PCF8883
Capacitive touch/proximity switch with auto-calibration, large
voltage operating range, and very low power consumption
Rev. 4 — 17 March 2014
Product data sheet
1. General description
The integrated circuit PCF8883 is a capacitive touch and proximity switch that uses a
patented (EDISEN) digital method to detect a change in capacitance on a remote sensing
plate. Changes in the static capacitance (as opposed to dynamic capacitance changes)
are automatically compensated using continuous auto-calibration. Remote sensing plates
(e.g. conductive foil) can be connected directly to the IC1 or remotely using a coaxial
cable.
2. Features and benefits
Dynamic proximity switch
Digital processing method
Adjustable sensitivity, can be made very high
Adjustable response time
Wide input capacitance range (10 pF to 60 pF)
Automatic calibration
A large distance (several meters) between the sensing plate and the IC is possible
Open-drain output (P-type MOSFET, external load between pin and ground)
Designed for battery powered applications (IDD = 3 A, typical)
Output configurable as push-button, toggle, or pulse
Wide voltage operating range (VDD = 3 V to 9 V)
Large temperature operating range (Tamb = 40 C to +85 C)
Internal voltage regulator
Available in SOIC8 and wafer level chip-size package
3. Applications
Proximity detection
Proximity sensing in
Mobile phones
Portable entertainment units
Switch for medical applications
Switch for use in explosive environments
Vandal proof switches
Transportation: Switches in or under upholstery, leather, handles, mats, and glass
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 21.
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
Buildings: switch in or under carpets, glass, or tiles
Sanitary applications: use of standard metal sanitary parts (e.g. tap) as switch
Hermetically sealed keys on a keyboard
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCF8883T
SOIC8
plastic small outline package; 8 leads;
body width 3.9 mm
PCF8883T
PCF8883US
WLCSP8
wafer level chip-size package; 8 bumps
PCF8883US
4.1 Ordering options
Table 2.
Ordering options
Product type number
Orderable part number Sales item
(12NC)
Delivery form
IC
revision
PCF8883T/1
PCF8883T/1,118
935289766118
tape and reel, 13 inch
1
PCF8883US/7EA/1
PCF8883US/7EA/1Y
935300777518
dry pack, tape and reel, 13 inch
1
5. Marking
Table 3.
PCF8883
Product data sheet
Marking codes
Product type number
Marking code
PCF8883T
PCF8883
PCF8883US
PC
8883-1
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
6. Block diagram
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Fig 1.
PCF8883
Product data sheet
Block diagram of PCF8883
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
7. Pinning information
7.1 Pinning
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Top view. For mechanical details, see Figure 17.
Fig 2.
Pin configuration of PCF8883T (SOIC8)
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Viewed from active side. For mechanical details, see Figure 18.
Fig 3.
Pin configuration of PCF8883US (bare die)
7.2 Pin description
Table 4.
Pin description
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
Symbol
Product data sheet
Type
Description
PCF8883T
PCF8883US
IN
1
1
analog input/output sensor input
TYPE
2
2
input
CPC
3
3
analog input/output sensitivity setting
4
4
supply
ground supply voltage
VDD
5
5
supply
supply voltage
OUT
6
6
output
switch output
CLIN
7
7
analog input/output sampling rate setting
VDD(INTREGD)[2] 8
8
supply
VSS
PCF8883
Pin
[1]
pin OUT behavior
configuration input
internal regulated supply
voltage output
[1]
The substrate (rear side of the die) is connected to VSS and should be electrically isolated.
[2]
The internal regulated supply voltage output must be decoupled with a decoupling capacitor to VSS.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
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4 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
8. Functional description
Figure 4 and Figure 5 show the functional principle of the PCF8883.
The discharge time (tdch) of a chip-internal RC timing circuit, to which the external sensing
plate is connected via pin IN, is compared to the discharge time (tdch(ref)) of a second
chip-internal reference RC timing circuit. Both RC timing circuits are periodically charged
from VDD(INTREGD) via identical switches and then discharged via a resistor to ground
(VSS). Both switches are synchronized.
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Fig 4.
Functional diagram of the sensor logic
The charge-discharge cycle is governed by the sampling rate (fs). If the voltage of one of
the RC timing circuits falls below the internal reference voltage Vref, the respective
comparator output becomes LOW. The logic following the comparators determines which
comparator switches first. If the upper (reference) comparator switches, then a pulse is
given on CUP. If the lower (input) comparator switches first, then a pulse is given on CDN
(see Figure 4).
The pulses control the charge on the external capacitor CCPC on pin CPC. Every time a
pulse is given on CUP, capacitor CCPC is charged from VDD(INTREGD) for a fixed time
causing the voltage on CCPC to rise. Likewise when a pulse occurs on CDN, capacitor
CCPC is connected to a current sink to ground for a fixed time causing the voltage on CCPC
to fall.
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
If the capacitance on pin IN increases, the discharge time tdch increases too. Therefore it
takes longer for the voltage on the corresponding comparator to drop below Vref. Only
once this happens, the comparator output becomes LOW and this results in a pulse on
CDN discharging the external capacitor CCPC slightly. Thus most pulses will now be given
by CUP. Without further action, capacitor CCPC would then fully charge.
However, a chip-internal automatic calibration mechanism that is based on a voltage
controlled sink current (Isink) connected to pin IN attempts to equalize the discharge time
tdch with the internal reference discharge time tdch(ref). The current source is controlled by
the voltage on CCPC which causes the capacitance on pin IN to be discharged more
quickly in the case that the voltage on CCPC is rising, thereby compensating for the
increase in capacitance on input pin IN. This arrangement constitutes a closed-loop
control system that constantly attempts to equalize the discharge time tdch with tdch(ref).
This allows compensating for slow changes in capacitance on input pin IN. Fast changes
due to an approaching hand for example will not be compensated. In the equilibrium state,
the discharge times are equal and the pulses alternate between CUP and CDN.
From this also follows, that an increase in capacitor value CCPC results in a smaller
voltage change per pulse CUP or CDN. Thus the compensation due to internal current
sink source Isink is slower and therefore the sensitivity of the sensor increases. Likewise a
decrease in capacitor CCPC results in a lower sensitivity. (For further information see
Section 14.)
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CSENS = sensing plate capacitance.
RC = external discharge (pull-down) resistor.
RF = low pass filter resistor.
CF = low pass filter capacitor.
Fig 5.
Functional principle of the PCF8883
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
The counter, following the sensor logic depicted in Figure 4, counts the pulses of CUP or
CDN respectively. The counter is reset every time the pulse sequence changes from CUP
to CDN or the other way around. Pin OUT will only be activated when enough consecutive
CUP or CDN pulses occur. Low-level interference or slow changes in the input
capacitance do not cause the output to switch.
Various measures, such as asymmetrical charge and discharge steps, are taken to
ensure that the output switches off correctly. A special start-up circuit ensures that the
device reaches equilibrium quickly when the supply is attached.
Pin OUT is an open-drain output capable of pulling an external load Rext (at maximum
current of 20 mA) up to VDD. The load resistor must be dimensioned appropriately, taking
the maximum expected VDD voltage into account. The output is automatically deactivated
(short circuit protection) for loads in excess of 30 mA. Pin OUT can also drive a CMOS
input without connection of the external load.
A small internal 150 nA current sink Isink enables a full voltage swing to take place on pin
OUT, even if no load resistor is connected. This is useful for driving purely capacitive
CMOS inputs. The falling slope can be fairly slow in this mode, depending on load
capacitance.
The sampling rate (fs) corresponds to half of the frequency used in the RC timing circuit.
The sampling rate can be adjusted within a specified range by selecting the value of
CCLIN. The oscillator frequency is internally modulated by 4 % using a pseudo random
signal. This prevents interference caused by local AC-fields.
8.1 Output switching modes
The output switching behavior can be selected using pin TYPE (see Figure 6).
• Push-button (TYPE connected to VSS): The output OUT is active as long as the
capacitive event2 lasts.
• Toggle (TYPE connected to VDD(INTREGD)): The output OUT is activated by the first
capacitive event and deactivated by a following capacitive event.
• Pulse (CTYPE connected between TYPE and VSS): The output OUT is activated for a
defined time at each capacitive event. The pulse duration is determined by the value
of CTYPE and is approximately 2.5 ms/nF.
A typical value for CTYPE is 4.7 nF which results in an output pulse duration of about
10 ms. The maximum value of CTYPE is 470 nF which results in a pulse duration of
about 1 s. Capacitive events are ignored that occur during the time the output is active.
Figure 6 illustrates the switching behavior for the output switching modes. Additionally the
graph illustrates, that short-term disturbances on the sensor are suppressed by the circuit.
2.
A capacitive event is a dynamic increase of capacitance at the sensor input pin IN.
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
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Fig 6.
Switching modes timing diagram of PCF8883
8.2 Voltage regulator
The PCF8883 implements a chip-internal voltage regulator supplied by pin VDD that
provides an internal supply (VDD(INTREGD)) limited to a maximum of 4.6 V. The lock-in
voltage Vlockin on VDD is typically 4.0 V. Figure 7 shows the relationship between VDD and
VDD(INTREGD).
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PCF8883
Product data sheet
Integrated voltage regulator
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
9. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
CAUTION
Semiconductors are light sensitive. Exposure to light sources can cause the IC to
malfunction. The IC must be protected against light. The protection must be applied to all
sides of the IC.
10. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VDD
supply voltage
VI
input voltage
IO
output current
ISS
ground supply current
II
input current
Ptot
total power dissipation
Max
Unit
0.5 +9
V
on pins IN, TYPE, CPC
0.5 VDD(INTREGD) + 0.5
V
on pin OUT
10
+50
mA
10
+50
mA
10
+10
mA
on any other pin
-
100
mW
HBM
-
2500
V
MM
[2]
-
200
V
latch-up current
[3]
-
100
mA
Tstg
storage temperature
[4]
60
+125
C
Tamb
ambient temperature
40
+85
C
Ilu
Product data sheet
Min
[1]
VESD
PCF8883
Conditions
electrostatic discharge
voltage
operating device
[1]
Pass level; Human Body Model (HBM) according to Ref. 9 “JESD22-A114”.
[2]
Pass level; Machine Model (MM), according to Ref. 10 “JESD22-A115”.
[3]
Pass level; latch-up testing, according to Ref. 11 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the store and transport requirements (see Ref. 14 “UM10569”) the devices have to be stored
at a temperature of +8 C to +45 C and a humidity of 25 % to 75 %.
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Rev. 4 — 17 March 2014
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PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
11. Static characteristics
Table 6.
Static characteristics
VDD = 5 V, Tamb = +25 C; unless otherwise specified.
Symbol
VDD
VDD(INTREGD)
Parameter
Conditions
supply voltage
Unit
10 pF Ci 40 pF;
40 C Tamb +85 C
3.0
-
9.0
V
10 pF Ci 35 pF;
20 C Tamb +85 C
[2]
2.8
-
9.0
V
3.0
4.0
4.6
V
-
10
50
mV
-
3
5
A
3.5
internal regulated supply voltage
VDD(INTREGD) internal regulated supply voltage
variation
supply current
IDD
Min Typ Max
[1]
regulator voltage drop
idle state; fs = 1 kHz
[3]
VDD = 5.0 V
VDD = 3.0 V
Isink
sink current
internal constant current to VSS
VO
output voltage
on pin OUT; pull-up voltage
output current
IO
P-MOS
[4]
short circuit protection
VO 0.6 V
Vsat
saturation voltage
VDD = 3.0 V
decoupling capacitance
VI(CPC)
input voltage on pin CPC
2.2
150 -
nA
0
VDD 9.0
V
0
10
20
mA
20
30
50
mA
0.1
0.2
0.4
V
0.1
0.3
on pin OUT; IO = +10 mA
VDD = 5.0 V
Cdec
A
-
on pin VDD(INTREGD)
[5]
0.5
V
100 -
220
nF
0.6
VDD(INTREGD) 0.5 V
-
[1]
Alternatively an external discharge resistor RC can be used (see Section 14).
[2]
Tested on sample basis.
[3]
Idle state is the steady state after completed power-on without any activity on the sensor plate and the voltage on the reservoir capacitor
CCPC settled.
[4]
For reliability reasons, the average output current must be limited to 4.6 mA at 70 C and 3.0 mA at 85 C.
[5]
External ceramic chip capacitor recommended (see Figure 16).
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
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PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
12. Dynamic characteristics
Table 7.
Dynamic characteristics
VDD = 5 V, CCLIN = 22 pF, CCPC = 470 nF, Tamb = +25 C; unless otherwise specified.
Symbol
Parameter
Conditions
CCLIN
capacitance on pin CLIN
CCPC
capacitance on pin CPC
Min
Typ
Max
Unit
0
22
100
pF
90
470
2500
nF
-
14
-
bit
0.1
-
470
nF
VDD = 5.0 V
10
-
60
pF
Tamb = 40 C to +85 C;
VDD = 3.0 V
10
-
40
pF
X7R ceramic chip capacitor
Nres(dig)eq equivalent digital resolution
CTYPE
capacitance on pin TYPE
Ci
input capacitance
sensing plate and connecting cable
tstartup
start-up time
until normal operation is established
-
0.5
-
s
tp
pulse duration
on pin OUT;
in pulse mode;
CTYPE 10 nF
-
2.5
-
ms/nF
fs
sampling frequency
CCLIN = 0 pF
-
3.3
-
kHz
tsw
switching time
CCLIN = 22 pF (typical value)
-
1
-
kHz
CCLIN = 100 pF
-
275
-
Hz
at fs = 1 kHz
-
64
-
ms
13. Characteristic curves
13.1 Power consumption
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Idle state; fs = 1 kHz; Tamb = 25 C.
Fig 8.
PCF8883
Product data sheet
IDD with respect to VDD
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PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
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Idle state; fs = 1 kHz.
Fig 9.
IDD with respect to temperature
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Fig 10. IDD with respect to sampling frequency (fs)
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
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12 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
13.2 Typical reaction time
DDN
WVZ
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VDD = 6 V; Tamb = 25 C.
Fig 11. Switching time (tsw) with respect to sampling frequency (fs)
DDN
WVZ
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VDD = 6 V; Tamb = 25 C.
Fig 12. Switching time (tsw) with respect to capacitor on pin CLIN (CCLIN)
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
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13 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
DDN
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VDD = 6 V.
Fig 13. Switching time (tsw) with respect to temperature
13.3 Reservoir capacitor voltage
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VDD = 6 V; Tamb = 25 C.
VI(CPC) = input voltage on pin CPC.
CIN = capacitor on pin IN.
Fig 14. Input voltage on pin CPC (VI(CPC)) with respect to capacitor on pin IN (CIN)
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
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14 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
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VDD = 6 V.
VI(CPC) = input voltage on pin CPC.
Fig 15. Input voltage on pin CPC (VI(CPC)) with respect to temperature
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
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PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
14. Application information
Figure 16 shows the typical connections for a general application3. The positive supply is
connected to pin VDD. It is recommended to connect smoothing capacitors to ground to
both VDD and VDD(INTREGD) (values for Cdec, see Table 6).
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The coaxial cable is optional.
Fig 16. Typical application
The sampling rate is determined by the capacitance CCLIN on pin CLIN. A higher sampling
rate reduces the reaction time and increases the current consumption.
