FREESCALE MPX12

Freescale Semiconductor
Technical Data
MPX12
Rev 7, 01/2007
10 kPa Uncompensated
Silicon Pressure Sensors
MPX12 SERIES
The MPX12 series device is a silicon piezoresistive pressure sensor providing
a very accurate and linear voltage output — directly proportional to the applied
pressure. This standard, low cost, uncompensated sensor permits
manufacturers to design and add their own external temperature compensating
and signal conditioning networks. Compensation techniques are simplified
because of the predictability of Freescale's single element strain gauge design.
Features
•
•
•
•
•
•
UNCOMPENSATED PRESSURE
SENSOR
0 TO 10 kPA (0–1.45 psi)
55 mV FULL SCALE SPAN
(TYPICAL)
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Differential and Gauge Options
Durable Epoxy Package
MPX12D
CASE 344-15
Application Examples
• Air Movement Control
• Environmental Control Systems
• Level Indicators
• Leak Detection
• Medical Instrumentation
• Industrial Controls
• Pneumatic Control Systems
• Robotics
MPX12GP
CASE 344B-01
ORDERING INFORMATION(1)
Device Type
Options
Case No.
Basic Element
Differential
344
Ported Elements
Differential
Gauge
Order Number
Device Marking
MPX12D
MPX12D
344C
MPX12DP
MPX12DP
344B
MPX12GP
MPX12GP
1. MPX12 series pressure sensors are available in differential and gauge configurations.
Devices are available in the basic element package or with pressure port fittings which
provide printed circuit board mounting ease and barbed hose pressure connections.
MPX12DP
CASE 344C-01
PIN NUMBERS
© Freescale Semiconductor, Inc., 2007. All rights reserved.
1
GND
3
VSS
2
+Vout
4
–Vout
3
+VS
2
Sensing
Element
4
+VOUT
–VOUT
1
GND
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Table 1. Maximum Ratings(1)
Rating
Maximum Pressure (P1 > P2)
Burst Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Value
Unit
PMAX
75
kPa
PBURST
100
kPa
TSTG
–40 to +125
°C
TA
–40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX12
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
10
kPa
VS
—
3.0
6.0
Vdc
Io
—
6.0
—
mAdc
VFSS
45
55
70
mV
Voff
0
20
35
mV
Sensitivity
∆V/∆P
—
5.5
—
mV/kPa
Linearity(5)
—
–0.5
—
5.0
%VFSS
—
—
±0.1
—
%VFSS
—
—
±0.5
—
%VFSS
TCVFSS
–0.22
—
–0.16
%VFSS/°C
TCVoff
—
±15
—
µV/°C
TCR
0.28
—
0.34
%Zin/°C
Input Impedance
Zin
400
—
550
W
Output Impedance
Zout
750
—
1250
W
tR
—
1.0
—
ms
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Differential Pressure Range
Supply
(1)
Voltage(2)
Supply Current
Full Scale Span
(3)
Offset(4)
Pressure
Hysteresis6
(0 to 10 kPa)
(5)
Temperature Hysteresis
(–40°C to +125°C)
Temperature Coefficient of Full Scale
Temperature Coefficient of
Span(5)
Offset(5)
Temperature Coefficient of Resistance
(6)
Response Time
Warm-Up Time
Offset Stability
(5)
(10% to 90%)
(7)
(8)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
•
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
TCR:
ZIN deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to
25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
8. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX12
Sensors
Freescale Semiconductor
3
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX12 series over temperature.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to
differences in the thermal expansion of the strain gauge and
the diaphragm, as are often encountered in bonded strain
gauge pressure sensors. However, the properties of the
strain gauge itself are temperature dependent, requiring that
the device be temperature compensated if it is to be used
over an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature
compensation over both –40 to +125°C and 0 to +80°C
ranges are presented in Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
80
70
+25°C
VS = 3 VDC
P1 > P2
-40°C
Output (mVdc)
60
Span
Range
(Typ)
50
+125°C
40
30
20
Offset
(Typ)
10
0
PSI 0
0.3
kPa
2.0
0.6
0.9
4.0
6.0
1.2
1.5
8.0
10
Pressure Differential
Figure 2. Output versus Pressure Differential
80
Linearity
70
60
Output (mVdc)
Span
(VFSS)
Actual
50
40
Theoretical
30
20
Offset
(Voff)
10
0
0
Pressure (kPA)
Max
POP
Figure 3. Linearity Specification Comparison
MPX12
4
Sensors
Freescale Semiconductor
Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Epoxy
Case
Wire Bond
Lead Frame
P2
RTV Die
Bond
Figure 4. Unibody Package — Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX12 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application/
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table
Part Number
MPX12D
Case Type
344
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX12DP
344C
Side with Part Marking
MPX12GP
344B
Side with Port Attached
MPX12
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
C
R
M
1
B
-A-
2
3
4
Z
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
Y
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX12
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
-T-
0.25 (0.010)
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
MPX12
Sensors
Freescale Semiconductor
7
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MPX12
Rev. 7
01/2007
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