Features • • • • • • • • • • • • • • • First-in First-out Dual Port Memory 16384 bits x 9 Organization Fast Flag and Access Times: 15, 30 ns Wide Temperature Range: - 55°C to + 125°C Fully Expandable by Word Width or Depth Asynchronous Read/Write Operations Empty, Full and Half Flags in Single Device Mode Retransmit Capability Bi-directional Applications Battery Back-up Operation: 2V Data Retention TTL Compatible Single 5V ± 10% Power Supply No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm2 Tested up to a Total Dose of 30 krads (Si) according to MIL STD 883 Method 1019 Quality grades: QML Q and V with SMD 5962-93177 and ESCC with specification 9301/048 Rad. Tolerant High Speed 16 Kb x 9 Parallel FIFO Description The M67206H implements a first-in first-out algorithm, featuring asynchronous read/write operations. The FULL and EMPTY flags prevent data overflow and underflow. The Expansion logic allows unlimited expansion in word size and depth with no timing penalties. Twin address pointers automatically generate internal read and write addresses, and no external address information is required. Address pointers are automatically incremented with the write pin and read pin. The 9 bits wide data are used in data communications applications where a parity bit for error checking is necessary. The Retransmit pin resets the Read pointer to zero without affecting the write pointer. This is very useful for retransmitting data when an error is detected in the system. M67206H Using an array of eight transistors (8T) memory cell, the M67206H combines an extremely low standby supply current (typ = 0.1 µA) with a fast access time at 15 ns over the full temperature range. All versions offer battery backup data retention capability with a typical power consumption at less than 2 µW. The M67206H is processed according to the methods of the latest revision of the MIL PRF 38535 (Q and V) or ESCC 9000. Rev. 4143J–AERO–04/07 1 Block Diagram Pin Configuration DIL ceramic 28-pin 300 mils FP 28-pin 400 mils 2 M67206H 4143J–AERO–04/07 M67206H Pin Description Names Description I0-8 Inputs Q0-8 Outputs W Write Enable R Read Enable RS Reset EF Empty Flag FF Full Flag XO/HF Expansion Out/Half-Full Flag XI Expansion IN FL/RT First Load/Retransmit VCC Power Supply GND Ground Data In (I0 - I8) Data inputs for 9-bit data Reset (RS) Reset occurs whenever the Reset (RS) input is taken to a low state. Reset returns both internal read and write pointers to the first location. A reset is required after power-up before a write operation can be enabled. Both the Read Enable (R) and Write Enable (W) inputs must be in the high state during the period shown in Figure 1 (i.e. tRSS before the rising edge of RS) and should not change until tRSR after the rising edge of RS. The Half-Full Flag (HF) will be reset to high After Reset (RS) Figure 1. Reset Notes: 1. EF, FF and HF may change status during reset, but flags will be valid at tRSC. 2. W and R = VIH around the rising edge of RS. 3 4143J–AERO–04/07 Write Enable (W) A write cycle is initiated on the falling edge of this input if the Full Flag (FF) is not set. Data set-up and hold times must be maintained in the rise time of the leading edge of the Write Enable (W). Data is stored sequentially in the Ram array, regardless of any current read operation. Once half the memory is filled, and during the falling edge of the next write operation, the Half-Full Flag (HF) will be set to low and remain in this state until the difference between the write and read pointers is less than or equal to half of the total available memory in the device. The Half-Full Flag (HF) is then reset by the rising edge of the read operation. To prevent data overflow, the Full Flag (FF) will go low, inhibiting further write operations. On completion of a valid read operation, the Full Flag (FF) will go high after TRFF, allowing a valid write to begin. When the FIFO stack is full, the internal write pointer is blocked from W, so that external changes to W will have no effect on the full FIFO stack. Read Enable (R) A read cycle is initiated on the falling edge of the Read Enable (R) provided that the Empty Flag (EF) is not set. The data is accessed on a first-in/first-out basis, not including any current write operations. After Read Enable (R) goes high, the Data Outputs (Q0 - Q8) will return to a high impedance state until the next Read operation. When all the data in the FIFO stack has been read, the Empty Flag (EF) will go low, allowing the “final” read cycle, but inhibiting further read operations while the data outputs remain in a high impedance state. Once a valid write operation has been completed, the Empty Flag (EF) will go high after tWEF and a valid read may then be initiated. When the FIFO stack is empty, the internal read pointer is blocked from R, so that external changes to R will have no effect on the empty FIFO stack. First Load/Retransmit (FL/RT) This pin is a dual-purpose input. In the Depth Expansion Mode, this pin is connected to ground to indicate that it is the first loaded (see Operating Modes). In the Single Device Mode, this pin acts as the retransmit input. The Single Device Mode is initiated by connecting the Expansion In (XI) to ground. The M67206H can be set to retransmit data when the Retransmit Enable Control (RT) input is pulsed low. A retransmit operation will set the internal read point to the first location and will not affect the write pointer. Read Enable (R) and Write Enable (W) must be in the high state during retransmit. The retransmit feature is intended for use when a number of writes are equal to or less than the depth of the FIFO has occurred since the last RS cycle. The retransmit feature is not compatible with the Depth Expansion Mode and will affect the Half-Full Flag (HF), in accordance with the relative locations of the read and write pointers. Expansion In (XI) The XI input is a dual-purpose pin. Expansion In (XI) is connected to GND to indicate an operation in the single device mode. Expansion In (XI) is connected to Expansion Out (XO) of the previous device in the Depth Expansion or Daisy Chain modes. Full Flag (FF) The Full Flag (FF) will go low, inhibiting further write operations when the write pointer is one location less than the read pointer, indicating that the device is full. If the read pointer is not moved after Reset (RS), the Full Flag (FF) will go low after 16384 writes. Empty Flag (EF) The Empty Flag (EF) will go low, inhibiting further read operations when the read pointer is equal to the write pointer, indicating that the device is empty. 4 M67206H 4143J–AERO–04/07 M67206H Expansion Out/Half-Full Flag (XO/HF) The XO/HF pin is a dual-purpose output. In the single device mode, when Expansion In (XI) is connected to ground, this output acts as an indication of a half-full memory. After half the memory is filled and on the falling edge of the next write operation, the Half-Full Flag (HF) will be set to low and will remain set until the difference between the write and read pointers is less than or equal to half of the total memory of the device. The Half-Full Flag (HF) is then reset by the rising edge of the read operation. In the Depth Expansion Mode, Expansion In (XI) is connected to Expansion Out (XO) of the previous device. This output acts as a signal to the next device in the Daisy Chain by providing a pulse to the next device when the previous device reaches the last memory location. Data Output (Q0 - Q8) DATA output for 9-bit wide data. This data is in a high impedance condition whenever Read (R) is in a high state. 