Materials Declaration Package Body Size Lead Count Option Item Alumina Chromium oxide Silicon dioxide Titanium dioxide Molybdenum Subtotal Item Tungsten Nickel Gold Subtotal Item Iron Nickel Subtotal Item Pb Sn Silver Indium Subtotal 32 High Pb, RoHS Compliant, Exempt Ceramic Base % of Compound 91.3 3.9 3.6 0.99 0.26 Pads % of Pads 83.6 10.7 5.7 Metal Lid % of Metal Lid 58.0 42.0 Solder Seal % of Solder 91.1 6.3 1.3 1.3 Bond Wires % of Wire 99.0 1.0 Al Si Subtotal Chip % of Chip 100.0 Si Item Resin 700 Silicon dioxide Subtotal Die Attach % of Die Attach 94.5 5.5 Ball Attach Solder % of Ball Attach Solder 95.5 4.0 0.5 Item Sn Ag Cu Subtotal Item Pb Sn Subtotal CBGA Solder Balls % of Solder Balls 90 10 Weight (g) 2.99 E-01 1.28 E-02 1.19 E-02 3.28 E-03 8.85 E-04 3.28 E-01 PPM 658096 28064 26116 7214 1948 721438 Weight (g) 2.06 E-02 2.63 E-03 1.41 E-03 2.46 E-02 PPM 45235 5798 3108 54141 Weight (g) 2.95 E-02 2.17 E-02 5.12 E-02 PPM 64824 47815 112639 Weight (g) 4.01 E-03 2.79 E-04 5.59 E-05 5.54 E-05 4.40 E-03 PPM Weight (g) 5.94 E-05 6.00 E-07 6.00 E-05 PPM Weight (g) 1.90 E-02 PPM 41816 Weight (g) 3.69 E-04 2.15 E-05 3.90 E-04 PPM Weight (g) 4.19 E-03 1.76 E-04 2.20 E-05 4.39 E-03 PPM Weight (g) 2.03 E-02 2.26 E-03 2.26 E-02 PPM 44666 4963 49629 8826 613 123 122 9684 131 1 132 811 47 858 9227 386 48 9662 Package Totals Weight (g) PPM 1000000 4.54 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary