................................4 General Description ......................................................................... 1 Bypass on the PCB ........................................................................5 Photograph of the Evaluation Board .............................................. 1 High Voltage Capability ...............................................................5 Revision History ............................................................................... 2 Evaluation Board Schematics and Artwork ...................................6 Evaluation Board Circuitry ............................................................. 3 Ordering Information .......................................................................8 PCB Evaluation Goals .................................................................. 3 Bill of Materials ..............................................................................8 Connectors .................................................................................... 3 Related Links ......................................................................................9 REVISION HISTORY 7/14—Revision 0: Initial Version Rev. 0 | Page 2 of 9 EVAL-ADuM3150Z User Guide UG-719 EVALUATION BOARD CIRCUITRY PCB EVALUATION GOALS SCOPE PROBE The EVAL-ADuM3150Z board is intended to achieve the following goals: • • • Evaluate the full range of SPIsolator data transfer functions. Power each side of the SPIsolator isolator independently. Allow high differential voltage to be applied between the two sides of the SPIsolator isolator. Allow connecting easily to power, other circuit boards and instrumentation. SMA CONNECTOR SCOPE PROBE HEADER PADS TO CONNECT SMA Although the evaluation board comes with the ADuM3150BRSZ SPIsolator digital isolator installed, the board is also compatible with the ADuM3150ARSZ. Figure 2. Optional Components CONNECTORS The PCB provides support for three types of interconnections: • • • SHORTING JUMPER 12435-002 • SMA edge-mounted connectors. Through-hole signal ground pairs. Terminal blocks for power connections. With these three options, both temporary and permanent connections to the board can easily be made. When coaxial connections are desired, SMA connector positions are available for VDD1 and VDD2 power supplies, as well as all digital inputs. These SMA connector positions are left unpopulated so that the user can customize the connectors for a given application. Pins that are outputs only may not have access to a coaxial connection. The native output buffers of the ADuM3150 are not capable of driving a 50 Ω coaxial terminated cable. Bring out signals leaving the board through the provided through holes or headers. Figure 2 shows examples of installed SMA connectors; these connectors were chosen because they are not only low profile and provide excellent mechanical connections to the PCB but also support 50 Ω coaxial cabling. Because most lab equipment is compatible with BNC connectors, adaptors may be required to use some on-board connectors. Power can be connected through the T1 and T2 terminal blocks or can be wired directly to the PCB via the PR1 and PR2 throughhole positions or the VDD1 and VDD2 SMA connectors can be populated to connect the coaxial cable. Each through-hole pair