Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK HMC128 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 1.8 - 5.0 GHz Typical Applications Features The HMC128 is ideal for: Conversion Loss: 7 dB • Microwave & VSAT Radios LO to RF and IF Isolation: >36 dB • Test Equipment Input IP3: +18 dBm • Military EW, ECM, C3I No DC Bias Required • Space Telecom Die Size: 1.45 x 1.45 x 0.1 mm Functional Diagram General Description MIXERS - DOUBLE-BALANCED - CHIP 4 The HMC128 is a miniature double-balanced mixer chip that can be used as an upconverter or downconverter. The device is a passive diode/balun type mixer with high dynamic range. Noise figure is essentially equal to the conversion loss. The mixer can handle larger signal levels than active mixers due to the high third order intercept. MMIC implementation provides exceptional balance in the circuit resulting in high LO/ RF and LO/IF isolations. This mixer can operate over a wide LO Drive input of +9 to +15 dBm. Electrical Specifi cations, TA = +25° C, LO Drive = +15 dBm* Parameter Min. Frequency Range, RF & LO Typ. Max. 1.8 - 5.0 Frequency Range, IF GHz DC - 3 GHz Conversion Loss 7 10 dB Noise Figure (SSB) 7 10 dB LO to RF Isolation 35 42 dB LO to IF Isolation 27 36 dB IP3 (Input) 15 18 dBm IP2 (Input) 45 50 dBm 1 dB Gain Compression (Input) 5 10 dBm * Unless otherwise noted, all measurements performed as downconverter, IF = 100 MHz 4-2 Units For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC128 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 1.8 - 5.0 GHz Conversion Gain vs . Temperature @ LO = +15 dBm Isolation @ LO = +15 dBm 0 0 -10 +25 C +85 C -55 C -15 RF/IF LO/RF LO/IF -20 -30 4 -40 -50 -60 -20 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1 1.5 2 2.5 FREQUENCY (GHz) Conversion Gain vs. LO Drive 5.5 6 5 5.5 6 5 5.5 6 0 RETURN LOSS (dB) CONVERSION GAIN (dB) 5 LO and RF Return Loss 0 -5 -10 +9 dBm +11 dBm +13 dBm +15 dBm -15 -5 -10 RF LO -15 -20 -20 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1 1.5 2 2.5 FREQUENCY (GHz) 3 3.5 4 4.5 FREQUENCY (GHz) Upconverter Performance Conversion Gain vs. LO Drive IF Bandwidth @ LO = +15 dBm 0 CONVERSION GAIN (dB) 0 RESPONSE (dB) 3 3.5 4 4.5 Frequency (GHz) -5 -10 -15 -5 -10 + 9 dBm + 11 dBm + 13 dBm + 15 dBm -15 IF CONVERSION LOSS IF RETURN LOSS -20 MIXERS - DOUBLE-BALANCED - CHIP ISOLATION (dB) CONVERSION GAIN (dB) -10 -5 -20 0 1 2 3 FREQUENCY (GHz) 4 5 1 1.5 2 2.5 3 3.5 4 4.5 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4-3 HMC128 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 1.8 - 5.0 GHz Input IP3 vs. Temperature @ LO = +15 dBm Input IP3 vs. LO Drive 30 30 +11 dBm +13 dBm +15 dBm 20 15 10 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1 1.5 2 2.5 FREQUENCY (GHz) 3.5 4 4.5 5 5.5 6 5 5.5 6 Input IP2 vs. Temperature @ LO = +15 dBm Input IP2 vs LO Drive 80 80 75 75 70 65 +25 C +85 C -55 C 70 + 11 dBm + 13 dBm + 15 dBm IP2 (dBm) IP2 (dBm) 3 FREQUENCY (GHz) 60 55 65 60 55 50 50 45 45 40 40 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1 1.5 2 FREQUENCY (GHz) 2.5 3 3.5 4 4.5 FREQUENCY (GHz) Input P1dB vs. Temperature @ LO = +15 dBm Harmonics of LO 15 nLO Spur @ RF Port 14 + 25 C + 85 C - 55 C 13 12 11 10 9 8 LO Freq. (GHz) 1 2 3 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) 4.5 5 5.5 4 1.5 54 42 54 54 2.0 48 41 50 66 2.5 47 41 44 76 3.5 40 50 52 75 4.5 40 60 51 65 5.5 38 60 46 63 LO = +13 dBm All values in dBc below input LO level measured at RF port. 7 4-4 20 15 10 P1dB (dBm) MIXERS - DOUBLE-BALANCED - CHIP 4 + 25 C + 85 C - 55 C 25 IP3 (dBm) IP3 (dBm) 25 6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC128 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 1.8 - 5.0 GHz Absolute Maximum Ratings MxN Spurious @ IF Port nLO mRF 0 1 2 3 4 0 xx 5.6 30.3 11.1 34.5 1 2.8 0 23.3 31.5 29.1 2 62.3 58.6 57.8 60.3 75.8 3 74.3 >85 74.3 65.8 74.3 4 >85 >85 >85 >85 >85 LO Drive +27 dBm Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 4 MIXERS - DOUBLE-BALANCED - CHIP RF Freq.= 3.5 GHz @ -10 dBm LO Freq.= 3.4 GHz @ +13 dBm All values in dBc below IF power level. Measured as downconverter Outline Drawing Die Packaging Information [1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] Standard Alternate WP-3 (Waffle Pack) [2] 2. BOND PADS ARE .004” SQUARE 3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006” .1 EXCEPT AS SHOWN [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 4. DIE THICKNESS = .004” [.100 MM] 5. BACKSIDE METALIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4-5 HMC128 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 1.8 - 5.0 GHz Pad Descriptions Pad Number Function Description 1 LO This pin is DC coupled and matched to 50 Ohms. 2 IF This pin is DC coupled. For applications not requiring operation to DC, this port should be DC blocked externally using a series capacitor whose value has been chosen to pass the necessary IF frequency range. For operation to DC this pin must not source or sink more than 2mA of current or die non-function and possible die failure will result. 3 RF This pin is DC coupled and matched to 50 Ohms. GND The backside of the die must connect to RF ground. MIXERS - DOUBLE-BALANCED - CHIP 4 4-6 Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC128 v03.1007 GaAs MMIC DOUBLE-BALANCED MIXER, 1.8 - 5.0 GHz Assembly Diagram Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting MIXERS - DOUBLE-BALANCED - CHIP 4 The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 4-7