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v00.0609
C-14 – CONNECTORIZED
HERMETIC MODULE
PACKAGE OUTLINES
C-14 Package Outline Drawing
NOTES:
1. PACKAGE, LEADS, COVER MATERIAL: KOVAR TM
2. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN., OVER
ELECTROLYTIC NICKEL 75 MICROINCHES MIN.
3. SPACER MATERIAL: NICKEL PLATED ALUMINUM
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. TOLERANCES ±0.010 [0.25] UNLESS OTHERWISE SPECIFIED
6. FIELD REPLACEABLE SMA CONNECTORS.
TENSOLITE 5602-5CCSF OR EQUIVALENT.
B - 18
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com