provides a power and ground with the power on the Pin 1 hole. The pin spacing of each through-hole connector is 200 mil between centers. This matches the pin spacing required for Tektronix active scope probes. If a scope probe connection is desired, the header shown in Figure 2 can be soldered into the through-hole positions, and the signal pin can be trimmed to match the height requirements of a Tektronix active scope probe. POWER INPUT Each side of the EVAL-ADuM3150Z SPIsolator isolator requires an off-board power source. Each power source must be independent if common-mode voltages are to be applied across the isolation barrier. Sharing a single supply for both sides of the part across the isolation barrier does not harm the isolator, and it is useful for functional testing of the ADuM3150 SPIsolator isolator when common-mode voltages are not present. A ground plane and a power plane are present on Layer 2 and Layer 3 of the PCB on each side of the isolation barrier. Power connects to the VDD1 and GND1 planes for Side 1 and connects to the VDD2 and GND2 planes for Side 2. Rev. 0 | Page 3 of 9 UG-719 EVAL-ADuM3150Z User Guide DATA I/O STRUCTURES Figure 3 shows four 0603 pad layouts between the signal path and optional connections. Pads with similar functions are arranged in vertical rows and their function is labeled on the PCB. Each data channel has a variety of structures to help configure, load, and monitor both the input and output. Figure 3 shows one of the datapaths from an external connection to the DUT pin. Each channel has the same or a subset of these connections depending on the particular I/O. • Starting at the external connection, the signal path is 3. 4. 5. Pad layout for a PCB board edge-mounted SMA connector. Two 0805 pads are provided where 100 Ω resistors to ground can be installed. The combined resistance of 50 Ω provides a termination for a standard coaxial cable. A 3-pin 100mil header is provided, where Pin 1 is connected to ground through a 10 kΩ resistor, and Pin 3 is connected to VDD through a 10 kΩ resistor. Temporary pull-up or pull-down can be implemented with a shorting jumper between Pin 2 and either Pin 1 or Pin 3. A 2-pin 100 mil header provides a signal ground pair that can be used for clip leads or for shorting a channel to ground temporarily. There are groupings of three open through holes, consisting of a signal and two ground connections. These holes can be used for hardwiring signal wires into the PCB, installing a header to accept a Tektronix active probe, or installing a 2-pin header to allow adjacent channels to temporarily be shorted together. • • • Figure 2 shows many of the optional components installed, as well as how jumpers can be used to temporarily connect channels. This figure shows a signal connected to the first channel SMA and then fanned out to the top three channels and monitored by an active scope probe. 5 OPEN HOLES FOR SOLDERED WIRES OR 200mil TEKTRONIC HEADER, GND/GND/SIGNAL 2 TERMINATION 2 POSITIONS 4 2-PIN HEADER GND/SIGNAL 3 3-PIN HEADER FOR 10kΩ LOADS 1 SMA CONNECTOR PADS NOTES: 1. THE NUMBERED COMPONENTS IN THIS DIAGRAM CORRESPOND TO THE DESCRIPTIONS IN THE DATA I/O STRUCTURES SECTION. 12435-003 1. 