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Product / Package Information
Package
Body Size (mm)
Ball Count
Terminal Finish
Environmental Information
LGA_CAV
3.35 X 2.5 X 0.98
3
Gold
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Yes
Yes
Yes
Yes
Materials Declaration
Lid/Shield
Description
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Tin & its alloys
Subtotal
Substance
Iron
Chromium
Nickel
Manganese
Silicon
Carbon
Phosphorus
Sulfur
Tin
CAS#
Weight (g)
7439-89-6
7440-47-3
7440-02-0
7439-96-5
7440-21-3
7440-44-0
7723-14-0
7704-34-9
7440-31-5
4.61 E-03
1.16 E-03
5.19 E-04
8.15 E-05
3.33 E-05
3.14 E-06
1.47 E-06
1.28 E-07
2.90 E-04
6.70 E-03
CAS#
Weight (g)
Proprietary
7440-50-8
Proprietary
7440-02-0
7440-57-5
7440-50-8
12047-27-7
Proprietary
Proprietary
Proprietary
7440-50-8
7440-66-6
7440-38-2
7440-47-3
7440 47 3
7439-92-1
7440-02-0
3.20 E-03
1.10 E-03
4.01 E-04
1.87 E-03
7.36 E-05
2.00 E-03
1.33 E-04
2.88 E-05
3.32 E-05
1.33 E-05
2.20 E-03
7.78 E-06
8.85 E-07
1 77 E
07
1.77
E-07
8.85 E-09
4.43 E-09
1.11 E-02
CAS#
Weight (g)
7440-50-8
7440-02-0
7440-57-5
2.00 E-04
5.00 E-05
1.00 E-05
2.60 E-04
CAS#
Weight (g)
7440 57 5
7440-57-5
7440-05-3
4 84 E
05
4.84
E-05
4.89 E-07
4.89 E-05
CAS#
Weight (g)
7440-21-3
7.00 E-04
Homogeneous Material Level
Percentage (%)
PPM
68.84
688400
17.31
173057
7.74
77400
1.22
12160
0.50
4972
0.05
468
0.02
220
0.002
19
4.33
43274
100.0
999970
Percentage (%)
23.69
5.95
2.66
0.42
0.17
0.02
0.01
0.001
1.49
34.41
Homogeneous Material Level
Percentage (%)
PPM
28.90
289000
9.93
99300
3.63
36280
16.88
168782
0.67
6656
18.12
181200
1.20
12000
0.26
2600
0.30
3000
0.12
1200
19.92
199200
0.07
703
0.01
80
0
0.002
002
16
0.0001
1
0.00004
0
100.00
1000000
Percentage (%)
16.42
5.64
2.06
9.59
0.38
10.30
0.68
0.15
0.17
0.07
11.32
0.04
0.005
0.001
0
001
0.00005
0.00002
56.82
Homogeneous Material Level
Percentage (%)
PPM
76.92
769231
19.23
192308
3.85
38462
100.00
1000000
Percentage (%)
1.03
0.26
0.05
1.34
Homogeneous Material Level
Percentage (%)
PPM
99
990000
1
10000
100
1000000
Percentage (%)
0 25
0.25
0.003
0.25
Homogeneous Material Level
Percentage (%)
PPM
100
1000000
Percentage (%)
3.59
Homogeneous Material Level
Percentage (%)
PPM
75.00
750000
10.00
100000
10.00
100000
3.00
30000
2 00
2.00
20000
100.00
1000000
Percentage (%)
1.16
0.15
0.15
0.05
0
03
0.03
1.54
Homogeneous Material Level
Percentage (%)
PPM
1000000
100
Percentage (%)
1.03
Homogeneous Material Level
Percentage (%)
PPM
75.0
750000
10.0
100000
10.0
100000
3.0
30000
2.0
20000
100 00
100.00
1000000
Percentage (%)
0.77
0.10
0.10
0.03
0.02
1 03
1.03
PPM
Percentage (%)
100.00
PPM
Component Level
PPM
236865
59546
26632
4184
1711
161
76
7
14890
344071
L i t
Laminate
Description
Composite
Copper & its alloys
Other organic materials
Nickel & its alloys
Precious Metals
Passives 1
Passives 1
Passives 1
Passives 1
Passives 1
Passives 2
Passives 2
Passives 2
P
Passives
i
2
Passives 2
Passives 2
Subtotal
Substance
Laminate core
Copper
Solder Mask
Nickel
Gold
Copper Foil
Barium Titanate
Epoxy-based polymer
Proprietary organic dispersant
Halogen-free curative
Copper
Zinc
Arsenic
Chromium
Ch
i
Lead
Nickel
Component Level
PPM
164198
56418
20613
95895
3782
102950
6818
1477
1704
682
113177
399
45
9
0
0
568167
Solder Land
Description
Copper & its alloys
Nickel & its alloys
Precious Metals
Subtotal
Substance
Copper
Nickel
Gold
Component Level
PPM
10271
2568
514
13352
Bond Wires
Description
Precious
P
i
metals
t l
Precious metals
Subtotal
Substance
G ld
Gold
Palladium
Component Level
PPM
2486
25
2511
Chip
Description
Other inorganic materials
Substance
Doped Silicon
Component Level
PPM
35949
Die Attach
Description
Precious metals
Other organic materials
Other organic materials
Others
Others
Subtotal
Substance
Silver
Bisphenof F type epoxy resin
Bisphenof A type epoxy resin
Additives
Curing Agent
CAS#
Weight (g)
7440-22-4
9003-36-5
25068-38-6
Proprietary
Proprietary
2.25 E-04
3.00 E-05
3.00 E-05
9.00 E-06
6 00 E
6.00
E-06
06
3.00 E-04
CAS#
Weight (g)
Proprietary
2.00 E-04
Component Level
PPM
11555
1541
1541
462
308
15407
Die Coat
Description
Other organic materials
Substance
Polydimethylsiloxane
Component Level
PPM
10271
Lid/ Shield Attach
Description
Precious metals
Other organic materials
Other organic materials
Others
Others
Subtotal
Package Totals
Substance
Silver
Bisphenof F type epoxy resin
Bisphenof A type epoxy resin
Additives
Curing Agent
CAS#
Weight (g)
7440-22-4
9003-36-5
25068-38-6
Proprietary
Proprietary
1.50 E-04
2.00 E-05
2.00 E-05
6.00 E-06
4.00 E-06
2 00 E
2.00
E-04
04
Weight (g)
1.95 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
7703
1027
1027
308
205
10271
1000000