The sensing plate capacitance CSENS may consist of a small metal area, for example
behind an isolating layer. The sensing plate can be connected to a coaxial cable (CCABLE)
which in turn is connected to the input pin IN. Alternatively, the sensing plate can be
directly connected to the input pin IN. An internal low pass filter is used to reduce RF
interference. An additional low pass filter consisting of a resistor RF and capacitor CF can
be added to the input to further improve RF immunity as required. For good performance,
the total amount of capacitance on the input (CSENS + CCABLE + CF) should be in the
proper range, the optimum point being around 30 pF. These conditions allow the control
loop to adapt to the static capacitance on CSENS and to compensate for slow changes in
the sensing plate capacitance. A higher capacitive input loading is possible if an additional
discharge resistor RC is placed as shown in Figure 16. Resistor RC simply reduces the
discharge time such that the internal timing requirements are fulfilled.
The sensitivity of the sensor can be influenced by the sensing plate area and capacitor
CCPC. The sensitivity is significantly reduced when CCPC is reduced. When maximum
sensitivity is desired CCPC can be increased, but this also increases sensitivity to
interference. Pin CPC has high-impedance and is sensitive to leakage currents.
3.
For further information, see Ref. 4 “AN10832”. Information about the appropriate evaluation board can be found in Ref. 13
“UM10370”.
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
Remark: CCPC should be a high-quality foil or ceramic capacitor, for example an
X7R type.
When limiting the maximum input capacitance to 35 pF and the minimum operating
temperature to 20 C then the minimum operating voltage can be reduced to 2.8 V. The
main limitation when lowering the supply voltage is a reduction in the range of the VI(CPC)
voltage, which is specified from 0.6 V to VDD 0.3 V. Reducing the VI(CPC) working range
is equivalent to reducing the input capacitance range. Additionally, VI(CPC) increases with
decreasing temperature, as illustrated in Figure 14 and Figure 15. This means that it is
possible to lower the supply voltage if the minimum temperature will be raised accordingly.
For the choice of proper component values for a given application, the component
specifications in Table 6 and Table 7 must be followed.
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
17 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
15. Package outline
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PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
18 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
16. Bare die outline
:/&63ZDIHUOHYHOFKLSVL]HSDFNDJHEXPSV
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Fig 18. Bare die outline of PCF8883US
Table 8.
Dimension of PCF8883US
Original dimensions are in mm.
Unit (mm)
A
A1
A2
b
D
E
max
-
-
-
-
1.19
0.89
nom
0.55
0.11
0.44
0.2
1.16
0.86
min
-
-
-
-
1.13
0.83
Table 9.
Solder bump locations
All coordinates are in m and referenced to the center of the die (see Figure 18).
PCF8883
Product data sheet
Symbol
Pin
X
Y
Type
Description
IN
1
430
280
analog input/
output
sensor input
TYPE
2
0
280
input
pin OUT behavior configuration input
CPC
3
225
0
analog input/
output
sensitivity setting
VSS
4
430
280
supply
ground supply voltage
VDD
5
430
280
supply
supply voltage
OUT
6
0
280
output
switch output
CLIN
7
225
0
analog input/
output
sampling rate setting
VDD(INTREGD) 8
430
280
supply
internal regulated supply voltage output
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
19 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
\
5()
[
DDD
Fig 19. Alignment mark of the PCF8883US die (for location and dimension see Table 10)
Table 10.
Alignment mark dimension and location
Coordinates
x
y
Location[1]
172 m
371 m
Dimension[2]
117 m
131 m
[1]
The x/y coordinates of the alignment mark location represent the position of the REF point (see Figure 19)
with respect to the center (x/y = 0) of the chip.
[2]
The x/y values of the dimensions represent the extensions of the alignment mark in direction of the
coordinate axis (see Figure 19).
17. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
18. Packing information
18.1 Tape and reel information
7239,(:
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3
:
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3
$
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.
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DDD
Fig 20. Tape and reel details for PCF8883T
Table 11. Carrier tape dimensions of PCF8883T
Nominal values without production tolerances.
