PCA8886 Dual channel capacitive proximity switch with auto-calibration and large voltage operating range Rev. 3 — 14 March 2014 Product data sheet 1. General description The PCA8886 is a low power dual channel capacitive proximity switch that uses a patented (EDISEN) digital method to detect a change in capacitance on remote sensing plates. Changes in the static capacitance (as opposed to dynamic capacitance changes) are automatically compensated using continuous auto-calibration. Remote sensing plates (for example, conductive foil) can be connected directly to the IC1 or remotely using a coaxial cable. 2. Features and benefits Dynamic proximity switch Digital processing method Automatic calibration Adjustable sensitivity, can be made very high Adjustable response time Wide input capacitance range (10 pF to 60 pF) A large distance (several meters) between the sensing plate and the IC is possible Open-drain output (P-type MOSFET, external load between pin and ground) Output configurable as push-button, toggle, or pulse Wide voltage operating range (VDD = 3 V to 9 V) Designed for battery powered applications (IDD = 6 A, typical) Large temperature operating range (Tamb = 40 C to +85 C) AEC-Q100 compliant for automotive applications Available in TSSOP16 3. Applications Proximity detection Proximity sensing in Door locks and grips Portable entertainment units Computing tablets Switch for medical applications Dashboard: switch to toggle menus and resetting trip counter Switch for use in explosive environments 1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20. PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration Vandal proof switches Transportation: Switches in or under upholstery, leather, handles, mats, and glass Buildings: switch in or under carpets, glass, or tiles Sanitary applications: use of standard metal sanitary parts (for example, tap) as switch Hermetically sealed keys on a keyboard 4. Ordering information Table 1. Ordering information Type number Package PCA8886TS Name Description Version TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm PCA8886 4.1 Ordering options Table 2. Ordering options Product type number Orderable part number Sales item (12NC) Delivery form IC revision PCA8886TS/Q900/1 PCA8886TS/Q900/1,1 tape and reel, 13 inch 1 935297325118 5. Marking Table 3. PCA8886 Product data sheet Marking codes Product type number Marking code PCA8886TS/Q900/1 PCA8886 All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 2 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 6. Block diagram 9'',175(*'>@ YVV>@ 92/7$*( 5(*8/$725 9''>@ &2817(5 /2*,& 287>@ 6(1625 /2*,& 3&$ ,1 ,1 26&,//$725 IV 26&,//$725 IV 7<3(>@ &3& &3& &/,1 &/,1 DDD The PCA8886 integrates two identical capacitive proximity switches which can be configured separately. Fig 1. PCA8886 Product data sheet Block diagram of PCA8886 All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 3 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 7. Pinning information 7.1 Pinning ,1 7<3( 9'',175(*' &/,1 &3& 287 966 ,1 7<3( &/,1 &3& 287 966 9'' 9'',175(*' 3&$ 9'' DDD Top view. For mechanical details, see Figure 16. Fig 2. Pin configuration of PCA8886TS (TSSOP16) 7.2 Pin description Table 4. Pin description Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified. Symbol Pin Type Description TSSOP16 (PCA8886TS) IN1 1 analog input/output sensor input 1 TYPE1 2 input select output configuration of pin OUT1 CPC1 3 analog input/output sensitivity setting 1 VSS1 4 supply ground supply voltage 1 IN2 5 analog input/output sensor input 2 TYPE2 6 input select output configuration of pin OUT2 CPC2 7 analog input/output sensitivity setting 2 VSS2 8 supply ground supply voltage 2 VDD2 9 supply supply voltage 2 OUT2 10 output switch output 2 CLIN2 11 analog input/output sampling rate setting 2 VDD(INTREGD)2[1] 12 supply internal regulated supply voltage output 2 VDD1 13 supply supply voltage 1 OUT1 14 output switch output 1 CLIN1 15 analog input/output sampling rate setting 1 VDD(INTREGD)1[1] 16 supply internal regulated supply voltage output 1 [1] PCA8886 Product data sheet The internal regulated supply voltage outputs must be decoupled with a decoupling capacitor to VSS[1:2]. All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 4 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 8. Functional description Figure 3 and Figure 4 show the functional principle of one channel of the PCA8886. The discharge time (tdch) of a chip-internal RC timing circuit, to which the external sensing plates are connected via pins IN[1:2], is compared to the discharge time (tdch(ref)) of a second chip-internal reference RC timing circuit. Both RC timing circuits are periodically charged from VDD(INTREGD)[1:2] via identical switches and then discharged via a resistor to ground (VSS). Both switches are synchronized. 