5 4143J–AERO–04/07 Functional Description Single Device Mode A single M67206H may be used when the application requirements are for 16384 words or less. The M67206H is in a Single Device Configuration when the Expansion In (XI) control input is grounded (see Figure 2). In this mode the Half-Full Flag (HF), which is an active low output, is shared with Expansion Out (XO). Figure 2. Block Diagram of Single 16384 bits × 9 HF (HALF-FULL FLAG) (W) WRITE (R) READ HF 9 DATAIN 9 (I) FULL FLAG (FF) RESET (RS) EXPANSION IN (XI) Width Expansion Mode DATAOUT (Q) (EF) EMPTY FLAG (RT) RETRANSMIT M67206H Word width may be increased simply by connecting the corresponding input control signals of multiple devices. Status flags (EF, FF and HF) can be detected from any device. Figure 3 demonstrates an 18-bit word width by using two M67206H. Any word width can be attained by adding additional M67206H. Figure 3. Block Diagram of 16384 bits x 18 FIFO Memory Used in Width Expansion Mode H Note: 6 Flag detection is accomplished by monitoring the FF, EF and the HF signals on either (any) device used in the width expansion configuration. Do not connect any output control signals together. M67206H 4143J–AERO–04/07 M67206H Table 1. Reset and Retransmit Single Device Configuration/Width Expansion Mode Inputs Internal Status Outputs Mode RS RT XI Read Pointer Write Pointer EF FF HF Reset 0 X 0 Location Zero Location Zero 0 1 1 Retransmit 1 0 0 Location Zero Unchanged X X X Read/Write 1 1 0 Increment(1) Increment(1) X X X Note: 1. Pointer will increment if flag is high. Table 2. Reset and First Load Truth Table Depth Expansion/Compound Expansion Mode Inputs Mode Internal Status Outputs RS FL XI Read Pointer Write Pointer EF FF Reset First Device 0 0 (1) Location Zero Location Zero 0 1 Reset All Other Devices 0 1 (1) Location Zero Location Zero 0 1 Read/Write 1 X (1) X X X X Note: 1. XI is connected to XO of previous device. See Figure 4. Depth Expansion (Daisy Chain) Mode The M67206H can be easily adapted for applications which require more than 16384 words. Figure 4 demonstrates Depth Expansion using three M67206Hs. Any depth can be achieved by adding an additional M67206H. The M67206H operates in the Depth Expansion configuration if the following conditions are met: 1. The first device must be designated by connecting the First Load (FL) control input to ground. 2. All other devices must have FL in the high state. 3. The Expansion Out (XO) pin of each device must be connected to the Expansion In (XI) pin of the next device. See Figure 4 4. External logic is needed to generate a composite Full Flag (FF) and Empty Flag (EF). This requires that all EF’s and all FFs be ORed (i.e. all must be set to generate the correct composite FF or EF). See Figure 4. 5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in the Depth Expansion Mode. Compound Expansion Module It is quite simple to apply the two expansion techniques described above together to create large FIFO arrays (see Figure 5). 7 4143J–AERO–04/07 Bi-directional Mode Applications which require data buffering between two systems (each system being capable of Read and Write operations) can be created by coupling M67206H as shown in Figure 6. Care must be taken to ensure that the appropriate flag is monitored by each system (i.e. FF is monitored on the device on which W is in use; EF is monitored on the device on which R is in use). Both Depth Expansion and Width Expansion may be used in this mode. Data Flow – Through Modes Two types of flow-through modes are permitted: a read flow-through and a write flowthrough mode. In the read flow-through mode (Figure 17) the FIFO stack allows a single word to be read after one word has been written to an empty FIFO stack. The data is enabled on the bus at (tWEF + tA) ns after the leading edge of W which is known as the first write edge and remains on the bus until the R line is raised from low to high, after which the bus will go into a three-state mode after tRHZ ns. The EF line will show a pulse indicating temporary reset and then will be set. In the interval in