Symbol
Description
Value
Unit
A0
pocket width in x direction
6.3 to 6.5
mm
B0
pocket width in y direction
5.4
mm
K0
pocket depth
2.05 to 2.1
mm
P1
pocket hole pitch
8
mm
D1
pocket hole diameter
1.5
mm
Compartments
Overall dimensions
PCF8883
Product data sheet
W
tape width
12
mm
D0
sprocket hole diameter
1.5 to 1.55
mm
P0
sprocket hole pitch
4
mm
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
21 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
7239,(:
'
3
:
7
%
3
$
;
.
GLUHFWLRQRIIHHG
SLQ
7KHGLHKDVDFWLYHVLGHIDFLQJGRZQ
SLQWRZDUGVWKHVSURFNHWKROHV
GHWDLO;
2ULJLQDOGLPHQVLRQVDUHLQPP
)LJXUHQRWGUDZQWRVFDOH
DDD
Fig 21. Tape and reel details for PCF8883US
Table 12. Carrier tape dimensions of PCF8883US
Nominal values without production tolerances.
Symbol
Description
Value
Unit
pocket width in x direction
0.96
mm
Compartments
A0
B0
pocket width in y direction
1.37
mm
K0
pocket depth
0.77
mm
tape width
8
mm
T
tape thickness
0.2
mm
D0
sprocket hole diameter
1.5
mm
P0
sprocket hole pitch
4
mm
Overall dimensions
W
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
22 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
19. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
19.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
19.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
19.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
19.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 13 and 14
Table 13.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 14.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
24 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 22. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
20. Soldering of WLCSP packages
20.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
20.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
20.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 23) than a SnPb process, thus
reducing the process window
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
25 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 15.
Table 15.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 23.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 23. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
20.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
26 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
20.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
20.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
20.3.4 Cleaning
Cleaning can be done after reflow soldering.
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
27 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
21. Abbreviations
Table 16.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
HBM
Human Body Model
IC
Integrated Circuit
MM
Machine Model
MOS
Metal Oxide Semiconductor
MOSFET
Metal–Oxide–Semiconductor Field-Effect Transistor
MSL
Moisture Sensitivity Level
PCB
Printed-Circuit Board
RC
Resistance-Capacitance
RF
Radio Frequency
SMD
Surface Mount Device
22. References
[1]
AN10365 — Surface mount reflow soldering description
[2]
AN10439 — Wafer Level Chip Size Package
[3]
AN10706 — Handling bare die
[4]
AN10832 — PCF8883 - capacitive proximity switch with auto-calibration
[5]
AN11122 — Water and condensation safe touch sensing with the NXP
capacitive touch sensors
[6]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[7]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[8]
IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices
[9]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[10] JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[11] JESD78 — IC Latch-Up Test
[12] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[13] UM10370 — PCF8883 evaluation board
[14] UM10569 — Store and transport requirements
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
28 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
23. Revision history
Table 17.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF8883 v.4
20140317
Product data sheet
-
PCF8883 v.3
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Emphasized the X7R statement (Section 14)
Added Section 9
Added Input or input/output statement in Table 4
PCF8883 v.3
20130423
Product data sheet
-
PCF8883 v.2
PCF8883 v.2
20110308
Product data sheet
-
PCF8883_1
PCF8883 v.1
20091016
Product data sheet
-
-
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
29 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
24. Legal information
24.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
24.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
24.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCF8883
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
30 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
24.4 Licenses
ICs with capacitive sensing functionality
This NXP Semiconductors IC is made under license to European Patent
No. 0723339, owned by EDISEN - SENSOR SYSTEME GmbH & CO KG
and counterparts. Any license fee is included in the purchase price.
