Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Part Type: Plastic Encapsulated SOIC Package Family: HMC182S14E HMC207S8E HMC351S8E HMC361S8GE HMC362S8GE HMC363S8GE HMC364S8GE HMC365S8GE HMC754S8GE HMC147S8E HMC154S8E HMC165S14E HMC239S8E HMC403S8GE QTR: 02018 Rev: 01 Switch, SP4T Mixer, Double-Balanced Mixer, High IP3, Double-Balanced Frequency Divider, ÷2 Frequency Divider, ÷2 Frequency Divider, ÷2 Frequency Divider, ÷2 Frequency Divider, ÷2 Amplifier, HBT Gain Block Obsolete Products Mixer, Double-Balanced Switch, SPDT Switch, SP4T Switch, SPDT Reflective Frequency Detector Hittite Microwave Corporation is committed to: Hittite’s employees recognize the responsibility to: • Supplying products of the highest quality • Advance in state-of-the-art technology that supports our products • Enhance our competitive position with superior product standards • Take the initiate to ensure product quality • Create an environment where the highest standards are maintained • Continue to improve quality practices 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] QTR: 02018 Rev: 01 1.0 Introduction This qualification procedure was designed to satisfy the package reliability requirements for a plastic SOIC 8-lead surface mount package. The testing was designed to simulate the worst-case environments the product may experience during assembly, test and life in the end user application. The device was electrically tested to the appropriate catalog specifications. The HMC182S14 was selected to qualify the SOIC package family. 1.1 General Description The SOIC package uses a copper lead frame. The lead frame is spot plated with silver to enable gold wire bonding. The MMIC device is epoxy attached to the paddle. The MMIC contains gold bond pads. The interconnection is performed using 1 mil gold ball bonds. The part is encapsulated using Sumitomo EME 6300 or equivalent encapsulating compound. The leads are finished with 85/15 SnPb or Matte Sn. The HMC182S14 is a low-cost terminated SP4T switch in a 14-lead SOIC package for use in antenna diversity, switched filter banks, gain/attenuation selection, and general channel multiplexing applications. The switch can control signals up to 2 GHz. A 2:4 decoder is integrated on the switch, requiring only 2 control lines and a negative bias to select each RF path. The 2:4 decoder replaces 4 to 8 control lines normally required by GaAs SP4T switches. The HMC182S14 is a drop-in replacement for the HMC165S14 in applications requiring low “off-state” VSWR. See positive bias/TTL SP4T HMC241QS16. Photo 1 Typical SOIC Package 2.0 Summary of Results PARA TEST QTY IN QTY OUT PASS / FAIL 3.1.1 Initial Electrical Test 196 196 Pass 3.1.2 Temperature Cycle 116 116 Complete 3.1.3 Final Electrical Test 116 116 Pass 3.1.4 Autoclave 80 80 Complete 3.1.5 Final Electrical Test 80 80 Pass 3.2.1 Lead Co-Planarity 80 80 Pass 3.2.2 Physical Dimensions 15 15 Pass 3.2.3 Resistance to Solvents 45 45 Pass 3.2.4 Solderability 15 15 Pass NOTES All testing has been completed. There were no relevant failures. 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] Page - 2 QTR: 02018 Rev: 01 Package Dimensions NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Suggested Land Pattern Package Information Part Number Suffix Package Body Material Lead Finish S14 RoHS Compliant Mold Compound Sn/Pb Solder MSL1 S14E RoHS Compliant Mold Compound 100% matte Sn MSL1 [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C MSL Rating Package Marking [3][4] [1] HMCNNN XXXX [2] HMCNNN XXXX [3] 4-Digit lot number XXXX [4] 3-Digit part number NNN 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] Page - 3 QTR: 02018 Rev: 01 3.0 Test Procedures 3.1 Package Environmental Tests - These tests are designed to demonstrate that the SOIC family of packages are capable of maintaining the specified parameters throughout their useful life under rated operating conditions. The HMC182S14 was chosen to qualify the SOIC package family. The results of these tests qualify by similarity all other product using the same package. 3.1.1 Initial Characteristics - 196 HMC182S14 devices were electrically tested for DC and critical RF parameters. These tests are performed at ambient temperature (+25°C). This test was performed at Hittite. There were no failures in this test. 3.1.2 Temperature Cycle - 116 devices from 3.1.1 were subjected to 200 cycles of non-operating temperature cycling from -65°C to 150°C. This test was performed at Test Labs in Woburn, MA. 3.1.3 Final Electrical Test - 116 devices from 3.1.2 were electrically tested at ambient temperature to DC and critical RF parameters. Any out of specification parameter was considered a failure. This test was performed at Hittite. There were no failures in this test. 3.1.4 Autoclave - 80 devices from 3.1.1 were subjected to 96 hours of humidity (100%), temperature (121°C) and pressure (15 PSIG). This test was performed at Qualified Parts Lab in Santa Clara, CA. 3.1.5 Final Electrical Test - 80 devices from 3.1.4 were electrically tested at ambient temperature to DC and critical RF parameters. Any out of specification parameter was considered a failure. This test was performed at Hittite within 48 hours after removal from the chamber. There were no failures in this test. 3.2 Package Mechanical Tests 3.2.1 Coplanarity - 80 devices were measured for lead coplanarity. Coplanarity in excess of .004” (0.1 mm) was considered a reject. These devices need not be electrically functional. Any out of specification parameter was considered a failure. This test was performed at Source Electronics Corp. in Hollis, NH. There were no failures. 3.2.2 Physical Dimensions - 15 devices were measured to the requirement of the data sheet. These devices need not be electrically functional. Any out of specification parameter was considered a failure. This test was performed at Hittite. There were no failures. 3.2.3 Resistance to Solvents - 15 devices were subjected to the resistance to solvents test as specified herein. The devices shall be immersed in isopropyl alcohol for 30 minutes. After the immersion, the parts were scrubbed for 10 seconds each with a stiff bristle brush. The marking were then inspected using 10X magnification for permanency and legibility. These devices need not be electrically functional. Illegible marking was considered a failure. This test was performed at Hittite. There were no failures 3.2.4 Solderability - 45 devices were subjected to the steam aging and solderability test in accordance with MIL-STD-883 Method 2003. These devices need not be electrically functional. This test was performed at Hittite. There were no failures. 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] Page - 4