2. LOAD is a connection to load structures located on the reverse side of the board. These structures consist of 100 kΩ resistors to power and ground to pull high-Z outputs to a midrange voltage when not being actively driven. This is useful during debugging because it allows easy identification floating outputs. The header and associated resistors identified in Point 3 are also connected to the signal path by this pad. PULL-DOWN is an 0603 pad layout between the signal path and GND1 or GND2 can be used for installing a permanent pull-down resistor or load capacitor. SMA CONNECT is an 0603 pad layout that allows connection of the datapath to the board edge SMA pad layout and terminations. PULL-UP is an 0603 pad layout between the signal path and VDD1 or VDD2 can be used for installing a permanent pull-up resistor. Figure 3. Configuration and Monitoring Structures (Showing a Data path from an External Connection to the DUT Pin) Rev. 0 | Page 4 of 9 EVAL-ADuM3150Z User Guide UG-719 BYPASS ON THE PCB HIGH VOLTAGE CAPABILITY Several positions and structures are provided to allow optimum bypass of the evaluation board. Provision has been made for optional surface-mount bulk capacitors to be installed near the power connectors to compensate for long cables to the power supply. Parallel bypass capacitors are installed near the ADuM3150BRSZ and consist of a 0.1 µF capacitor for VDD1 on the top side and bottom side and a 0.1 µF capacitor for VDD2 on the top and bottom side of the board. It is best to use the top side bypass positions if possible. This PCB is designed in adherence with 3750 V basic insulation practices. High voltage testing beyond 3750 V is not recommended. Take appropriate care when using this evaluation board at high voltages, and do not rely on the PCB for safety functions because it has not been high potential tested (also known as hipot tested or dielectric withstanding voltage tested) or certified for safety. The PCB also implements a distributed capacitive bypass on the PCB. This consists of power and ground planes closely spaced on the inner layers of the PCB. This minimizes noise and the transmission of EMI without using complex design features. Rev. 0 | Page 5 of 9 UG-719 EVAL-ADuM3150Z User Guide EVALUATION BOARD SCHEMATICS AND ARTWORK SIDE 1 PINS SIDE 2 PINS VDD1 VDD2 R13 MCLK_DUT MCLK_DUT MO_DUT MI_DUT MSSB_DUT VIA_DUT VIB_DUT VOC_DUT 0 R11 1 2 3 P1A DGND1 DGND1 P1B DGND1 1 2 SSW-102-01-G-S VDD1 R14 U1 1 (1) (20) 2 (2) (19) 3 (3) (18) 4 (4) (17) 5 (5) (16) 6 (6) (15) 7 (7) (14) 8 (8) (13) 9 (9) (12) 10 (10) (11) 20 19 18 17 16 15 14 13 12 11 VDD2 GND2 SCLK SI SO SSSB/SS0 VOA/VIA/SS1 VOB/VIB/SS2 VIC/SS3 GND2 VDD2 SCLK_DUT SCLK_DUT SI_DUT SO_DUT SSSB_DUT VOA_DUT VOB_DUT VIC_DUT C7 DGND1 DGND1 R17 GEN_SSOP20 P8B R3 R50 100k DGND2 100k ADuM315x R51 MO_DUT 1 2 SSW-102-01-G-S VDD2 R52 DGND2 VDD2 10k 1 2 3 MO P8A R49 10k DGND2 R16 1 1 2 3 DGND2 0 MO 2 3 4 5 R48 15PF DGND2 0 R2 100 0 R1 100 2 3 4 5 VDD1 GND1 MCLK MO MI MSSB VIA/VOA/SSA0 VIB/VOB/SSA1 VOC/DCLK GND1 VDD1 R12 MCLK 0 1 0 R47 0 MLCK PR1 0 1 2 1 2 3 P2A DGND1 VDD2 DGND1 P2B DGND1 1 2 SSW-102-01-G-S DGND1 T1 1 2 KRM2 02 C1T 0.1UF DGND1 DGND1 VDD1 C1B 0.1UF DGND1 5 4 3 2 10UF 0.1UF DGND1 DGND1 0 C8 R54 15PF DGND2 DGND1 SI_DUT R59 SI C1 C2T DNI R53 VDD1 1 VDD1 0 100 DGND1 1 2 3 0 0 100 JP5 R15 R4 P9A R19 P9B R55 R56 100k DGND2 100k 0 PR2 1 2 MI_DUT 1 2 SSW-102-01-G-S VDD2 DGND2 