24.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
25. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCF8883
Product data sheet
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Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
31 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
26. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9
Static characteristics . . . . . . . . . . . . . . . . . . . .10
Dynamic characteristics . . . . . . . . . . . . . . . . . . 11
Dimension of PCF8883US . . . . . . . . . . . . . . .19
Solder bump locations . . . . . . . . . . . . . . . . . . .19
Alignment mark dimension and location . . . . .20
Carrier tape dimensions of PCF8883T . . . . . .21
Carrier tape dimensions of PCF8883US . . . . .22
SnPb eutectic process (from J-STD-020D) . . .24
Lead-free process (from J-STD-020D) . . . . . .24
Lead-free process (from J-STD-020D) . . . . . .26
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .28
Revision history . . . . . . . . . . . . . . . . . . . . . . . .29
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
32 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
27. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Block diagram of PCF8883 . . . . . . . . . . . . . . . . . .3
Pin configuration of PCF8883T (SOIC8) . . . . . . . .4
Pin configuration of PCF8883US (bare die). . . . . .4
Functional diagram of the sensor logic . . . . . . . . .5
Functional principle of the PCF8883 . . . . . . . . . . .6
Switching modes timing diagram of PCF8883 . . . .8
Integrated voltage regulator . . . . . . . . . . . . . . . . . .8
IDD with respect to VDD . . . . . . . . . . . . . . . . . . . . 11
IDD with respect to temperature . . . . . . . . . . . . . .12
IDD with respect to sampling frequency (fs) . . . . .12
Switching time (tsw) with respect to sampling
frequency (fs) . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Switching time (tsw) with respect to capacitor
on pin CLIN (CCLIN) . . . . . . . . . . . . . . . . . . . . . . .13
Switching time (tsw) with respect to temperature .14
Input voltage on pin CPC (VI(CPC))
with respect to capacitor on pin IN (CIN) . . . . . . .14
Input voltage on pin CPC (VI(CPC))
with respect to temperature . . . . . . . . . . . . . . . . .15
Typical application . . . . . . . . . . . . . . . . . . . . . . . .16
Package outline of PCF8883T (SOIC8). . . . . . . .18
Bare die outline of PCF8883US. . . . . . . . . . . . . .19
Alignment mark of the PCF8883US die
(for location and dimension see Table 10) . . . . . .20
Tape and reel details for PCF8883T . . . . . . . . . .21
Tape and reel details for PCF8883US . . . . . . . . .22
Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
PCF8883
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 17 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
33 of 34
PCF8883
NXP Semiconductors
Capacitivetouch/proximity switch with auto-calibration
28. Contents
1
2
3
4
4.1
5
6
7
7.1
7.2
8
8.1
8.2
9
10
11
12
13
13.1
13.2
13.3
14
15
16
17
18
18.1
19
19.1
19.2
19.3
19.4
20
20.1
20.2
20.3
20.3.1
20.3.2
20.3.3
20.3.4
21
22
23
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Output switching modes . . . . . . . . . . . . . . . . . . 7
Voltage regulator. . . . . . . . . . . . . . . . . . . . . . . . 8
Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Static characteristics. . . . . . . . . . . . . . . . . . . . 10
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
Characteristic curves . . . . . . . . . . . . . . . . . . . 11
Power consumption . . . . . . . . . . . . . . . . . . . . 11
Typical reaction time . . . . . . . . . . . . . . . . . . . . 13
Reservoir capacitor voltage . . . . . . . . . . . . . . 14
Application information. . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Handling information. . . . . . . . . . . . . . . . . . . . 20
Packing information . . . . . . . . . . . . . . . . . . . . 21
Tape and reel information . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 23
Introduction to soldering . . . . . . . . . . . . . . . . . 23
Wave and reflow soldering . . . . . . . . . . . . . . . 23
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
Soldering of WLCSP packages. . . . . . . . . . . . 25
Introduction to soldering WLCSP packages . . 25
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 25
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 25
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Quality of solder joint . . . . . . . . . . . . . . . . . . . 27
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 28
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 29
24
24.1
24.2
24.3
24.4
24.5
25
26
27
28
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
30
30
30
30
31
31
31
32
33
34
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 17 March 2014
Document identifier: PCF8883