9'',175(*' 9'',175(*' 9UHI IV &83 &2817(5 /2*,& &'1 ,1 ,VLQN 966 &3& DDD Fig 3. Functional diagram of the sensor logic (one channel) The charge-discharge cycle is governed by the sampling rate (fs). If the voltage of one of the RC timing circuits falls below the internal reference voltage Vref, the respective comparator output becomes LOW. The logic following the comparators determines which comparator switches first. If the upper (reference) comparator switches, then a pulse is given on CUP. If the lower (input) comparator switches first, then a pulse is given on CDN (see Figure 3). The pulses control the charge on the external capacitor CCPC on pins CPC[1:2]. Every time a pulse is given on CUP, capacitor CCPC is charged from VDD(INTREGD) for a fixed time causing the voltage on CCPC to rise. Likewise when a pulse occurs on CDN, capacitor CCPC is connected to a current sink to ground for a fixed time causing the voltage on CCPC to fall. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 5 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration If the capacitance on pins IN[1:2] increases, the discharge time tdch increases too. Therefore it takes longer for the voltage on the corresponding comparator to drop below Vref. Only once this happens, the comparator output becomes LOW and this results in a pulse on CDN discharging the external capacitor CCPC slightly. Thus most pulses will now be given by CUP. Without further action, capacitor CCPC would then fully charge. However, a chip-internal automatic calibration mechanism that is based on a voltage controlled sink current (Isink) connected to pins IN[1:2] attempts to equalize the discharge time tdch with the internal reference discharge time tdch(ref). The current source is controlled by the voltage on CCPC which causes the capacitance on pins IN[1:2] to be discharged more quickly in the case that the voltage on CCPC is rising, thereby compensating for the increase in capacitance on input pins IN[1:2]. This arrangement constitutes a closed-loop control system that constantly attempts to equalize the discharge time tdch with tdch(ref). This allows compensating for slow changes in capacitance on input pins IN[1:2]. Fast changes due to an approaching hand for example will not be compensated. In the equilibrium state, the discharge times are equal and the pulses alternate between CUP and CDN. From this also follows, that an increase in capacitor value CCPC results in a smaller voltage change per pulse CUP or CDN. Thus the compensation due to internal current sink source Isink is slower and therefore the sensitivity of the sensor increases. Likewise a decrease in capacitor CCPC results in a lower sensitivity. (For further information see Section 14.) 9'',175(*' 92/7$*( 5(*8/$725 9'' 3&$ 6(16,1*3/$7( &2$;,$/&$%/( 6(1625 /2*,& 5) &2817(5 /2*,& ,1 287 &6(16 5& &) 26&,//$725 IV 7<3( 966 &3& &/,1 DDD CSENS = sensing plate capacitance. CCABLE = cable capacitance. RC = external pull-down resistor. RF = low pass filter resistor. CF = low pass filter capacitor. Fig 4. Functional principle of one channel of the PCA8886 PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 6 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration The counter, following the sensor logic depicted in Figure 3, counts the pulses of CUP or CDN respectively. The counter is reset every time the pulse sequence changes from CUP to CDN or the other way around. Pins OUT[1:2] will only be activated when enough consecutive CUP or CDN pulses occur. Low-level interference or slow changes in the input capacitance do not cause the output to switch. Various measures, such as asymmetrical charge and discharge steps, are taken to ensure that the output switches off correctly. A special start-up circuit ensures that the device reaches equilibrium quickly when the supply is attached. Pins OUT[1:2] are open-drain outputs capable of pulling an external load Rext (at maximum current of 20 mA) up to VDD. The load resistor must be dimensioned appropriately, taking the maximum expected VDD voltage into account. The output will be automatically deactivated (short circuit protection) for loads in excess of 30 mA. Pins OUT[1:2] can also drive CMOS inputs without connection of the external load. A small internal 150 nA current sink Isink enables a full voltage swing to take place on pins OUT[1:2], even if no load resistor is connected. This is useful for driving purely capacitive CMOS inputs. The falling slope can be fairly slow in this mode, depending on load capacitance. The sampling rate (fs) corresponds to half of the frequency used in the RC timing circuit. The sampling rate can be adjusted within a specified range by selecting the value of CCLIN. The oscillator frequency is internally modulated by 4 % using a pseudo random signal. This prevents interference caused by local AC-fields. 