v00.0206 C-1 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-1 Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR™ 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN. 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. TOLERANCES ±.005 [0.13] UNLESS OTHERWISE SPECIFIED. 6. FIELD REPLACEABLE SMA CONNECTORS. TENSOLITE 5602 - 5CCSF OR EQUIVALENT. 7. TO MOUNT MODULE TO SYSTEM PLATFORM REPLACE 0 -80 HARDWARE WITH DESIRED MOUNTING SCREWS. B-2 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v00.0906 C-1B – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-1B Package Outline Drawing NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR™ 2. SPACER MATERIAL: ALUMINUM 3. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER ELECTROLYTIC NICKEL 75 MICROINCHES MIN. 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. TOLERANCES ±.005 [0.13] UNLESS OTHERWISE SPECIFIED. 6. FIELD REPLACEABLE 2.92mm CONNECTORS. TENSOLITE 231CCSF OR EQUIVALENT. 7. TO MOUNT MODULE TO SYSTEM PLATFORM REPLACE 0 -80 HARDWARE WITH DESIRED MOUNTING SCREWS. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com B-3