Materials Declaration Package Body Size LeadCount Option Item Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black Subtotal Item Cu Zr Subtotal PLCC 28 Halide, Pb-free Molding Compound % of Compound Weight (g) 86.0 7.05 E-01 7.5 6.15 E-02 4.0 3.28 E-02 2.0 1.64 E-02 0.5 4.10 E-03 8.20 E-01 Leadframe % of Leadframe 99.9 0.1 Weight (g) 2.91 E-01 2.91 E-04 2.91 E-01 PPM 616033 53724 28652 14327 3582 716318 253984 254 254238 Internal Leadframe Plating % of Plating Weight (g) 1.48E-03 100 PPM PPM Sn External Leadframe Plating Weight (g) % of Plating 100 1.41E-02 1293 Weight (g) 1.12 E-03 PPM Au Weight (g) 1.24E-02 PPM Si Chip % of Chip 100 Weight (g) 3.42 E-03 9.13 E-04 1.14 E-04 6.85 E-05 4.57 E-05 4.57 E-03 PPM Item Ag Filler Epoxy Resin t-butyl phenyl glycidyl ether Phenolic hardener Butyl cellosolve acetate Subtotal Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MS-D. Not Detected Draft IEC 62321. GC-MS-D. 12351 Bond Wires % of Wire 99.99 Die Attach % of Die Attach 75.0 20.0 2.5 1.5 1.0 Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MS-D. Not Detected Draft IEC 62321. GC-MS-D. PPM Ag Item Item Pb Cd Hg Cr+6 PBB PBDE 982 10829 2992 798 100 60 40 3989 Package Totals Weight (g) PPM 1000000 1.14 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary AMK-P-J Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Cresol Novolac Phenol Novolac Sb2O3 Brominated Resin Carbon Black Subtotal Item Cu Zr Subtotal Ag Item Sn Pb Subtotal PLCC 28 with Pb Molding Compound % of Compound 72 16 8 2.2 1.6 0.2 Weight (g) 5.66 E-01 1.26 E-01 6.29 E-02 1.73 E-02 1.26 E-02 1.57 E-03 7.86 E-01 PPM 575354 127856 63928 17580 12786 1598 799102 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MS-D. Not Detected Draft IEC 62321. GC-MS-D. Weight (g) 1.59 E-01 1.59 E-04 1.59 E-01 PPM 161609 162 161770 Internal Leadframe Plating % of Plating Weight (g) 1.21 E-03 100 PPM 1234 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MS-D. Not Detected Draft IEC 62321. GC-MS-D. External Leadframe Plating Weight (g) % of Plating 85 1.41 E-02 15 2.48 E-03 1.66 E-02 PPM 14308 2525 16833 Leadframe % of Leadframe 99.9 0.1 Au Bond Wires % of Wire 99.99 Weight (g) 1.41 E-03 PPM 1430 Si Chip % of Chip 100 Weight (g) 1.56 E-02 PPM 15907 Weight (g) 2.93 E-03 5.49 E-04 1.83 E-04 3.66 E-03 PPM 2978 558 186 3722 Item Ag Epoxy Resin Curing agent & hardener Subtotal Die Attach % of Die Attach 80 15 5 Package Totals Weight (g) PPM 1000000 9.84 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary AMK-P-A