8.1 Output switching modes The output switching behavior can be selected using pins TYPE[1:2] (see Figure 5) • Push-button (TYPE[1:2] connected to VSS[1:2]): The output OUT is active as long as the capacitive event2 lasts. • Toggle (TYPE[1:2] connected to VDD(INTREGD)[1:2]): The output OUT is activated by the first capacitive event and deactivated by a following capacitive event. • Pulse (CTYPE connected between TYPE[1:2] and VSS[1:2]): The output OUT is activated for a defined time at each capacitive event. The pulse duration is determined by the value of CTYPE and is approximately 2.5 ms/nF. A typical value for CTYPE is 4.7 nF which results in an output pulse duration of about 10 ms. The maximum value of CTYPE is 470 nF which results in a pulse duration of about 1 s. Capacitive events are ignored that occur during the time the output is active. Figure 5 illustrates the switching behavior for the output switching modes. Additionally the graph illustrates, that short-term disturbances on the sensor are suppressed by the circuit. 2. A capacitive event is a dynamic increase of capacitance at the sensor input pins IN[1:2]. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 7 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration &DSDFLWDQFH RQLQSXW W 287 SXVKEXWWRQ W 287 WRJJOH W 287 SXOVH WFON+ &7<3(ā PVQ) WFON+ &7<3(ā PVQ) WFON+ &7<3(ā PVQ) W DDD Fig 5. Switching modes timing diagram of PCA8886 8.2 Voltage regulator The PCA8886 implements a chip-internal voltage regulator supplied by pins VDD[1:2] that provides an internal supply (VDD(INTREGD)), limited to a maximum of 4.6 V. Figure 6 shows the relationship between VDD[1:2] and VDD(INTREGD)[1:2]. 9''PD[ 9''PD[ RSHUDWLRQDOUDQJHRI3&$ 9'',175(*' 9''PLQ 9'' 9'',175(*' 9''PLQ DDD Fig 6. Integrated voltage regulator 9. Safety notes CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 8 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 10. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage VI input voltage IO output current ISS ground supply current II input current Ptot total power dissipation VESD electrostatic discharge voltage Conditions Min Max Unit 0.5 +9 V on pins IN[1:2], TYPE[1:2], CPC[1:2] 0.5 VDD(INTREGD) + 0.5 V on pins OUT[1:2] 10 +50 mA 10 +50 mA on any other pin 10 +10 mA - 100 mW HBM [1] - 2500 V CDM [2] - 1000 V - 100 mA 60 +125 C 40 +85 C Ilu latch-up current [3] Tstg storage temperature [4] Tamb ambient temperature operating device [1] Pass level; Human Body Model (HBM) according to Ref. 7 “JESD22-A114”. [2] Pass level; Charged-Device Model (CDM), according to Ref. 8 “JESD22-C101”. [3] Pass level; latch-up testing, according to Ref. 9 “JESD78” at maximum ambient temperature (Tamb(max) = +85 C). [4] According to the store and transport requirements (see Ref. 12 “UM10569”) the devices have to be stored at a temperature of +8 C to +45 C and a humidity of 25 % to 75 %. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 9 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 11. Static characteristics Table 6. Static characteristics VDD = 5 V, Tamb = +25 C; unless otherwise specified. Symbol Parameter Conditions [1] VDD supply voltage VDD(INTREGD) internal regulated supply voltage VDD(INTREGD) internal regulated supply voltage regulator voltage drop variation IDD supply current Min Typ Max Unit 3.0 - 9.0 V 3.0 4.0 4.6 V - 10 50 mV idle state; fs = 1 kHz [2] - 6 10 A idle state; fs = 1 kHz; VDD = 3.0 V [2] - 4.4 7 A Isink sink current internal constant current to VSS[1:2] - 150 - nA VO output voltage on pins OUT[1:2]; pull-up voltage 0 VDD 9.0 V IO output current P-MOS Vsat saturation voltage [3] 0 10 20 mA short circuit protection VO 0.6 V 20 30 50 mA on pins OUT[1:2]; IO = +10 mA 0.1 0.2 0.4 V on pins OUT[1:2]; IO = +10 mA; VDD = 3.0 V 0.1 0.3 0.5 V nF Cdec decoupling capacitance on pins VDD(INTREGD)[1:2] VI input voltage on pins CPC[1:2] [4] 100 - 220 0.6 - VDD(INTREGD) 0.5 V [1] When the input capacitance range is limited to 10 pF Ci 40 pF or an external pull-down resistor RC is used, the device can be operated down to VDD = 3.0 V over the full temperature range. [2] Idle state is the steady state after completed power-on without any activity on the sensor plate and the voltage on the reservoir capacitor CCPC settled. [3] For reliability reasons, the average output current must be limited to 4.6 mA at 70 C and 3.0 mA at 85 C. [4] External ceramic chip capacitor recommended (see Figure 15). PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 