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Product / Package Information
Package
Body Size (mm)
Ball Count
Terminal Finish
Environmental Information
LGA_CAV
3.76 X 4.72 X 1.0
6
Gold
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Yes
Yes
Yes
Yes
Materials Declaration
Lid/Shield
Description
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Stainless steel
Nickel & its alloys
Tin & its alloys
Subtotal
Substance
Iron
Chromium
Nickel
Manganese
Silicon
Carbon
Nitrogen
Phosphorus
Molybdenum
Sulfur
Nickel
Tin
CAS#
Weight (g)
7439-89-6
7440-47-3
7440-02-0
7439-96-5
7440-21-3
7440-44-0
7727-37-9
7723-14-0
7439-98-7
7704-34-9
7440-02-0
7440-31-5
8.55 E-03
2.37 E-03
1.05 E-03
1.41 E-04
6.73 E-05
5.00 E-06
4.40 E-06
3.20 E-06
2.60 E-06
4.00 E-07
3.62 E-04
4.53 E-04
1.30 E-02
Homogeneous Material Level
Percentage (%)
PPM
65.77
657692
18.20
182000
8.04
80400
1.09
10862
0.52
5177
0.04
385
0.03
338
0.02
246
0.02
200
0.003
31
2.785
27854
3.482
34815
100.0
1000000
Percentage (%)
25.47
7.05
3.11
0.42
0.20
0.01
0.01
0.01
0.01
0.001
1.079
1.348
38.726
Homogeneous Material Level
Percentage (%)
PPM
Percentage (%)
Component Level
PPM
254695
70481
31135
4206
2005
149
131
95
77
12
10787
13482
387256
Laminate
Description
Composite
Composite
Composite
Composite
Composite
Composite
Other organic materials
Other inorganic materials
Other inorganic materials
Other organic materials
Other inorganic materials
Other inorganic materials
Other organic materials
Copper & its alloys
Nickel & its alloys
P i
Precious
Metals
M t l
Subtotal
Substance
CAS#
Weight (g)
Component Level
PPM
Fibrous glass-wool
Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane
Triazine
Phenolic Polymer Resin
Aluminium hydroxide
Laminate Subtotal
Cured resin
Barium sulfate
Talc
Copper phthalocyanine blue
Silicon dioxide
Aluminium compounds
Solder Mask Subtotal
Copper
Nickel
Gold
G ld
Proprietary
7.45 E-03
43.52
435219
22.20
222047
Proprietary
7440-50-8
7440-02-0
7440-57-5
7440 57 5
5.31 E-03
3.17 E-03
1.02 E-03
1
75 E
04
1.75
E-04
1.71 E-02
31.00
18.49
5.97
1
1.02
02
100.00
310037
184854
59672
10218
1000000
15.82
9.43
3.04
0.52
0
52
51.02
158179
94312
30444
5213
510195
Substance
CAS#
Weight (g)
7440-50-8
7440-02-0
7440-57-5
5.90 E-04
1.70 E-04
3.00 E-05
7.90 E-04
Solder Land
Description
Copper & its alloys
Nickel & its alloys
Precious Metals
Subtotal
Copper
Nickel
Gold
Homogeneous Material Level
Percentage (%)
PPM
74.68
746835
21.52
215190
3.80
37975
100.00
1000000
Percentage (%)
1.76
0.51
0.09
2.35
Component Level
Homogeneous Material Level
Percentage (%)
PPM
99
990000
1
10000
100
1000000
Percentage (%)
0.29
0.003
0.298
Homogeneous Material Level
Percentage (%)
PPM
100
1000000
Percentage (%)
3.87
Homogeneous Material Level
Percentage (%)
PPM
77.71
777100
3.11
31100
3.11
31100
3.11
31100
3.11
31100
3.11
31100
3.11
31100
3.11
31100
0.52
5200
100.00
1000000
Percentage (%)
1.85
0.07
0.07
0.07
0.07
0.07
0.07
0.07
0.01
2 38
2.38
Homogeneous Material Level
Percentage (%)
PPM
549889
55
199557
20
150333
15
45100
4.5
25055
2.5
25055
2.5
5011
0.5
100.00
1000000
Percentage (%)
0.37
0.13
0.10
0.03
0.02
0.02
0.003
0.672
Homogeneous Material Level
Percentage (%)
PPM
75.0
744493
10 0
10.0
101322
10.0
101322
3.0
30837
2.0
22026
100.00
1000000
Percentage (%)
0.50
0 07
0.07
0.07
0.02
0.01
0.68
PPM
Percentage (%)
100.00
PPM
PPM
17575
5064
894
23533
Bond Wires
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
Weight (g)
7440-57-5
7440-05-3
9.90 E-05
1.00 E-06
1.00 E-04
Component Level
PPM
2949
30
2979
Chip
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
1.30 E-03
Component Level
PPM
38726
Die Attach
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
Weight (g)
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
6.22 E-04
2.49 E-05
2.49 E-05
2.49 E-05
2.49 E-05
2.49 E-05
2.49 E-05
2.49 E-05
4.16 E-06
8.00 E-04
Component Level
PPM
18519
741
741
741
741
741
741
741
124
23831
Die Coat
Description
Other inorganic materials
Other organic materials
Other organic materials
Others
Other organic materials
Other organic materials
Other inorganic materials
Subtotal
Substance
Silica
Bis/Naphtalene Epoxy Resin
Organic Acid Anhydride
Additives
Bis A Epoxy Resin
Phenolic Resin
Carbon Black
CAS#
Weight (g)
60676-86-0
27610-48-6
Proprietary
Proprietary
25068-38-6
Proprietary
1333-86-4
1.24 E-04
4.50 E-05
3.39 E-05
1.02 E-05
5.65 E-06
5.65 E-06
1.13 E-06
2.26 E-04
Component Level
PPM
3694
1341
1010
303
168
168
34
6717
Lid/ Shield Attach
Description
Precious metals
Other organic materials
Other organic materials
Others
Others
Subtotal
Substance
Silver
Bisphenof F type epoxy resin
Bisphenof A type epoxy resin
Additives
Curing Agent
CAS#
Weight (g)
7440-22-4
9003 36 5
9003-36-5
25068-38-6
Proprietary
Proprietary
1.69 E-04
2 30 E
2.30
E-05
05
2.30 E-05
7.00 E-06
5.00 E-06
2.27 E-04
Weight (g)
3.36 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
5034
685
685
209
149
6762
1000000