C3 DGND2 T2 1 2 KRM2 02 P3B R21 100k 1 2 SSW-102-01-G-S VDD1 DGND1 DGND2 R22 R23 10k DGND1 10k 1 VDD2 C4T C2B 0.1UF DGND2 0.1UF DGND2 C3T 0.1UF DGND2 DNI R57 R58 10k DGND2 10k VDD2 R60 VDD2 C2 10UF DGND2 JP6 5 4 3 2 R64 SO DGND2 1 VDD1 R63 SO SO_DUT 0 1 2 3 2 3 4 5 JP1 R61 R62 100 100 P10A P10B DGND2 DGND2 VDD1 1 2 SSW-102-01-G-S DGND2 R25 1 R24 MSSB DGND2 VDD2 0 MSSB 1 2 3 R65 0 R20 100k DGND1 VDD2 0 P3A 0 1 2 3 0 15PF DGND1 1 2 3 R18 MSSB_DUT R66 100 R26 SSSB_DUT 1 2 3 P4A DGND1 DGND1 C9 P4B DGND1 1 2 SSW-102-01-G-S VDD1 P11B R68 R69 100k DGND2 100k 1 2 SSW-102-01-G-S VDD2 DGND2 0 AUX1_S1 VIA_DUT R28 100 C4 R27 15PF R71 10k DGND2 10k VDD2 1 2 3 P5A DGND1 JP7 VDD2 P5B DGND1 R30 R31 100k 100k 1 2 SSW-102-01-G-S VDD1 DGND1 R72 0 R8 DGND1 R70 1 2 3 R7 100 0 0 DGND1 AUX1_S2 VOA_DUT R33 R32 1 2 3 0 DGND2 VIB_DUT 100 15PF R77 R78 100k DGND2 100k R79 R80 10k VDD2 JP8 VDD2 P6B R38 100k DGND1 100k 1 2 SSW-102-01-G-S VDD1 R39 R40 10k DGND1 10k R81 0 R37 DGND1 VOB_DUT AUX2_S2 R83 1 VOB 0 VDD1 R82 1 2 3 1 2 3 P13A C11 R84 R85 15PF 100 100 0 DGND1 DGND2 DGND2 VDD2 10k DGND2 1 2 3 P6A DGND1 DGND1 5 4 3 2 1 2 3 R34 1 2 SSW-102-01-G-S VDD1 5 4 3 2 DGND2 DGND2 P13B JP3 DGND2 R86 R87 100k DGND2 100k DGND2 VDD2 R42 R88 R89 10k DGND2 10k 0 VOC_DUT VDD2 1 2 3 C6 15PF DGND1 1 2 3 R41 0 P7A VDD2 JP9 R90 R43 R44 100k DGND1 100k 1 2 SSW-102-01-G-S AUX3_S2 R92 VIC_DUT DGND1 1 VIC R46 VDD1 1 2 3 P14A 10k R91 C12 R93 R94 0 0 R45 15PF 100 100 DGND2 P14B 1 2 SSW-102-01-G-S JP4 DGND2 R95 R96 100k DGND2 100k Rev. 0 | Page 6 of 9 DGND2 DGND2 R97 R98 10k JP10 Figure 4. EVAL-ADuM3150Z Schematic 5 4 3 2 VDD2 10k DGND2 1 2 3 10k DGND1 VDD1 0 P7B 1 2 3 100 C5 0 0 R10 R75 100 DGND2 1 2 SSW-102-01-G-S R36 R9 15PF R74 100 P12B R35 VIB R73 C10 0 1 2 3 P12A VDD1 AUX2_S1 1 VOA 0 JP2 1 R76 VDD1 10k 10k DGND1 VDD2 12435-004 VIA 1 2 3 4 5 1 2 3 P11A DGND1 R29 2 3 4 5 R67 15PF DGND2 0 R6 0 R5 100 0 0 2 3 4 5 EVAL-ADuM3150Z User Guide UG-719 Figure 5. Top Side Layout Rev. 0 | Page 7 of 9 UG-719 EVAL-ADuM3150Z User Guide ORDERING INFORMATION BILL OF MATERIALS Table 1. Installed Components Quantity 1 1 2 2 10 Reference Designator(s) EVAL-ADuM3150Z U1 C1, C2 C2T, C3T JP1 to JP10 14 P1B to P14B 20 R20, R21, R30, R31, R37, R38, R43, R44, R49, R50, R55, R56, R68, R69, R77, R78, R86, R87, R95, R96 R22, R23, R32, R33, R39, R40, R45, R46, R51,R52, R57, R58, R70, R71, R79, R80, R88, R89, R97, R98 T1, T2 20 2 Value Voltage Tolerance 10 µF 0.1 µF Jumper (3-pin) Jumper (2-pin) 100 kΩ 6.3 V 16 V 10% 5% 1/10 W 10 kΩ Package Manufacturer/Part Number Analog Devices, Inc. 08-038567 Rev A Analog Devices, Inc. ADuM3151BRSZ Taiyo Yuden JMK212B7106KG-T Kemet C0603C104J4RACTU Harwin M20-9990345 1 SSOP20 0805 0603 1 × 3 pin header IDC 2×1 IDC2×1 R0603 Stackpole RMCF0603FT100K 1% 0603 Panasonic ERJ-3EKF1002V FCI 90726-402HLF DIG01 ED2609-ND 5.08 mm 2 × 1 screw terminal block Table 2. Optional Components—Not Installed Quantity 4 16 Reference Designator(s) C1B, C1T, C2B, C4T P1A to P14A, PR1, PR2 Value 0.1 µF Jumper (2-pin) Voltage 16 V Tolerance 5% 10 11 C3to C12 MO, SO, MLCK, MSSB, VDD1, VDD2, AUX1_S1, AUX1_S2, AUX2_S1, AUX2_S2, AUX3_S2 15 pF SMA connector 50 V 5% 18 R1 to R10, R61, R62, R74, R75, R84, R85, R93, R94 R11 to R19, R24 to R29, R34 to R36, R41, R42, R47, R48, R53, R54, R59, R60, R63 to R67, R72, R73, R76, R81 to