Product / Package Information Package Body Size (mm) Ball Count Terminal Finish Environmental Information LGA_CAV 3.76 X 4.72 X 1.0 6 Gold RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Yes Yes Yes Yes Materials Declaration Lid/Shield Description Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Stainless steel Nickel & its alloys Tin & its alloys Subtotal Substance Iron Chromium Nickel Manganese Silicon Carbon Nitrogen Phosphorus Molybdenum Sulfur Nickel Tin CAS# Weight (g) 7439-89-6 7440-47-3 7440-02-0 7439-96-5 7440-21-3 7440-44-0 7727-37-9 7723-14-0 7439-98-7 7704-34-9 7440-02-0 7440-31-5 8.55 E-03 2.37 E-03 1.05 E-03 1.41 E-04 6.73 E-05 5.00 E-06 4.40 E-06 3.20 E-06 2.60 E-06 4.00 E-07 3.62 E-04 4.53 E-04 1.30 E-02 Homogeneous Material Level Percentage (%) PPM 65.77 657692 18.20 182000 8.04 80400 1.09 10862 0.52 5177 0.04 385 0.03 338 0.02 246 0.02 200 0.003 31 2.785 27854 3.482 34815 100.0 1000000 Percentage (%) 25.47 7.05 3.11 0.42 0.20 0.01 0.01 0.01 0.01 0.001 1.079 1.348 38.726 Homogeneous Material Level Percentage (%) PPM Percentage (%) Component Level PPM 254695 70481 31135 4206 2005 149 131 95 77 12 10787 13482 387256 Laminate Description Composite Composite Composite Composite Composite Composite Other organic materials Other inorganic materials Other inorganic materials Other organic materials Other inorganic materials Other inorganic materials Other organic materials Copper & its alloys Nickel & its alloys P i Precious Metals M t l Subtotal Substance CAS# Weight (g) Component Level PPM Fibrous glass-wool Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane Triazine Phenolic Polymer Resin Aluminium hydroxide Laminate Subtotal Cured resin Barium sulfate Talc Copper phthalocyanine blue Silicon dioxide Aluminium compounds Solder Mask Subtotal Copper Nickel Gold G ld Proprietary 7.45 E-03 43.52 435219 22.20 222047 Proprietary 7440-50-8 7440-02-0 7440-57-5 7440 57 5 5.31 E-03 3.17 E-03 1.02 E-03 1 75 E 04 1.75 E-04 1.71 E-02 31.00 18.49 5.97 1 1.02 02 100.00 310037 184854 59672 10218 1000000 15.82 9.43 3.04 0.52 0 52 51.02 158179 94312 30444 5213 510195 Substance CAS# Weight (g) 7440-50-8 7440-02-0 7440-57-5 5.90 E-04 1.70 E-04 3.00 E-05 7.90 E-04 Solder Land Description Copper & its alloys Nickel & its alloys Precious Metals Subtotal Copper Nickel Gold Homogeneous Material Level Percentage (%) PPM 74.68 746835 21.52 215190 3.80 37975 100.00 1000000 Percentage (%) 1.76 0.51 0.09 2.35 Component Level Homogeneous Material Level Percentage (%) PPM 99 990000 1 10000 100 1000000 Percentage (%) 0.29 0.003 0.298 Homogeneous Material Level Percentage (%) PPM 100 1000000 Percentage (%) 3.87 Homogeneous Material Level Percentage (%) PPM 77.71 777100 3.11 31100 3.11 31100 3.11 31100 3.11 31100 3.11 31100 3.11 31100 3.11 31100 0.52 5200 100.00 1000000 Percentage (%) 1.85 0.07 0.07 0.07 0.07 0.07 0.07 0.07 0.01 2 38 2.38 Homogeneous Material Level Percentage (%) PPM 549889 55 199557 20 150333 15 45100 4.5 25055 2.5 25055 2.5 5011 0.5 100.00 1000000 Percentage (%) 0.37 0.13 0.10 0.03 0.02 0.02 0.003 0.672 Homogeneous Material Level Percentage (%) PPM 75.0 744493 10 0 10.0 101322 10.0 101322 3.0 30837 2.0 22026 100.00 1000000 Percentage (%) 0.50 0 07 0.07 0.07 0.02 0.01 0.68 PPM Percentage (%) 100.00 PPM PPM 17575 5064 894 23533 Bond Wires Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# Weight (g) 7440-57-5 7440-05-3 9.90 E-05 1.00 E-06 1.00 E-04 Component Level PPM 2949 30 2979 Chip Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 1.30 E-03 Component Level PPM 38726 Die Attach Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# Weight (g) 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 6.22 E-04 2.49 E-05 2.49 E-05 2.49 E-05 2.49 E-05 2.49 E-05 2.49 E-05 2.49 E-05 4.16 E-06 8.00 E-04 Component Level PPM 18519 741 741 741 741 741 741 741 124 23831 Die Coat Description Other inorganic materials Other organic materials Other organic materials Others Other organic materials Other organic materials Other inorganic materials Subtotal Substance Silica Bis/Naphtalene Epoxy Resin Organic Acid Anhydride Additives Bis A Epoxy Resin Phenolic Resin Carbon Black CAS# Weight (g) 60676-86-0 27610-48-6 Proprietary Proprietary 25068-38-6 Proprietary 1333-86-4 1.24 E-04 4.50 E-05 3.39 E-05 1.02 E-05 5.65 E-06 5.65 E-06 1.13 E-06 2.26 E-04 Component Level PPM 3694 1341 1010 303 168 168 34 6717 Lid/ Shield Attach Description Precious metals Other organic materials Other organic materials Others Others Subtotal Substance Silver Bisphenof F type epoxy resin Bisphenof A type epoxy resin Additives Curing Agent CAS# Weight (g) 7440-22-4 9003 36 5 9003-36-5 25068-38-6 Proprietary Proprietary 1.69 E-04 2 30 E 2.30 E-05 05 2.30 E-05 7.00 E-06 5.00 E-06 2.27 E-04 Weight (g) 3.36 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level 5034 685 685 209 149 6762 1000000