10 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 12. Dynamic characteristics Table 7. Dynamic characteristics VDD = 5 V, CCLIN = 22 pF, CCPC = 470 nF, Tamb = +25 C; unless otherwise specified. Symbol Parameter Conditions CCLIN capacitance on pin CLIN CCPC capacitance on pin CPC Min Typ Max Unit 0 22 100 pF 90 470 2500 nF - 14 - bit 0.1 - 470 nF sensing plate and connecting cable 10 - 60 pF sensing plate and connecting cable; Tamb = 40 C to +85 C; VDD = 3.0 V 10 - 40 pF X7R ceramic chip capacitor Nres(dig)eq equivalent digital resolution CTYPE capacitance on pin TYPE Ci input capacitance tstartup start-up time until normal operation is established - 0.5 - s tp pulse duration on pins OUT[1:2]; in pulse mode; CTYPE 10 nF - 2.5 - ms/nF fs sampling frequency CCLIN = 0 pF - 3.3 - kHz tsw switching time CCLIN = 22 pF (typical value) - 1 - kHz CCLIN = 100 pF - 275 - Hz at fs = 1 kHz - 64 - ms 13. Characteristic curves 13.1 Power consumption DDN ,'' $ 9''9 Idle state; fs = 1 kHz; Tamb = 25 C. Fig 7. PCA8886 Product data sheet IDD with respect to VDD All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 11 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration DDN ,'' $ 9'' 9 9'' 9 7HPSHUDWXUH& Idle state; fs = 1 kHz. Fig 8. IDD with respect to temperature DDN ,'' $ IV+] Idle state; VDD = 6 V; Tamb = 25 C. Fig 9. PCA8886 Product data sheet IDD with respect to sampling frequency (fs) All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 12 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 13.2 Typical reaction time DDN WVZ PV IV+] VDD = 6 V; Tamb = 25 C. Fig 10. Switching time (tsw) with respect to sampling frequency (fs) DDN WVZ PV &&/,1S) VDD = 6 V; Tamb = 25 C. Fig 11. Switching time (tsw) with respect to capacitor (CCLIN) on pins CLIN[1:2] PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 13 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration DDN WVZ PV 7HPSHUDWXUH& VDD = 6 V. Fig 12. Switching time (tsw) with respect to temperature 13.3 Reservoir capacitor voltage DDN 9,&3& 9 &,1S) VDD = 6 V; Tamb = 25 C. VI(CPC) = input voltage on pins CPC[1:2]. CIN = capacitor on pins IN[1:2]. Fig 13. Input voltage on pins CPC[1:2] (VI(CPC)) with respect to capacitor (CIN) on pins IN[1:2] PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 14 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration DDN 9,&3& 9 &,1 S) &,1 S) 7HPSHUDWXUH& VDD = 6 V. VI(CPC) = input voltage on pins CPC[1:2] Fig 14. Input voltage (VI(CPC)) on pins CPC[1:2] with respect to temperature 14. Application information Figure 15 shows the typical connections for a general application3. The positive supply is connected to pins VDD[1:2]. It is recommended to connect smoothing capacitors to ground to both VDD[1:2] and VDD(INTREGD)[1:2] (values for Cdec, see Table 6). 3. For further information, see Ref. 2 “AN10832”. Information about the appropriate evaluation board can be found in Ref. 11 “UM10505”. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 15 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 5& 6(16,1*3/$7( &2$;,$/&$%/( &) 5) ,1 9'',175(*' ,1 9'',175(*' &6(16 5& 6(16,1*3/$7( &2$;,$/&$%/( &) 5) &6(16 9'',175(*' 7RJJOH 7<3( 3XOVH 3XVK EXWWRQ &/,1 7<3( 3&$ &3& &/,1 &3& 287 287 966 966 9'' 9'' DDD CSENS = sensing plate capacitance. The coaxial cable is optional. Fig 15. Typical application The sampling rate is determined by the capacitance CCLIN on pins CLIN[1:2]. A higher sampling rate reduces the reaction time and increases the current consumption. The sensing plate capacitance CSENS may consist of a small metal area, for example behind an isolating layer. The sensing plate can be connected to a coaxial cable (CCABLE) which in turn is connected to the input pins IN[1:2]. Alternatively, the sensing plate can be directly connected to the input pins IN[1:2]. An internal low pass filter is used to reduce RF interference. An additional low pass filter consisting of a resistor RF and capacitor CF can be added to the input to further improve RF immunity as required. For good performance, the total amount of capacitance on the input (CSENS + CCABLE + CF) should be in the proper range, the optimum point being around 30 pF. These conditions allow the control loop to adapt to the static capacitance on CSENS and to compensate for slow changes in the sensing plate capacitance. A higher capacitive input loading is possible if an additional discharge resistor RC is placed as shown in Figure 15. Resistor RC simply reduces the PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 16 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration discharge time such that the internal timing requirements are fulfilled. The sensitivity of the sensor can be influenced by the sensing plate area and capacitor CCPC. The sensitivity is significantly reduced when CCPC is reduced. When maximum sensitivity is desired CCPC can be increased, but this also increases sensitivity to interference. Pins CPC[1:2] has high-impedance and is sensitive to leakage currents. Remark: CCPC should be a high-quality foil or ceramic capacitor, for example an X7R type. For the choice of proper component values for a given application, the component specifications in Table 6 and Table 7 must be followed. 