Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LGA - ADIS16203 16 Au Materials Declaration PWB Description Composite Substance PCB CAS# Weight (g) Proprietary 9.42 E-02 Homogeneous Material Level Percentage (%) PPM 100.00 1000000 Percentage (%) 15.08 Component Level Homogeneous Material Level PPM Percentage (%) 100.00 1000000 Percentage (%) 7.39 Homogeneous Material Level PPM Percentage (%) 950000 95.00 50000 5.00 100.0 1000000 Percentage (%) 11.20 0.59 11.79 Homogeneous Material Level PPM Percentage (%) 100.0 1000000 Percentage (%) 5.58 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 6.28 Homogeneous Material Level PPM Percentage (%) 49.90 499000 Percentage (%) 0.09 PPM 150833 Board Frame Description Composite Substance Board Frame CAS# Weight (g) Proprietary 4.61 E-02 Component Level PPM 73855 Solder Paste Substance Description Tin and its alloys Tin and its alloys Subtotal Tin Antimony CAS# Weight (g) 7440-31-5 7440-36-0 6.99 E-02 3.68 E-03 7.36 E-02 CAS# Weight (g) 7440-21-3 3.48 E-02 Component Level PPM 112015 5896 117911 Chip Description Inorganic silicon Substance Doped Silicon Component Level PPM 55783 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 3.92 E-02 Component Level PPM 62832 Die Attach Description Substance Component Level CAS# Weight (g) Other inorganic materials Silicon Dioxide 14808-60-7 5.39 E-04 Organic materials Reaction product: bisphenol-F(epichlorhydrin); epoxy resin (number average molecular weight <= 700) 9003-36-5 2.16 E-04 20.00 200000 0.03 346 Organic materials Others Glass 1,4-bis(2,3-epoxypropoxy)butane Aromatic Amine Glass 2425-79-8 Proprietary 65997-17-3 2.16 E-04 5.40 E-05 5.40 E-05 20.00 5.00 5.00 200000 50000 50000 0.03 0.01 0.009 346 87 87 Organic materials Reaction product: bisphenol-A(epichlorhydrin); epoxy resin (number average molecular weight <= 700) 25068-38-6 1.08 E-06 0.10 1000 0.0002 1.08 E-03 100.00 1000000 0.17 Subtotal PPM 863 2 1730 Underfill Description Substance CAS# Weight (g) Homogeneous Material Level PPM Percentage (%) 73.40 260395 15.00 53214 7.50 26607 Component Level Percentage (%) 3.07 0.63 0.31 PPM Other Inorganic materials Other organic materials Other organic materials Silica hexahydromethylphthalic anhydride 1,6-Naphthalenediol diglycidyl ether 60676-86-0 25550-51-0 27610-48-6 1.92 E-02 3.92 E-03 1.96 E-03 Other organic materials Bisphenol-A epichlorhydrin resin MW <= 700 25068-38-6 7.83 E-04 3.00 10643 0.13 1255 Other organic materials 4,4'-Methylene diphenyl diglycidyl ether 1675-54-3 1.44 E-04 0.55 1951 0.02 230 Other organic materials Bisphenol-F epichlorhydrin resin; MW<700 9003-36-5 1.44 E-04 0.55 1951 0.02 230 2.61 E-02 100.0 1000000 4.18 41830 Subtotal 30703 6275 3137 Label Description Other organic materials Others Other organic materials Others Subtotal Substance Static Dissipative Adhesive Topcoat Mixture Polyimide Film Primer Mixture Homogeneous Material Level Percentage (%) PPM 506500 50.65 236000 23.60 204500 20.45 53000 5.30 100.0 1000000 Percentage (%) 9.18 4.28 3.71 0.96 18.12 