which R is low, more words may be written to the FIFO stack (the subsequent writes after the first write edge will reset the Empty Flag); however, the same word (written on the first write edge) presented to the output bus as the read pointer will not be incremented if R is low. On toggling R, the remaining words written to the FIFO will appear on the output bus in accordance with the read cycle timings. In the write flow-through mode (Figure 18), the FIFO stack allows a single word of data to be written immediately after a single word of data has been read from a full FIFO stack. The R line causes the FF to be reset, but the W line, being low, causes it to be set again in anticipation of a new data word. The new word is loaded into the FIFO stack on the leading edge of W. The W line must be toggled when FF is not set in order to write new data into the FIFO stack and to increment the write pointer. Figure 4. Block Diagram of 49152 bits × 9 FIFO Memory (Depth Expansion) M 67206H M 67206H M 67206H 8 M67206H 4143J–AERO–04/07 M67206H Figure 5. Compound FIFO Expansion Q0 - Q8 Q9 - Q17 Q0 - Q8 M67206H R W RS Notes: M67206H I9 - I 17 I0 - I 8 I0 - I 8 Q (N-8) - QN Q9 - Q17 I9 - I17 I(N-8) - IN I(N-8) - IN 1. For depth expansion block see section on Depth Expansion and Figure 4. 2. For Flag detection see section on Width Expansion and Figure 3. Figure 6. Bi-directional FIFO Mode M 67206H M 67206H 9 4143J–AERO–04/07 Electrical Characteristics Absolute Maximum Ratings *NOTICE: Supply voltage (VCC - GND): .............................- 0.5V to 7.0V Input or Output voltage applied: (GND - 0.3V) to (Vcc + 0.3V) Storage temperature:................................. - 65 °C to + 150 °C Stresses beyond those listed under "Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Parameters DC Test Conditions TA = -55°C to + 125°C; Vss = 0V; Vcc = 4.5V to 5.5V Parameter 1. 2. 3. M67206H-15 Unit Value Operating supply current 110 120 mA Max ICCSB (2) Standby supply current 5 5 mA Max ICCPD (3) Power down current 400 400 µA Max Icc measurements are made with outputs open. R = W = RS = FL/RT = VIH. All input = Vcc. Description M67206H Unit Value ILI (1) Input leakage current ±1 µA Max ILO (2) Output leakage current ±1 µA Max VIL (3) Input low voltage 0.8 V Max VIH(3) Input high voltage 2.2 V Min VOL (4) Output low voltage 0.4 V Max VOH(4) Output high voltage 2.4 V Min C IN (5) Input capacitance 8 pF Max Output capacitance 8 pF Max C OUT(5) 10 M67206H-30 ICCOP (1) Parameter 1. 2. 3. 4. 5. Description 0.4 ≤ Vin ≤ Vcc. R = VIH, 0.4 ≤ VOUT ≤ VCC. VIH max = Vcc + 0.3 V. VIL min = -0.3V or -1V pulse width 50 ns. For XI input, VIH = 2.8V Vcc min, IOL = 8 mA, IOH = -2 mA. Guaranteed but not tested. M67206H 4143J–AERO–04/07 M67206H AC Test Conditions Input pulse levels: Gnd to 3.0V Output reference levels: 1.5V Input rise/Fall times: 5 ns Output load: See Figure 7 Input timing reference levels: 1.5V Figure 7. Output Load Table 3. AC Test Conditions Symbol (1) Symbol (2) M67206H- 15 M67206H- 30 (4) Min Max Min Max Read cycle time 25 – 40 – ns Access time – 15 – 30 ns Parameter (3) Unit Read Cycle TRLRL tRC TRLQV tA TRHRL tRR Read recovery time 10 – 10 – ns TRLRH tRPW Read pulse width (5) 15 – 30 – ns TRLQX tRLZ Read low to data low Z (6) 0 – 0 – ns TWHQX tWLZ Write low to data low Z (6) (7) 3 – 5 – ns TRHQX tDV Data valid from read high 5 – 5 – ns TRHQZ tRHZ Read high to data high Z(6) – 15 – 20 ns TWLWL tWC Write cycle time 25 – 40 – ns TWLWH tWPW Write pulse width(5) 15 – 30 – ns TWHWL tWR Write recovery time 10 – 10 – ns TDVWH tDS Data set-up time 9 – 18 – ns TWHDX tDH Data hold time 0 – 0 – ns Reset cycle time 25 – 40 – ns Reset pulse width (5) 15 – 30 – ns Write Cycle Reset Cycle TRSLWL tRSC TRSLRSH tRS 11 4143J–AERO–04/07 Table 3. AC Test Conditions (Continued) Symbol (1) Symbol (2) Parameter (3) (4) M67206H- 15 M67206H- 30 Min Max Min Max Unit TWHRSH tRSS Reset