05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ 200W LOW CAPACITANCE unbumped flip chip tvs array Description The ULC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In addition, the ULC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. Features applications • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • ESD Protection > 25 kilovolts • Available in Voltages Ranging from 3.3V to 36V • 200 Watts Peak Pulse Power per Line (tp = 8/20µs) • Bidirectional and Monolithic Structure • Low Clamping Voltage • Low Capacitance • Protection for 1 Line • RoHS Compliant • REACH Compliant • SMART Phones • Portable Electronics • SMART Cards Mechanical characteristics • Standard EIA Chip Size: 0402 • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Flammability Rating UL 94V-0 • 8mm Plastic Tape per EIA Standard 481 PIN CONFIGURATION 05152.R11 10/12 Page 1 www.protekdevices.com 05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ typical device characteristics MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature SYMBOL VALUE UNITS PPP 200 Watts TA -55 to 150 °C TSTG -55 to 150 °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE V WM VOLTS @ 1mA V(BR) VOLTS MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ I P = 1A VC VOLTS MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ 8/20µs VC @ IPP MAXIMUM LEAKAGE CURRENT (Note 2) @V WM ID µA TYPICAL CAPACITANCE @0V, 1MHz C pF ULC0402FC3.3C 3.3 4.0 7.0 12.5V @ 16A 75* 70 ULC0402FC05C 5.9 6.0 11.0 13.0V @ 15A 10** 35 ULC0402FC08C 8.0 8.5 13.2 18.0V @ 11A 1 32 ULC0402FC12C 12.0 13.3 19.8 26.9V @ 7.4A 1 30 ULC0402FC15C 15.0 16.7 25.4 34.5V @ 5.8A 1 25 ULC0402FC24C 24.0 26.7 37.2 50.6V @ 4A 1 20 ULC0402FC36C 36.0 40.0 70.0 80.0V @ 2.5A 1 18 notes 1. All devices are bidirectional. Electrical characteristics apply in both directions. 2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V. 05152.R11 10/12 Page 2 www.protekdevices.com 05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ typical device characteristics figure 1 peak pulse power vs pulse time PPP - Peak Pulse Power - Watts 10,000 1,000 200W, 8/20µs Waveform 100 10 0.1 10 100 td - Pulse Duration - µs Peak Value IPP 80 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs e-t 60 40 10,000 figure 3 power derating curve Peak Pulse Power 8/20µs 80 % Of Rated Power tf 100 td = t/(IPP/2) 60 40 20 20 0 1,000 figure 2 pulse wave form 120 IPP - Peak Pulse Current - % of IPP 1 0 05152.R11 10/12 5 10 15 t - Time - µs 20 25 0 30 Page 3 Average Power 0 25 50 75 100 125 TA - Ambient Temperature - °C 150 www.protekdevices.com 05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ typical device characteristics figure 4 overshoot & clamping voltage for ULC0402fc05c 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape) figure 5 typical clamping voltage vs peak pulse current ULC0402fc05c VC - Clamping Voltage - Volts 12 8 4 0 0 05152.R11 10/12 5 10 IPP - Peak Pulse Current - Amps Page 4 15 20 www.protekdevices.com 05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ SOLDER REFLOW INFORMATION printed circuit board recommendations parameter value Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity (Only applies to bumped devices) ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C Requirements recommended non-solder mask defined pad illustration Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) TP Solder Melt (Maximum Temp) Temperature - °C Ramp-Up Ramp-Down Preheat (Stay Below Flux Activation Temp) 30-60 seconds 05152.R11 10/12 Ramp-Up 15 seconds (Minimize) Page 5 Solder-Time 15-20 seconds Ramp-Down www.protekdevices.com 05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ U0402 package information outline dimensions millimeters min max inches min max A 0.61 0.024 B 0.86 0.034 C 0.98 1.02 0.038 D 0.10 0.004 E 0.35 0.014 F 0.458 I 0.508 0.018 0.406 TOP 0.040 A SIDE dim B C 0.020 0.016 Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Maximum chip size: 1.02mm (0.040”) by 0.51mm (0.020”). D E F Metalized Die Contacts END C B layout dimensions inches nominal nominal A 0.23 0.009 B 0.48 0.019 C 0.69 0.027 D 0.46 0.018 E 0.99 0.039 F 0.20 0.008 G 0.20 0.008 H 0.66 0.026 I 0.13 0.005 D A SOLDER PAD millimeters dim I DIE DIE CONTACTS F E H I Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 05152.R11 10/12 SOLDER PRINT DIAMETER 0.010” - 0.012” Page 6 G www.protekdevices.com 05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ TAPE AND REEL information P0 D T 10 Pitches Cumulative Tolerance on tape ± 0.2 E P2 Top Cover Tape F A0 K0 W B0 P User Direction of Feed specifications Reel Dia. Tape Width 178(7”) 8 A0 B0 K0 D E F P0 P2 P tmax 0.70 ± 0.05 1.15 ± 0.10 0.56 ± 0.05 1.55 ± 0.05 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 Notes 1. 2. 3. 4. 5. 6. W 0.25 tape & reel orientation Dimensions in millimeters. Top view of tape. Metal contacts are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004”). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 5,000 (pocket under hole skipped) pieces per reel. Marking on Reel - part number, date code and lot number. Single Die - 0402 Package outline, pad layout and tape specifications per document number 06020.R6 8/12. ORDERING INFORMATION base PART NUMBER (xx = voltage) LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE qty ULC0402FCxxC n/a -T75-1 5,000 7” n/a This device is only available in a Lead-Free configuration. 05152.R11 10/12 Page 7 www.protekdevices.com 05152 ULC0402FC3.3C - ULC0402FC36C Only One Name Means ProTek’Tion™ company information COMPANY PROFILE In business more than 20 years, ProTek Devices™ is a privately-held company located in Tempe, Arizona, that offers a product line of transient voltage suppressors (TVS); avalanche breakdown diodes; steering diode TVS arrays and other surge suppressor component products. These TVS devices protect electronic systems from the effects of lightning, electrostatic discharge (ESD), nuclear electromagnetic pulses (NEMP), inductive switching and EMI / RFI. ProTek Devices also offers high performance interface and linear products that include analog switches; multiplexers; LED drivers; audio control ICs; RF and related high frequency products. The analog devices work in a host of consumer; industrial; automotive and other applications. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: & Marketing: 602-414-5109 Customer Service: 602-414-5114 Product Technical Support: 602-414-5107 By Fax General: 602-431-2288 By E-mail: Sales: [email protected] Customer Service: [email protected] Technical Support: [email protected] ProTek Devices (Asia Pacific) Pte. Ltd. 8 Ubi Road 2, #06-19 Zervex Singapore - 408538 Tel: +65-67488312 Fax: +65-67488313 Web www.protekdevices.com COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05152.R11 10/12 Page 8 www.protekdevices.com