Component Level Homogeneous Material Level PPM Percentage (%) Percentage (%) CAS# Weight (g) Proprietary Proprietary Proprietary Proprietary 5.73 E-02 2.67 E-02 2.31 E-02 5.99 E-03 1.13 E-01 CAS# Weight (g) 1304-28-5 13463-67-7 Proprietary 1.56 E-02 7.82 E-03 2.61 E-03 2.61 E-02 60.00 30.00 10.00 100.00 600000 300000 100000 1000000 2.51 1.25 0.42 4.18 25071 12535 4178 41785 7440-50-8 5.96 E-03 100.00 1000000 0.95 9542 7631-86-9 1303-86-2 5.29 E-04 1.32 E-04 6.62 E-04 4.37 E-03 7.26 E-04 3.78 E-02 80.00 20.00 100.00 100.00 100.00 800000 200000 1000000 167702 27835 0.08 0.02 0.11 0.70 0.12 6.06 848 212 1060 7007 1163 60558 PPM 91774 42761 37054 9603 181192 Capacitor 1 Description Ceramics Ceramics Ceramics Copper and its alloys Glass Glass Nickel and its alloys Tin and its alloys Subtotal Substance Ceramic Barium oxide Titanium dioxide Misc Subtotal Outer Electrode Copper Silicon dioxide Diboron trioxide Subtotal Nickel Tin 7440-02-0 7440-31-5 Component Level PPM LCC Package Description Ceramics Ceramics Ceramics Ceramics Ceramics Subtotal Other inorganic materials Nickel & its alloys Precious metals Subtotal Precious metals Nickel & its alloys Subtotal Tin & its alloys Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Aluminum & its alloys Aluminum & its alloys Subtotal Polymer Other inorganic materials Subtotal Substance Homogeneous Material Level Percentage (%) PPM Component Level CAS# Weight (g) Ceramic Base Alumina Chromium oxide Silicon dioxide Titanium dioxide Molybdenum 1344-28-1 1308-38-9 7631-86-9 13463-67-7 7439-98-7 9.70 E-02 4.09 E-03 3.80 E-03 1.05 E-03 2.76 E-04 1.06 E-01 91.32 3.85 3.58 0.99 0.26 100.00 913200 38500 35800 9900 2600 1000000 15.54 0.66 0.61 0.17 0.04 17.01 155370 6550 6091 1684 442 170138 Terminals Tungsten Nickel Gold 7440-33-7 7440-02-0 7440-57-5 9.11 E-03 1.17 E-03 6.26 E-04 1.09 E-02 83.55 10.71 5.74 100.00 835500 107100 57400 1000000 1.46 0.19 0.10 1.75 14590 1870 1002 17462 Metal Lid Iron Nickel 7439-89-6 7440-02-0 1.46 E-02 1.06 E-02 2.52 E-02 58.0 42.0 100.0 579900 420100 1000000 2.34 1.70 4.04 23421 16967 40388 Solder Seal Lead Tin Silver Indium 7439-92-1 7440-31-5 7440-22-4 7440-74-6 2.01 E-03 1.39 E-04 2.79 E-05 2.77 E-05 2.20 E-03 91.14 6.33 1.27 1.26 100.0 911400 63300 12700 12600 1000000 0.32 0.02 0.00 0.00 0.35 3212 223 45 44 3525 Bond Wires Aluminum Silicon 7429-90-5 7440-21-3 3.00 E-05 3.03 E-07 3.03 E-05 99.0 1.0 100.0 990000 10000 1000000 0.00 0.0000 0.00 Die Attach Polymer Chip Doped Silicon Percentage (%) PPM 48 0 49 Proprietary 3.29 E-03 100 1000000 0.53 5263 7440-21-3 6.00 E-03 1.54 E-01 100 1000000 0.96 24.64 9612 246436 CAS# Weight (g) Ceramics Aluminum oxide ; Alumina; Corundum; Silica; Silicon dioxide Magnesium oxide Calcium oxide 1344-28-1 7631-86-9 1309-48-4 1305-78-8 1.33 E-03 2.90 E-05 1.38 E-05 4.14 E-06 1.38 E-03 96.60 2.10 1.00 0.30 100.00 966000 21000 10000 3000 1000000 0.21 0.00 0.002 0.001 0.22 Top Terminal Silver Palladium Lead(II) oxide; Lead oxide (PbO); C.I. Silica; Silicon dioxide 7440-22-4 7440-05-3 1317-36-8 