Data Sheet Precision Rail-to-Rail Input and Output Operational Amplifier OP284CHIPS FEATURES OP284 CHIP DIMENSIONS AND PAD LAYOUT Rail-to-rail output Gain bandwidth product: 4 MHz typical Low offset voltage: 175 μV Unity-gain stable High slew rate: 4.0 V/μs typical Low noise: 3.9 nV/√Hz typical 63.9 mils V+ OUT A GENERAL DESCRIPTION OUT B The OP284 die is available only through this specification. –IN A 90.6 mils The OP284 is a dual operational amplifier, featuring a 4 MHz bandwidth and rail-to-rail inputs and outputs. It is guaranteed to operate in single-supply from 3 V to 36 V, or dual-supply from ±1.5 V to ±18 V. +IN A This amplifier is superb for single-supply applications requiring both ac and precision dc performance. The combination of wide bandwidth, low noise, and precision makes the OP284 useful in a wide variety of applications, including filters and instrumentation. For application information, please refer to the OP284 package product data sheet and webpage. –IN B V– +IN B 12642-001 The OP284CHIPS die is specified for 25°C operations only. Figure 1. OP284 Metal Mask Die Image Table 1. Die Physical Characteristics Parameter Die Size Back Grind Thickness Bond Pad Opening Size Top Metal Composition Passivation Polyimide Die Marker Substrate Bias Rev. A Value 63.9 mils × 90.6 mils 19 mils 104 μm × 104 μm AlCu OxyNitride 21 μm 1446Y V- Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibilityis assumedby Analog Devices for its use, nor for anyinfringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. 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Technical Support www.analog.com OP284CHIPS Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Absolute Maximum Ratings ............................................................4 General Description ......................................................................... 1 ESD Caution...................................................................................4 OP284 Chip Dimensions and Pad Layout..................................... 1 Outline Dimensions ..........................................................................5 Revision History ............................................................................... 2 Die Pad Descriptions ....................................................................5 Specifications..................................................................................... 3 Ordering Guide .............................................................................5 Electrical Characteristics, VSY = ±15.0 V................................... 3 REVISION HISTORY 12/14—Rev. 0 to Rev. A Changes to Table 4 ............................................................................ 5 9/14—Revision 0: Initial Version Rev. A | Page 2 of 5 Data Sheet OP284CHIPS SPECIFICATIONS ELECTRICAL CHARACTERISTICS, VSY = ±15.0 V VSY = ±15.0 V, VCM = 0 V, VOUT = 0 V, TA = +25°C, unless otherwise noted. Table 2. Parameter INPUT CHARACTERISTICS Offset Voltage Offset Voltage Drift Input Bias Current Input Offset Current Input Voltage Range Common-Mode Rejection Ratio Large Signal Voltage Gain OUTPUT CHARACTERISTICS Output Voltage High Output Voltage Low Short-Circuit Current POWER SUPPLY Power Supply Rejection Ratio Supply Current per Amplifier DYNAMIC PERFORMANCE Slew Rate Gain Bandwidth Product Phase Margin NOISE PERFORMANCE Voltage Noise Voltage Noise Density Current Noise Density Symbol Test Conditions/Comments Min VOS ΔVOS/ΔT IB IOS Typ Max Unit 175 μV μV/°C nA nA V dB V/mV 0.3 −15 80 150 CMRR AVO VCM = −15.0 V to +15.0 V −10.0 V ≤ VO ≤ +10.0 V, RL = 2 kΩ VOH VOL IOUT IL = 1.0 mA IL = 1.0 mA PSRR ISY VSY = ±2 V to ±18 V VO = 0 V 90 SR GBP ΦM RL = 2 kΩ 2.4 en p-p en in 0.1 Hz to 10 Hz f = 1 kHz 150 50 +15 90 1000 14.8 −10 Rev. A | Page 3 of 5 −14.875 +10 V V mA 2.0 dB mA 4.0 4.25 50 V/µs MHz Degrees 0.3 3.9 0.4 µV p-p nV/√Hz pA/√Hz OP284CHIPS Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Supply Voltage Input Voltage Differential Input Voltage1 Output Short-Circuit Duration to GND Functional Temperature Range 1 Rating ±18 V V− ≤ VIN ≤ V+ ±0.6 V Indefinite −40°C to +125°C Limit the input current to less than 5 mA to prevent degradation or destruction of the input devices. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION Rev. A | Page 4 of 5 Data Sheet OP284CHIPS OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS Die center is the reference location at 0.0 μm × 0.0 μm. Pad coordinates are to the center of each pad. Waffle pack orientation is the chamfer corner to the OUTA pad. Table 4. Pad Mnemonics, Function Descriptions, and Coordinates Mnemonic OUTA −INA +INA V− Pad +INB −INB OUTB V+ NC NC Description Output of Channel A. Negative Input Channel A. Positive Input Channel A. Negative Power Supply. Substrate is connected to V−. Positive Input Channel B. Negative Input Channel B. Output Channel B. Positive Power Supply. No Connect—Factory Use Only. No Connect—Factory Use Only. Pad Coordinates (μm) −660 × +780 −608 × +149 −608 × −107 −662 × −780 +590 × −800 +586 × −424 570 × 437 590 × 802 −664 × −490 524 × 0 ORDERING GUIDE Model OP284CHIPS Functional Temperature Range −40°C to +125°C Package Option/Count Waffle Pack/221 ©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12642-0-12/14(A) Rev. A | Page 5 of 5 Package Option DIE