15. Test information 15.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Failure mechanism based stress test qualification for integrated circuits, and is suitable for use in automotive applications. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 17 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 16. Package outline 76623SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP 3&$ ' ( F ; ( 'K (K SLQ LQGH[ $ $ $ H[SRVHG SDG ș / H / E GHWDLO; PP VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP $ PD[ QRP PLQ $ $ E F ' 'K ( ( (K H / / ș SFDBSR 2XWOLQH YHUVLRQ 3&$ 5HIHUHQFHV ,(& -('(& -(,7$ 02,668(& (XURSHDQ SURMHFWLRQ ,VVXHGDWH Fig 16. Package outline of PCA8886TS (TSSOP16) PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 18 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 17. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent standards. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 19 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 18. Packing information 18.1 Tape and reel information 7239,(: ' 3 : % 3 $ ' . GLUHFWLRQRIIHHG 2ULJLQDOGLPHQVLRQVDUHLQPP )LJXUHQRWGUDZQWRVFDOH DDD Fig 17. Carrier tape details for PCA8886 Table 8. Carrier tape dimensions of PCA8886 Symbol Description Value Unit A0 pocket width in x direction 6.9 mm B0 pocket width in y direction 5.6 mm K0 pocket depth 1.5 to 1.6 mm P1 pocket hole pitch 8 mm D1 pocket hole diameter 1.5 to 1.6 mm Compartments Overall dimensions PCA8886 Product data sheet W tape width 12 mm D0 sprocket hole diameter 1.5 to 1.55 mm P0 sprocket hole pitch 4 mm All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 20 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 19. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 19.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 19.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 19.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 21 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 19.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 18) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 < 2.5 235 220 2.5 220 220 Table 10. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 18. PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 22 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 18. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 20. Abbreviations Table 11. PCA8886 Product data sheet Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor HBM Human Body Model IC Integrated Circuit MM Machine Model MOS Metal Oxide Semiconductor MOSFET Metal–Oxide–Semiconductor Field-Effect Transistor MSL Moisture Sensitivity Level PCB Printed-Circuit Board RC Resistance-Capacitance RF Radio Frequency SMD Surface Mount Device All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 23 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 21. References [1] AN10365 — Surface mount reflow soldering description [2] AN10832 — PCF8883 - capacitive proximity switch with auto-calibration [3] AN11122 — Water and condensation safe touch sensing with the NXP capacitive touch sensors [4] IEC 60134 — Rating systems for electronic tubes and valves and analogous semiconductor devices [5] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena [6] IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices [7] JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) [8] JESD22-C101 — Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components [9] JESD78 — IC Latch-Up Test [10] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices [11] UM10505 — OM11057 quick start guide [12] UM10569 — Store and transport requirements PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 24 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 22. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes PCA8886 v.3 20140314 Product data sheet - PCA8886 v.2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • Legal texts have been adapted to the new company name where appropriate. Emphasized the X7R statement (Section 14) Added Section 9 Added Input or input/output statement in Table 4 Enhanced ordering information in Table 2 Corrected Figure 6 PCA8886 v.2 20120920 Product data sheet - PCA8886 v.1 PCA8886 v.1 20111123 Objective data sheet - - PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 25 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 23. Legal information 23.