Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC Nickel‐Palladium‐Gold (Ni‐Pd‐Au) RoHS Compliant e4 Green Compliant Amkor Philippines REACH Compliant STN Yes Yes Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin Polyglycidyl Ester 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Copper Oxide gamma‐Butyrolactone Poly(oxypropylene)diamine 1,4‐Bis(2,3‐epoxypropoxy)butane 7440‐22‐4 9003‐36‐5 68475‐94‐5 Proprietary 1317‐38‐0 96‐48‐0 Proprietary 2425‐79‐8 Gold (Au) 7440‐57‐5 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Nickel (Ni) Palladium (Pd) Gold (Au) 7440‐02‐0 7440‐05‐3 7440‐57‐5 Sub‐Total Total Weight (mg) 24.169 0.596 0.025 0.025 24.814 2.710 2.710 0.147 0.012 0.012 0.010 0.009 0.005 0.005 0.001 0.201 0.055 0.055 81.300 7.330 3.046 3.046 0.476 95.199 0.439 0.031 0.004 0.473 123.452 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.1 731000 6.0 60000 6.0 60000 5.2 52000 4.6 46000 2.3 23000 2.3 23000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 19.58 195777 0.48 4824 0.02 201 0.02 201 20.10 201003 2.19 21949 2.19 21949 0.12 1189 0.01 98 0.01 98 0.01 85 0.01 75 0.00 37 0.00 37 0.00 8 0.16 1627 0.04 445 0.04 445 65.86 658556 5.94 59378 2.47 24677 2.47 24677 0.39 3856 77.11 771143 0.36 3554 0.02 249 0.00 31 0.38 3833 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: February 29, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC Nickel‐Palladium‐Gold (Ni‐Pd‐Au) RoHS Compliant e4 Green Compliant Amkor Philippines REACH Compliant STN Yes Yes Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin Polyglycidyl Ester 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Copper Oxide gamma‐Butyrolactone Poly(oxypropylene)diamine 1,4‐Bis(2,3‐epoxypropoxy)butane 7440‐22‐4 9003‐36‐5 68475‐94‐5 Proprietary 1317‐38‐0 96‐48‐0 Proprietary 2425‐79‐8 Gold (Au) 7440‐57‐5 Silica Fused Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary 1333‐86‐4 Nickel (Ni) Palladium (Pd) Gold (Au) 7440‐02‐0 7440‐05‐3 7440‐57‐5 Sub‐Total Total Weight (mg) 24.169 0.596 0.025 0.025 24.814 2.710 2.710 0.147 0.012 0.012 0.010 0.009 0.005 0.005 0.001 0.201 0.055 0.055 85.679 3.427 3.427 2.475 0.190 95.199 0.439 0.031 0.004 0.473 123.452 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.1 731000 6.0 60000 6.0 60000 5.2 52000 4.6 46000 2.3 23000 2.3 23000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 90.0 900000 3.6 36000 3.6 36000 2.6 26000 0.2 2000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 19.58 195777 0.48 4824 0.02 201 0.02 201 20.10 201003 2.19 21949 2.19 21949 0.12 1189 0.01 98 0.01 98 0.01 85 0.01 75 0.00 37 0.00 37 0.00 8 0.16 1627 0.04 445 0.04 445 69.40 694029 2.78 27761 2.78 27761 2.00 20050 0.15 1542 77.11 771143 0.36 3554 0.02 249 0.00 31 0.38 3833 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: February 29, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC Nickel‐Palladium‐Gold (Ni‐Pd‐Au) RoHS Compliant e4 Green Compliant Amkor Philippines REACH Compliant STN Yes Yes Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin Polyglycidyl Ester 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Copper Oxide gamma‐Butyrolactone Poly(oxypropylene)diamine 1,4‐Bis(2,3‐epoxypropoxy)butane 7440‐22‐4 9003‐36‐5 68475‐94‐5 Proprietary 1317‐38‐0 96‐48‐0 Proprietary 2425‐79‐8 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Fused Epoxy Resin Phenol Resin Epoxy, Cresol Novolac Carbon Black 60676‐86‐0 Proprietary Proprietary 29690‐82‐2 1333‐86‐4 Nickel (Ni) Palladium (Pd) Gold (Au) 7440‐02‐0 7440‐05‐3 7440‐57‐5 Sub‐Total Total Weight (mg) 24.169 0.596 0.025 0.025 24.814 2.710 2.710 0.147 0.012 0.012 0.010 0.009 0.005 0.005 0.001 0.201 0.025 0.001 0.026 82.347 5.236 5.236 2.094 0.286 95.199 0.439 0.031 0.004 0.473 123.422 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.1 731000 6.0 60000 6.0 60000 5.2 52000 4.6 46000 2.3 23000 2.3 23000 0.5 5000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 86.5 865000 5.5 55000 5.5 55000 2.2 22000 0.3 3000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 19.58 195823 0.48 4825 0.02 201 0.02 201 20.11 201050 2.20 21954 2.20 21954 0.12 1190 0.01 98 0.01 98 0.01 85 0.01 75 0.00 37 0.00 37 0.00 8 0.16 1628 0.02 202 0.00 5 0.02 207 66.72 667197 4.24 42423 4.24 42423 1.70 16969 0.23 2314 77.13 771326 0.36 3554 0.02 249 0.00 31 0.38 3834 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: February 29, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.