Product / Package Information Package Body Size (mm) Ball Count Terminal Finish Environmental Information LGA_CAV 3.35 X 2.5 X 0.98 3 Gold RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Yes Yes Yes Yes Materials Declaration Lid/Shield Description Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Tin & its alloys Subtotal Substance Iron Chromium Nickel Manganese Silicon Carbon Phosphorus Sulfur Tin CAS# Weight (g) 7439-89-6 7440-47-3 7440-02-0 7439-96-5 7440-21-3 7440-44-0 7723-14-0 7704-34-9 7440-31-5 4.61 E-03 1.16 E-03 5.19 E-04 8.15 E-05 3.33 E-05 3.14 E-06 1.47 E-06 1.28 E-07 2.90 E-04 6.70 E-03 CAS# Weight (g) Proprietary 7440-50-8 Proprietary 7440-02-0 7440-57-5 7440-50-8 12047-27-7 Proprietary Proprietary Proprietary 7440-50-8 7440-66-6 7440-38-2 7440-47-3 7440 47 3 7439-92-1 7440-02-0 3.20 E-03 1.10 E-03 4.01 E-04 1.87 E-03 7.36 E-05 2.00 E-03 1.33 E-04 2.88 E-05 3.32 E-05 1.33 E-05 2.20 E-03 7.78 E-06 8.85 E-07 1 77 E 07 1.77 E-07 8.85 E-09 4.43 E-09 1.11 E-02 CAS# Weight (g) 7440-50-8 7440-02-0 7440-57-5 2.00 E-04 5.00 E-05 1.00 E-05 2.60 E-04 CAS# Weight (g) 7440 57 5 7440-57-5 7440-05-3 4 84 E 05 4.84 E-05 4.89 E-07 4.89 E-05 CAS# Weight (g) 7440-21-3 7.00 E-04 Homogeneous Material Level Percentage (%) PPM 68.84 688400 17.31 173057 7.74 77400 1.22 12160 0.50 4972 0.05 468 0.02 220 0.002 19 4.33 43274 100.0 999970 Percentage (%) 23.69 5.95 2.66 0.42 0.17 0.02 0.01 0.001 1.49 34.41 Homogeneous Material Level Percentage (%) PPM 28.90 289000 9.93 99300 3.63 36280 16.88 168782 0.67 6656 18.12 181200 1.20 12000 0.26 2600 0.30 3000 0.12 1200 19.92 199200 0.07 703 0.01 80 0 0.002 002 16 0.0001 1 0.00004 0 100.00 1000000 Percentage (%) 16.42 5.64 2.06 9.59 0.38 10.30 0.68 0.15 0.17 0.07 11.32 0.04 0.005 0.001 0 001 0.00005 0.00002 56.82 Homogeneous Material Level Percentage (%) PPM 76.92 769231 19.23 192308 3.85 38462 100.00 1000000 Percentage (%) 1.03 0.26 0.05 1.34 Homogeneous Material Level Percentage (%) PPM 99 990000 1 10000 100 1000000 Percentage (%) 0 25 0.25 0.003 0.25 Homogeneous Material Level Percentage (%) PPM 100 1000000 Percentage (%) 3.59 Homogeneous Material Level Percentage (%) PPM 75.00 750000 10.00 100000 10.00 100000 3.00 30000 2 00 2.00 20000 100.00 1000000 Percentage (%) 1.16 0.15 0.15 0.05 0 03 0.03 1.54 Homogeneous Material Level Percentage (%) PPM 1000000 100 Percentage (%) 1.03 Homogeneous Material Level Percentage (%) PPM 75.0 750000 10.0 100000 10.0 100000 3.0 30000 2.0 20000 100 00 100.00 1000000 Percentage (%) 0.77 0.10 0.10 0.03 0.02 1 03 1.03 PPM Percentage (%) 100.00 PPM Component Level PPM 236865 59546 26632 4184 1711 161 76 7 14890 344071 L i t Laminate Description Composite Copper & its alloys Other organic materials Nickel & its alloys Precious Metals Passives 1 Passives 1 Passives 1 Passives 1 Passives 1 Passives 2 Passives 2 Passives 2 P Passives i 2 Passives 2 Passives 2 Subtotal Substance Laminate core Copper Solder Mask Nickel Gold Copper Foil Barium Titanate Epoxy-based polymer Proprietary organic dispersant Halogen-free curative Copper Zinc Arsenic Chromium Ch i Lead Nickel Component Level PPM 164198 56418 20613 95895 3782 102950 6818 1477 1704 682 113177 399 45 9 0 0 568167 Solder Land Description Copper & its alloys Nickel & its alloys Precious Metals Subtotal Substance Copper Nickel Gold Component Level PPM 10271 2568 514 13352 Bond Wires Description Precious P i metals t l Precious metals Subtotal Substance G ld Gold Palladium Component Level PPM 2486 25 2511 Chip Description Other inorganic materials Substance Doped Silicon Component Level PPM 35949 Die Attach Description Precious metals Other organic materials Other organic materials Others Others Subtotal Substance Silver Bisphenof F type epoxy resin Bisphenof A type epoxy resin Additives Curing Agent CAS# Weight (g) 7440-22-4 9003-36-5 25068-38-6 Proprietary Proprietary 2.25 E-04 3.00 E-05 3.00 E-05 9.00 E-06 6 00 E 6.00 E-06 06 3.00 E-04 CAS# Weight (g) Proprietary 2.00 E-04 Component Level PPM 11555 1541 1541 462 308 15407 Die Coat Description Other organic materials Substance Polydimethylsiloxane Component Level PPM 10271 Lid/ Shield Attach Description Precious metals Other organic materials Other organic materials Others Others Subtotal Package Totals Substance Silver Bisphenof F type epoxy resin Bisphenof A type epoxy resin Additives Curing Agent CAS# Weight (g) 7440-22-4 9003-36-5 25068-38-6 Proprietary Proprietary 1.50 E-04 2.00 E-05 2.00 E-05 6.00 E-06 4.00 E-06 2 00 E 2.00 E-04 04 Weight (g) 1.95 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level 7703 1027 1027 308 205 10271 1000000