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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP
4X4
16
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
1333-86-4
1.27E-02
4.06E-04
4.06E-04
4.06E-05
1.35 E-02
Percentage (%)
PPM
Percentage (%)
93.7
3.0
3.0
0.3
100.00
937000
30000
30000
3000
1000000
34.37
1.10
1.10
0.11
36.68
PPM
343666
11003
11003
1100
366773
Leadframe
Component Level
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
1.88 E-02
4.54 E-04
2.32 E-05
5.79 E-06
1.93 E-02
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
51.00
1.23
0.06
0.02
52.31
PPM
510044
12293
628
157
523122
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
3.97 E-04
7440-22-4
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.08
PPM
10766
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
5.69 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.54
PPM
15415
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Component Level
Weight (g)
3.25 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.88
PPM
8808
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
2.17 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
5.87
PPM
58723
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
t-butyl phenyl glycidyl ether
Phenolic hardener
Butyl cellosolve acetate
CAS#
7440-22-4
9003-36-5 / 30583-72-3
3101-60-8
92-88-6
112-07-2
Component Level
Weight (g)
4.23 E-04
1.21 E-04
4.54 E-05
9.07 E-06
6.05 E-06
6.05 E-04
Weight (g)
3.69 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
70
20
7.5
1.5
1
100.0
700000
200000
75000
15000
10000
1000000
1.15
0.33
0.12
0.02
0.02
1.64
Percentage (%)
100
PPM
11475
3279
1230
246
164
16393
PPM
1000000