TC623 DATA SHEET (02/05/2013) DOWNLOAD

TC623
3V, Dual Trip Point Temperature Sensor
Features:
Package Type
• Integrated Temp Sensor and Detector Operate
from a Supply Voltage as Low as 2.7V
• Replaces Mechanical Thermostats and Switches
• On-Chip Temperature Sense
• 8-Pin DIP or SOIC for Direct PCB Mounting
• 2 User Programmable Temperature Set Points
• 2 Independent Temperature Limit Outputs
• Heat/Cool Regulate Output
Applications:
•
•
•
•
•
•
CPU Thermal Management
System Over or Under Temperature Shutdown
Advanced Thermal Warning
Fan Speed Control Circuits
Accurate Appliance Temperature Sensing
Environmental Control
Device Selection Table
Part Number
Package
Temp. Range
TC623CCOA
8-Pin SOIC
0°C to +70°C
TC623CCPA
8-Pin PDIP
0°C to +70°C
TC623CEOA
8-Pin SOIC
-40°C to +85°C
TC623CEPA
8-Pin PDIP
-40°C to +85°C
TC623CVOA
8-Pin SOIC
-40°C to +125°C
Note:
Latch Output (C option), is a Standard Device
Contact Factory for Latch Q Output (H option).
Functional Block Diagram
NC
1
2
1
8
VCC
LOW SET
2
7
LOW LIMIT
HIGH SET
3
GND
4
NC
TC623CCOA
TC623CEOA
TC623CVOA
6
HIGH LIMIT
5
CONTROL
PDIP
NC
1
LOW SET
2
HIGH SET
3
GND
4
TC623CCPA
TC623CEPA
8
VCC
7
LOW LIMIT
6
HIGH LIMIT
5
CONTROL
General Description
The TC623 is a 3V solid-state, programmable temperature sensor designed for use in thermal management
applications. It features dual thermal interrupt outputs
(LOW LIMIT and HIGH LIMIT) each of which are set
with an external resistor. The HIGH LIMIT and LOW
LIMIT outputs are driven active (high) when measured
temperature equals the user programmed limits. The
CONTROL output is driven active (high) when temperature equals the HIGH LIMIT set point and turned off
when temperature falls below the LOW LIMIT set point.
The CONTROL output can be used to provide simple
ON/OFF control to a cooling fan if so desired.
Low voltage operation, easy set point programming,
small size and low cost make the TC623 an ideal
choice for many thermal management applications.
8
Temperature
To Voltage
Converter
VREF
Gen.
VCC
TC623
+
LOW SET
SOIC
7
LOW LIMIT
–
VREF
+
6
HIGH LIMIT
HIGH SET
GND
3
VREF
Gen.
–
R SQ
Latch
4
5
CONTROL
RLOW < R HIGH
 2001-2012 Microchip Technology Inc.
DS21441D-page 1
TC623
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ......................................................5.5V
Input Voltage Any Input .. (GND – 0.3V) to (VDD +0.3V)
Package Power Dissipation (TA  70°C)
Plastic DIP ............................................730 mW
SOIC.....................................................470 mW
Derating Factors
Plastic DIP ...........................................8 mW/°C
SOIC ....................................................6 mW/°C
Operating Temperature
V Version .................................-40°C to +125°C
E Version ...................................-40°C to +85°C
C Version ...................................... 0°C to +70°C
Storage Temperature..........................-65°C to +150°C
TC623 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Over Operating Temperature Range, VDD = 2.7V to 4.5V, unless otherwise specified.
Symbol
Parameter
Min
Typ.
Max
Unit
VDD
Supply Voltage Range
2.7
—
4.5
V
IDD
Supply Current
—
150
250
A
Test Conditions
2.7V  VDD  4.5V
TSET
Absolute Accuracy
T- 3
T ±1
T+3
°C
T = Programmed Temperature
VOH
Output Voltage High
0.9 x VDD
0.8 x VDD
—
—
—
—
V
V
IOH = 250 A
IOH = 500 A
VOL
Output Voltage Low
—
—
—
—
0.1 x VDD
0.2 x VDD
V
V
IOL = 500A
IOL = 1 mA
HYS
Hysteresis
—
—
-2
°C
Falling Temperature
DS21441D-page 2
 2001-2012 Microchip Technology Inc.