7631-86-9 1.69 E-05 1.22 E-06 2.40 E-07 1.59 E-07 1.85 E-05 91.23 6.61 1.30 0.86 100.00 912300 66100 13000 8600 1000000 0.00270 0.00020 0.00004 0.00003 0.00296 27 2 0.4 0.3 30 Bottom Terminal Silver Lead(II) oxide; Lead oxide (PbO); C.I. Silica; Silicon dioxide 7440-22-4 1317-36-8 7631-86-9 2.33 E-05 3.60 E-07 2.40 E-07 2.39 E-05 97.49 1.50 1.00 100.00 974937 15038 10025 1000000 0.00374 0.00006 0.00004 0.00384 37 1 0.4 38 Resistive Element Ruthenium(IV) oxide Lead(II) oxide; Lead oxide (PbO); C.I. Silica; Silicon dioxide Boron oxide Manganese dioxide 12036-10-1 1317-36-8 7631-86-9 1303-86-2 1313-13-9 7.56 E-06 4.87 E-06 3.53 E-06 1.25 E-06 4.25 E-07 1.76 E-05 42.88 27.60 20.00 7.11 2.41 100.00 428800 276000 200000 71100 24100 1000000 0.00121 0.00078 0.00057 0.00020 0.00007 0.00283 12 8 6 2 1 28 First Protective Coating Lead(II) oxide; Lead oxide (PbO); C.I. Silica; Silicon dioxide Boron oxide Zinc oxide Chromium(III) oxide; Pigment green 17 1317-36-8 7631-86-9 1303-86-2 1314-13-2 1308-38-9 9.70 E-06 4.52 E-06 2.28 E-06 7.41 E-07 4.07 E-07 1.76 E-05 54.97 25.61 12.91 4.20 2.31 100.00 549700 256100 129100 42000 23100 1000000 0.00155 0.00072 0.00036 0.00012 0.00007 0.00283 16 7 4 1 1 28 Second Protective Coating Epichlorohydrin, o-cresol, formaldehyde Silicon dioxide Carbon black 29690-82-2 7631-86-9 1333-86-4 1.93 E-05 6.43 E-06 2.23 E-06 2.79 E-05 68.99 23.01 8.00 100.00 689900 230100 80000 1000000 0.00309 0.00103 0.00036 0.00 31 10 4 45 Side Terminal Bisphenol A, epichlorohydrin polymer; Silver Carbon black 25068-38-6 7440-22-4 1333-86-4 7.25 E-05 7.25 E-05 1.45 E-05 1.60 E-04 45.45 45.45 9.10 100.00 454511 454474 91015 1000000 0.01162 0.01162 0.00233 0.03 116 116 23 256 7440-02-0 1.29 E-04 100.00 1000000 0.02067 207 7440-31-5 1.20 E-04 100.00 1000000 0.01922 192 0.30347 3035 Resistor Description Ceramics Ceramics Ceramics Ceramics Subtotal Precious metals Precious metals Glass Glass Subtotal Precious metals Glass Glass Subtotal Glass Glass Glass Glass Glass Subtotal Glass Glass Glass Glass Glass Subtotal Other organic materials Other inorganic materials Other inorganic materials Subtotal Other organic materials Precious metals Other inorganic materials Subtotal Nickel and its alloys Tin and its alloys Subtotal Substance Middle Terminal Nickel Outer Terminal Tin 1.89 E-03 Homogeneous Material Level PPM Percentage (%) Component Level Percentage (%) PPM 2136 46 22 7 2211 Capacitor 2 Description Ceramics Copper and its alloys Nickel and its alloys Tin and its alloys Others Subtotal Package Totals Substance Barium Titanate Copper Nickel Tin Others CAS# Weight (g) 12047-27-7 7440-50-8 7440-02-0 7440-31-5 Proprietary 1.10 E-03 8.00 E-04 5.00 E-04 6.00 E-05 4.00 E-05 2.50 E-03 Weight (g) 6.24 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Homogeneous Material Level Percentage (%) PPM 440000 44.00 320000 32.00 200000 20.00 24000 2.40 16000 1.60 1000000 100.00 Component Level Percentage (%) 0.18 0.13 0.08 0.01 0.01 0.40 PPM Percentage (%) 100.00 PPM 1762 1282 801 96 64 4005 1000000