Reliability Data Report Product Family R550 LTC3108 / LTC3109 / LTC3588 Reliability Data Report Report Number: R551 Report generated on: Wed Oct 03 18:56:44 PDT 2012 OPERATING LIFE TEST PACKAGE TYPE QFN/DFN Totals SAMPLE SIZE 308 308 OLDEST DATE NEWEST DATE K DEVICE HRS 1 No. of FAILURES 2,3 CODE CODE (+125°C) 0924 - 1005 - 243 243 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/SOT/MSOP Totals 50 153 203 OLDEST DATE NEWEST DATE CODE CODE 1016 1015 - 1016 1015 - 2 51 53 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1016 1015 - 1016 1015 - 4 153 157 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1016 1015 - 1016 1015 - 5 153 158 0 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 1015 - 1015 - 95 95 0 0 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/SOT/MSOP Totals 49 153 202 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/SOT/MSOP Totals 50 153 203 HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP Totals 95 95 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =7.54 FITS (3) Mean Time Between Failure in Years = 15131.88 Note: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 Preconditioning page 1