Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK HMC-ABH209 v03.0714 LINEAR & POWER AMPLIFIER - CHIP GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz Typical Applications Features This HMC-ABH209 is ideal for: Output IP3: +25 dBm • Short Haul / High Capacity Links P1dB: +16 dBm • Wireless LAN Bridges Gain: 13 dB • Military & Space Supply Voltage: +5V 50 Ohm Matched Input/Output Die Size: 2.2 x 1.22 x 0.1 mm General Description Functional Diagram The HMC-ABH209 is a high dynamic range, two stage GaAs HEMT MMIC Medium Power Amplifier which operates between 55 and 65 GHz. The HMCABH209 provides 13 dB of gain, and an output power of +16 dBm at 1 dB compression from a +5V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation. The HMC-ABH209 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as well as thermocompression and thermosonic wirebonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes. Electrical Specifications, TA = +25 °C, Vdd = 5V, Idd = 80mA [2] Parameter Min. Frequency Range Gain 12 Typ. Max. Units 55 - 65 GHz 13 dB Input Return Loss 13 dB Output Return Loss 17 dB Output Power for 1 dB Compression (P1dB) 16 dBm Output Third Order Intercept (IP3) 25 dBm Saturated Output Power (Psat) 18 dBm Supply Current (Idd) 80 mA [1] Unless otherwise indicated, all measurements are from probed die [2] Adjust Vgg between -1V to +0.3V (typ -0.3V) to achieve Idd total = 80mA 1 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC-ABH209 v03.0714 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz Fixtured Output Power vs. Frequency Linear Gain vs. Frequency 18 -5 RETURN LOSS (dB) 14 GAIN (dB) 12 10 8 6 4 -10 -15 -20 -25 2 -30 0 50 52 54 56 58 60 62 64 66 68 50 52 54 56 Input Return Loss vs. Frequency 60 62 64 66 68 Output Return Loss vs. Frequency 0 20 -5 18 -10 POUT (dBm) RETURN LOSS (dB) 58 FREQUENCY (GHz) FREQUENCY (GHz) -15 -20 16 14 12 -25 10 -30 50 52 54 56 58 60 62 FREQUENCY (GHz) 64 66 68 55 56 57 58 59 60 61 62 63 64 65 FREQUENCY (GHz) P1dB LINEAR & POWER AMPLIFIER - CHIP 0 16 P5dB For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 2 HMC-ABH209 v03.0714 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz LINEAR & POWER AMPLIFIER - CHIP Absolute Maximum Ratings Drain Bias Voltage +5.5 Vdc Gain Bias Voltage -1 to +0.3 Vdc RF Input Power 10 dBm Storage Temperature -65 °C to + 150 °C Chennel Temperature +180 °C Outline Drawing Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 3 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002” For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC-ABH209 v03.0714 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz Pad Descriptions Function Description 1 RFIN This pad is AC coupled and matched to 50 Ohms. 2 RFOUT This pad is AC coupled and matched to 50 Ohms. 3 Vdd Power Supply Voltage for the amplifier. See assembly for required external components. 4 Vgg Gate control for amplifier. Please follow “MMIC Amplifier Biasing Procedure” application note. See assembly for required external components. Die Bottom GND Die bottom must be connected to RF/DC ground. Interface Schematic For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] LINEAR & POWER AMPLIFIER - CHIP Pad Number 4 HMC-ABH209 v03.0714 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz LINEAR & POWER AMPLIFIER - CHIP Assembly Diagram Note 1: Bypass caps should be 100 pF (approximately) ceramic (single-layer) placed no farther than 30 mils from the amplifier. Note 2: Best performance obtained from use of <10 mil (long) by 3 by 0.5 mil ribbons on input and output. 5 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC-ABH209 v03.0714 GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Microstrip substrates should be placed as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Follow ESD precautions to protect against ESD Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. LINEAR & POWER AMPLIFIER - CHIP The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm). For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 6