set-up time 20 – 30 – ns TRSHWL tRSR Reset recovery time 10 – 10 – ns TRTLWL tRTC Retransmit cycle time 25 – 40 – ns TRTLRTH tRT Retransmit pulse width(5) 15 – 30 – ns TWHRTH tRTS Retransmit set-up time(6) 15 – 30 – ns TRTHWL tRTR Retransmit recovery time 10 – 10 – ns TRSLEFL tEFL Reset to EF low – 25 – 30 ns TRSLFFH tHFH, tFFH Reset to HF/FF high – 25 – 30 ns TRLEFL tREF Read low to EF low – 25 – 30 ns TRHFFH tRFF Read high to FF high – 25 – 30 ns TEFHRH tRPE Read width after EF high 15 – 30 – ns TWHEFH tWEF Write high to EF high – 15 – 30 ns TWLFFL tWFF Write low to FF low – 20 – 30 ns TWLHFL tWHF Write low to HF low – 30 – 30 ns TRHHFH tRHF Read high to HF high – 30 – 30 ns TFFHWH tWPF Write width after FF high 15 – 30 – ns TWLXOL tXOL Read/Write to XO low – 15 – 30 ns TWHXOH tXOH Read/Write to XO high – 15 – 30 ns TXILXIH tXI XI pulse width 15 – 30 – ns TXIHXIL tXIR XI recovery time 10 – 10 – ns TXILRL tXIS XI set-up time 10 – 10 – ns Retransmit Cycle Flags Expansion 1. 2. 3. 4. 5. 6. 7. 12 STD symbol. ALT symbol. Timings referenced as in AC test conditions. All parameters tested only. Pulse widths less than minimum value are not allowed. Values guaranteed by design, not currently tested. Only applies to read data flow-through mode. M67206H 4143J–AERO–04/07 M67206H Figure 8. Asynchronous Write and Read Operation Figure 9. Full Flag from Last Write to First Read Figure 10. Empty Flag from Last Read to First Write 13 4143J–AERO–04/07 Figure 11. Retransmit Figure 12. Empty Flag Timing Figure 13. Full Flag Timing 14 M67206H 4143J–AERO–04/07 M67206H Figure 14. Half Full Flag Timing Figure 15. Expansion Out Figure 16. Expansion In 15 4143J–AERO–04/07 Figure 17. Read Data Flow – Through Mode Figure 18. Write Data Flow – Through Mode 16 M67206H 4143J–AERO–04/07 M67206H Ordering Information Temperature Range Speed Package Quality Flow MMCP-67206HV-15-E(1) 25°C 15 ns SB28.3 Engineering Samples SMCP-67206HV-15SCC -55 to +125°C 15 ns SB28.3 ESCC SMCP-67206HV-30SCC -55 to +125°C 30 ns SB28.3 ESCC 5962-9317708QTC -55 to +125°C 15 ns SB28.3 QML Q 5962-9317707QTC -55 to +125°C 30 ns SB28.3 QML Q 5962-9317708VTC -55 to +125°C 15 ns SB28.3 QML V 5962D9317708VTC -55 to +125°C 15 ns SB28.3 QML V RHA 5962D9317707VTC -55 to +125°C 30 ns SB28.3 QML V RHA 5962-9317707VTC -55 to +125°C 30 ns SB28.3 QML V 25°C 15 ns FP28.4 Engineering Samples SMDP-67206HV-15SCC -55 to +125°C 15 ns FP28.4 ESCC SMDP-67206HV-30SCC -55 to +125°C 30 ns FP28.4 ESCC 5962-9317708QNC -55 to +125°C 15 ns FP28.4 QML Q 5962-9317707QNC -55 to +125°C 30 ns FP28.4 QML Q 5962-9317708VNC -55 to +125°C 15 ns FP28.4 QML V 5962-9317707VNC -55 to +125°C 30 ns FP28.4 QML V 5962D9317708VNC -55 to +125°C 15 ns FP28.4 QML V RHA 5962D9317707VNC -55 to +125°C 30 ns FP28.4 QML V RHA MM0 -67206HV-15SV(1) -55 to +125°C 15 ns Die QML V 25°C 15 ns Die Engineering Samples Part Number MMDP-67206HV-15-E MM067206HV-15-E(1) Note: 1. Contact Atmel for availability. 17 4143J–AERO–04/07 Package Drawings 28-lead Side Braze (300 Mils) 18 M67206H 4143J–AERO–04/07 28-lead Flat Pack (400 Mils) 19 M67206H 4143J–AERO–04/07 Atmel Headquarters Atmel Operations Corporate Headquarters Memory 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 487-2600 Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimhatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany TEL (49) 71-31-67-0 FAX (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France TEL (33) 2-40-18-18-18 FAX (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France TEL (33) 4-42-53-60-00 FAX (33) 4-42-53-60-01 1150 East Cheyenne Mtn. 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The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems. ©2007 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, and Everywhere You Are® are the trademarks or registered trademarks, of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 4143J–AERO–04/07 /xM