Pressure Freescale Semiconductor MPX12 Rev 11, 07/2009 10 kPa Uncompensated Silicon Pressure Sensors MPX12 Series The MPX12 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element strain gauge design. 0 to 10 kPa (0 to 1.45 psi) 55 mV Full Scale Span (Typical) Application Examples • • • • • • • • Features • • • • • • Low Cost Patented Silicon Shear Stress Strain Gauge Design Ratiometric to Supply Voltage Easy to Use Chip Carrier Package Options Gauge Options Durable Epoxy Package Air Movement Control Environmental Control Systems Level Indicators Leak Detection Medical Instrumentation Industrial Controls Pneumatic Control Systems Robotics ORDERING INFORMATION Device Name Package Options # of Ports Case No. None • Single Pressure Type Dual Gauge Differential Absolute Device Marking Unibody Package (MPX12 Series) MPX12D Tray 344 MPX12DP Tray 344C MPX12GP Tray 344B • • • MPX12D • MPX12DP MPX12GP • Small Outline Package (MPXV12 Series) MPXV12DP MPXV12DP Tray 1351 MPXV12GP Tray 1369 • • MPXV12GP MPXV12GW6U Rail 1735 • • MPXV12GW MPXV12GW7U Rail 1560 • • MPXV12GW Rail 1320A • • MPXM12GS Tape & Reel 1320A • • MPXM12GS • • MPAK Package (MPXM12 Series) MPXM12GS MPXM12GST1 © Freescale Semiconductor, Inc., 2007-2009. All rights reserved. Pressure UNIBODY PACKAGES MPX12D CASE 344-15 MPX12GP CASE 344B-01 MPX12DP CASE 344C-01 SMALL OUTLINE PACKAGES MPXV12DP CASE 1351-01 MPXV12GP CASE 1369-01 MPXV12GW6U CASE 1735-02 MPXV12GW7U CASE 1560-02 MPAK PACKAGE MPXM12GS/GST1 CASE 1320A-02 MPX12 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit POP 0 — 10 kPa Supply Voltage VS — 3.0 6.0 Vdc Supply Current Io — 6.0 — mAdc VFSS 45 55 70 mV Voff 0 20 35 mV ΔV/ΔP — 5.5 — mV/kPa — –0.5 — 5.0 %VFSS — — ±0.1 — %VFSS Temperature Hysteresis (–40°C to +125°C) — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span TCVFSS –0.22 — –0.16 %VFSS/°C TCVoff — ±15 — μV/°C TCR 0.21 — 0.27 %Zin/°C Input Impedance Zin 400 — 550 Ω Output Impedance Zout 750 — 1250 Ω tR — 1.0 — ms — — 20 — ms — — ±0.5 — %VFSS Differential Pressure Range(1) (2) Full Scale Span(3) (4) Offset Sensitivity Linearity Pressure Hysteresis (6) (0 to 10 kPa) Temperature Coefficient of Offset Temperature Coefficient of Resistance (5) Response Time Warm-Up (10% to 90%) Time(6) Offset Stability (7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX12 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit PMAX 75 kPa PBURST 100 kPa TSTG –40 to +125 °C TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. 3 +VS 2 Sensing Element 4 +VOUT –VOUT 1 GND Figure 1. Uncompensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX12 4 Sensors Freescale Semiconductor Pressure Temperature Compensation Figure 2 shows the typical output characteristics of the MPX12 series over temperature. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2010D series sensor. Several approaches to external temperature compensation over both –40 to +125°C and 0 to +80°C ranges are presented in Applications Note AN840. LINEARITY Linearity refers to how well a transducer's output follows the equation: VOUT = VOFF + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 80 70 +25°C VS = 3 VDC P1 > P2 -40°C Output (mVdc) 60 Span Range (Typ) 50 40 +125°C 30 20 Offset (Typ) 10 0 PSI 0 0.3 kPa 2.0 0.6 0.9 4.0 6.0 1.2 1.5 8.0 10 Pressure Differential Figure 2. Output vs. Pressure Differential 80 Linearity 70 60 Actual Output (mVdc) 50 Span (VFSS) 40 Theoretical 30 20 Offset (VOFF) 10 0 0 Pressure (kPa) Max POP Figure 3. Linearity Specification Comparison MPX12 Sensors Freescale Semiconductor 5 Pressure Stainless Steel Cap Die Gel Die Coat P1 Thermoplastic Case Wire Bond Lead Frame P2 Die Bond Differential Sensing Element Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential/gauge die. A gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. Media other than dry clean air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing gel which isolates the die from the environment. Freescale’s MPx12 series is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table Part Number MPX12D Case Type Pressure (P1) Side Identifier 344 Stainless Steel Cap MPX12DP 344C Side with Part Marking MPX12GP 344B Side with Port Attached MPXV12DP 1351 Side with Part Marking MPXV12GP 1369 Side with Port MPXV12GW6U 1735 Side with Port MPXV12GW7U 1560 Side with Port 1320A Side with Port Attached MPXM12GS/GST1 MPX12 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS C R M 1 B 2 –A– Z 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R Y Z N 1 PIN 1 2 3 L 4 –T– SEATING PLANE J F G F D Y 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. “F” 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC – SUPPLY + SUPPLY GROUND INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00 GND –VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– –T– U L R H N PORT #1 POSITIVE PRESSURE (P1) –Q– B 1 2 PIN 1 3 4 K –P– 0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX12 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS PORT #1 R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U V W L H PORT #2 N PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) –Q– B SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K –P– –T– –T– 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE MPX12 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX12 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. 8X F M E1 B N ∅T K A P C A B 8X M 0.004 (0.1) DETAIL G C SEATING PLANE DIM A A1 b D E E1 e F K L M N P T θ INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0˚ 7˚ 0˚ 7˚ CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 16 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK PACKAGE MPX12 18 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK PACKAGE MPX12 Sensors Freescale Semiconductor 19 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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