v00.0902 MS10 (E) – 10 LEAD PLASTIC MSOP PACKAGE PACKAGE OUTLINES MS10 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Suffix Package Body Material Lead Finish MSL Rating MS10 RoHS Compliant Mold Compound Sn/Pb Solder MSL1 MS10E RoHS Compliant Mold Compound 100% matte Sn MSL1 Package Marking [3][4] [1] HNNN XXXX [2] HNNN XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX [4] 3-Digit part number NNN B - 24 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v00.0902 MS10 (E) – 10 LEAD PLASTIC MSOP PACKAGE PACKAGE OUTLINES Suggested MS10 (E) PCB Land Pattern NOTES: 1. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE. B - 14 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com