v00.0704 LP6 (E) – 6 x 6 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES LP6 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. PAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Information Part Number Suffix Package Body Material Lead Finish MSL Rating LP6 RoHS Compliant Mold Compound Sn/Pb Solder MSL1 LP6E RoHS Compliant Mold Compound 100% matte Sn MSL1 Package Marking [3][4] [1] HNNN XXXX [2] HNNN XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX [4] 3-Digit part number NNN B - 14 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v00.0704 LP6 (E) – 6 x 6 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE PACKAGE OUTLINES Suggested LP6 (E) PCB Land Pattern NOTES: 1. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE. 3. SOLDERMASK ON FAR SIDE SHOULD TENT OR PLUG VIA HOLES. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com B-9