R83, R90 to R92 100 Ω 1/10 W 0Ω 1/10 W 40 1 Package 0603 1×2 pin header 200 mil 0603 CONNPCB coax SMA end launch R0805 PANASONIC ERJ-6ENF1000V 1 R0603 PANASONIC ERJ-3GEY0R00V Rev. 0 | Page 8 of 9 Manufacturer/Part Number KEMET C0603C104J4RACTU SAMTEC MTSW-202-12-G-S-730 ZZZ KEMET 15PF 50V 5% 0603 NPO ZZZ JOHNSON 142-0701-851 EVAL-ADuM3150Z User Guide UG-719 RELATED LINKS Resource ADuM3150 AN-1109 Description Product Page, 3.75 kV, 6-Channel, SPIsolator Digital Isolator for SPI with Delay Clock Application Note, Recommendations for Control of Radiated Emissions with iCoupler Devices ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Legal Terms and Conditions By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you have read and agreed to the Agreement. Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer”) and Analog Devices, Inc. (“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONLY. Customer understands and agrees that the Evaluation Board is provided for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Furthermore, the license granted is expressly made subject to the following additional limitations: Customer shall not (i) rent, lease, display, sell, transfer, assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term “Third Party” includes any entity other than ADI, Customer, their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including ownership of the Evaluation Board, are reserved by ADI. CONFIDENTIALITY. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board. Modifications to the Evaluation Board must comply with applicable law, including but not limited to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice to Customer. Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDED “AS IS” AND ADI MAKES NO WARRANTIES OR REPRESENTATIONS OF ANY KIND WITH RESPECT TO IT. ADI SPECIFICALLY DISCLAIMS ANY REPRESENTATIONS, ENDORSEMENTS, GUARANTEES, OR WARRANTIES, EXPRESS OR IMPLIED, RELATED TO THE EVALUATION BOARD INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, TITLE, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. IN NO EVENT WILL ADI AND ITS LICENSORS BE LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES RESULTING FROM CUSTOMER’S POSSESSION OR USE OF THE EVALUATION BOARD, INCLUDING BUT NOT LIMITED TO LOST PROFITS, DELAY COSTS, LABOR COSTS OR LOSS OF GOODWILL. ADI’S TOTAL LIABILITY FROM ANY AND ALL CAUSES SHALL BE LIMITED TO THE AMOUNT OF ONE HUNDRED US DOLLARS ($100.00). EXPORT. Customer agrees that it will not directly or indirectly export the Evaluation Board to another country, and that it will comply with all applicable United States federal laws and regulations relating to exports. GOVERNING LAW. This Agreement shall be governed by and construed in accordance with the substantive laws of the Commonwealth of Massachusetts (excluding conflict of law rules). Any legal action regarding this Agreement will be heard in the state or federal courts having jurisdiction in Suffolk County, Massachusetts, and Customer hereby submits to the personal jurisdiction and venue of such courts. The United Nations Convention on Contracts for the International Sale of Goods shall not apply to this Agreement and is expressly disclaimed. ©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. UG12435-0-7/14(0) Rev. 0 | Page 9 of 9