TC623
2.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin PDIP)
Symbol
1
NC
2
LOW SET
Low temperature set point. Connect an external 1% resistor from LOW SET to VDD
to set trip point.
3
HIGH SET
High temperature set point. Connect an external 1% resistor from HIGH SET to
VDD to set trip point.
4
GND
Description
No Internal Connection.
Ground Terminal.
5
CONTROL
Control output.
6
HIGH LIMIT
High temperature push/pull output.
7
LOW LIMIT
Low temperature push/pull output.
8
VCC
Power supply input.
 2001-2012 Microchip Technology Inc.
DS21441D-page 3
TC623
3.0
DETAILED DESCRIPTION
3.1
TC623 Operation
The TC623 has a positive temperature coefficient
(Silicon) temperature sensor and dual threshold detector. Temperature set point programming is accomplished with external resistors from the HIGH SET and
LOW SET inputs to VCC. The HIGH LIMIT and LOW
LIMIT outputs remain inactive (low) as long as the
measured temperature is below set point values. As
temperature increases, the LOW LIMIT is driven high
when temperature equals the LOW LIMIT set point
(±3°C). If temperature continues to climb, the HIGH
LIMIT output is driven high when temperature equals
the HIGH LIMIT set point (±3°C).
Figure 3-1 shows the relationship between the sense
resistance values and trip point temperature.
FIGURE 3-1:
TC623 SENSE
RESISTORS VS. TRIP
TEMPERATURE
RESISTANCE, RTRIP (kΩ)
250
200
150
100
50
-55
-35
-15
5
25
45
65
85
105
125
The CONTROL output is driven high when the HIGH
LIMIT output goes high and is RESET low when the
LOW LIMIT output goes low. This output provides the
logic for simple ON/OFF fan control. Figure 3-2 shows
overall TC623 operation.
FIGURE 3-2:
TC623 TEMPERATURE
VS. OUTPUT
High Set Point
Temperature
Low Set Point
Low Limit Output
High Limit Output
Control Output (Cool Option)
To prevent output “chattering” when measured temperature is at (or near) the trip point values, the LOW SET
and HIGH SET inputs each have a built-in hysteresis of
-2°C max. As a result, the HIGH LIMIT and LOW LIMIT
outputs remain active until the measured temperature
falls a maximum of 2°C below the programmed HIGH
SET and LOW SET thresholds as shown in Figure 3-3.
The programmed setting threshold of Figure 3-3 is user
programmed temperature trip points of either the LOW
SET or HIGH SET inputs. The LOW LIMIT or HIGH
LIMIT output is driven active when temperature equals
the set point value (to within 3°C). The output remains
active until the temperature falls an additional 2°C
below the set point due to hysteresis.
FIGURE 3-3:
HIGH SET AND LOW SET
THRESHOLDS
TEMPERATURE (°C)
Programmed Setpoint
-2°C Hysteresis
High Limit or Low Limit Ouput
DS21441D-page 4
 2001-2012 Microchip Technology Inc.
TC623
4.0
TYPICAL APPLICATIONS
4.1
Mounting
If the TC623 is used to measure the temperature of
another device, it is important that the top surface of the
TC623 package be in intimate contact with the
measured device. Good thermal conductivity and no air
space is critical to accurate temperature measurement
in applications of this type.
4.2
Trip Point Programming
The resistance values required for the HIGH SET and
LOW SET inputs are calculated using the formula
below:
RTRIP = 0.5997 x T 2.1312
Where;
RTRIP = Programming resistor value in Ohms
T = Desired trip temperature in degrees Kelvin.
For example, to program a trip point of 50°C, the
programming resistor is:
RTRIP = 0.5997 x (50 + 273.15)2.1312) = 133.65 k
 2001-2012 Microchip Technology Inc.
DS21441D-page 5
TC623
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
DS21441D-page 6
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
 2001-2012 Microchip Technology Inc.
TC623
5.3
Package Dimensions
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin SOIC
Pin 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) Typ.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8° Max.
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin Plastic DIP
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
.015 (0.38)
.008 (0.20)
3° Min.
.400 (10.16)
.310 (7.87)
Dimensions: inches (mm)
 2001-2012 Microchip Technology Inc.
DS21441D-page 7
TC623
6.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
DS21441D-page 8
 2001-2012 Microchip Technology Inc.
TC623
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DS21441D-page 9
TC623
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DS21441D-page 11
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