PDF

v00.1206
LH250 – CERAMIC
HERMETIC SMT PACKAGE
PACKAGE OUTLINES
LH250 Package Outline Drawing
NOTES:
1. PACKAGE MATERIAL: CERAMIC & KOVAR.
2. LEAD AND GROUND PADDLE PLATE: GOLD 40 - 80 MICROINCHES.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IN NON-CUMULATIVE.
5. PAD BUR LENGTH 0.15mm MAX. PAD BUR HEIGHT 0.25mm MAX.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
v00.1206
LH250 – CERAMIC
HERMETIC SMT PACKAGE
PACKAGE OUTLINES
Suggested LH250 PCB Land Pattern
NOTES:
1. DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT
CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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