R551 - Reliability Data

Reliability Data Report
Product Family R550
LTC3108 / LTC3109 / LTC3588
Reliability Data Report
Report Number: R551
Report generated on: Wed Oct 03 18:56:44 PDT 2012
OPERATING LIFE TEST
PACKAGE TYPE
QFN/DFN
Totals
SAMPLE SIZE
308
308
OLDEST DATE
NEWEST DATE
K DEVICE HRS
1
No. of FAILURES
2,3
CODE
CODE
(+125°C)
0924
-
1005
-
243
243
0
0
K DEVICE HRS
No. of FAILURES
PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C
PACKAGE TYPE
SAMPLE SIZE
SSOP/TSSOP
SOIC/SOT/MSOP
Totals
50
153
203
OLDEST DATE
NEWEST DATE
CODE
CODE
1016
1015
-
1016
1015
-
2
51
53
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1016
1015
-
1016
1015
-
4
153
157
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
1016
1015
-
1016
1015
-
5
153
158
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
CODE
CODE
1015
-
1015
-
95
95
0
0
TEMP CYCLE FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SSOP/TSSOP
SOIC/SOT/MSOP
Totals
49
153
202
THERMAL SHOCK FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SSOP/TSSOP
SOIC/SOT/MSOP
Totals
50
153
203
HIGH TEMPERATURE BAKE AT 175 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/SOT/MSOP
Totals
95
95
(1) Assumes Activation Energy = 0.7 Electron Volts
(2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =7.54 FITS
(3) Mean Time Between Failure in Years = 15131.88
Note: 1 FIT = 1 Failure in One Billion Hours.
Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 Preconditioning
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