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 23.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 23.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCA8886 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 26 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 23.4 Licenses Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. This NXP Semiconductors IC is made under license to European Patent No. 0723339, owned by EDISEN - SENSOR SYSTEME GmbH & CO KG and counterparts. Any license fee is included in the purchase price. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 23.5 Trademarks ICs with capacitive sensing functionality Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 24. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 27 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 25. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2 Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9 Static characteristics . . . . . . . . . . . . . . . . . . . .10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 11 Carrier tape dimensions of PCA8886 . . . . . . .20 SnPb eutectic process (from J-STD-020D) . . .22 Lead-free process (from J-STD-020D) . . . . . .22 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .23 Revision history . . . . . . . . . . . . . . . . . . . . . . . .25 PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 28 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 26. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Fig 16. Fig 17. Fig 18. Block diagram of PCA8886 . . . . . . . . . . . . . . . . . .3 Pin configuration of PCA8886TS (TSSOP16) . . . .4 Functional diagram of the sensor logic (one channel) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Functional principle of one channel of the PCA8886 . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Switching modes timing diagram of PCA8886. . . .8 Integrated voltage regulator . . . . . . . . . . . . . . . . . .8 IDD with respect to VDD . . . . . . . . . . . . . . . . . . . . 11 IDD with respect to temperature . . . . . . . . . . . . . .12 IDD with respect to sampling frequency (fs) . . . . .12 Switching time (tsw) with respect to sampling frequency (fs) . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Switching time (tsw) with respect to capacitor (CCLIN) on pins CLIN[1:2] . . . . . . . . . . . . . . . . . .13 Switching time (tsw) with respect to temperature .14 Input voltage on pins CPC[1:2] (VI(CPC)) with respect to capacitor (CIN) on pins IN[1:2] . .14 Input voltage (VI(CPC)) on pins CPC[1:2] with respect to temperature . . . . . . . . . . . . . . . . .15 Typical application . . . . . . . . . . . . . . . . . . . . . . . .16 Package outline of PCA8886TS (TSSOP16). . . .18 Carrier tape details for PCA8886 . . . . . . . . . . . . .20 Temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 PCA8886 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 14 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 29 of 30 PCA8886 NXP Semiconductors Dual channel capacitive proximity switch with auto-calibration 27. Contents 1 2 3 4 4.1 5 6 7 7.1 7.2 8 8.1 8.2 9 10 11 12 13 13.1 13.2 13.3 14 15 15.1 16 17 18 18.1 19 19.1 19.2 19.3 19.4 20 21 22 23 23.1 23.2 23.3 23.4 23.5 24 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Output switching modes . . . . . . . . . . . . . . . . . . 7 Voltage regulator. . . . . . . . . . . . . . . . . . . . . . . . 8 Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics. . . . . . . . . . . . . . . . . . . . 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 11 Characteristic curves . . . . . . . . . . . . . . . . . . . 11 Power consumption . . . . . . . . . . . . . . . . . . . . 11 Typical reaction time . . . . . . . . . . . . . . . . . . . . 13 Reservoir capacitor voltage . . . . . . . . . . . . . . 14 Application information. . . . . . . . . . . . . . . . . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 17 Quality information . . . . . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Handling information. . . . . . . . . . . . . . . . . . . . 19 Packing information . . . . . . . . . . . . . . . . . . . . 20 Tape and reel information . . . . . . . . . . . . . . . . 20 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25 Legal information. . . . . . . . . . . . . . . . . . . . . . . 26 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Contact information. . . . . . . . . . . . . . . . . . . . . 27 25 26 27 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 March 2014 Document identifier: PCA8886