0 Features § forward current ≦30mA § Wide viewing angle:120° § Operating Temperature -30~80℃ § Storage temperature-40~100℃ § Junction Temperature110℃ § ROHS and REACH-compliant § PACKAGE:2000 PCS/REEL. § Qualified according to JEDEC moisturevity Level 3 § Chip material: InGaN § Reverse Voltage:5V 0000000000000000000000000000000000000000000000000000000 Product Identification Code 1 Process Type Category 00000000000000 0 0 LED Type 0 Size S C 3020 W32F 0 W C 05 Special White code PCB module code Cap color Lap polarity Dice wavelength 0 0 0 Electrical-Optical Characteristics（Ta=25℃） Value Symbol Parameter Min. Typ. Max. Unit Test condition Forward Voltage Vf 2.8 3.2 3.8 V If=20mA Luminous intensity Iv 1850 2050 ﹍ mcd If=20mA X 0.312 ﹍ ﹍ If=20mA Y 0.3188 ﹍ ﹍ If=20mA ﹍ ﹍ 10 μ A Vr=5V ﹍ 120 ﹍ Deg If=20mA Wavelength Reverse Current Ir Viewing angle 2θ 1/2 ▲ .Luminous intensity (IV) ±10%, Forward Voltage(VF) ±0.1V, Wavelength(X、Y )±0.01 0000000000000000000000000000000000000000000000000000000 2.IS standard testing Range of bins Bin BinB BinC BinD BinE BinF BinG BinH VF(v) 2.8-2.9 2.9-3.0 3.0-3.1 3.1-3.2 3.2-3.3 3.3-3.4 3.4-3.5 Bin BinI VF(v) 3.5-3.6 Bin6 Bin7 Bin8 2050-2250 2250-2450 2450-2650 SQ4 SQ5 SR3 SR4 SR5 00000000000000 Bin5 Bin 0 Iv(mcd) 1850-2050 0 Bin 0 WL(nm) SQ3 0 0 0 Color Coordinate Comparison X Y X Y X BIN 碼 0000000000000000000000000000000000000000000000000000000 Y X Y SQ3 0.3124 0.3142 0.3136 0.3060 0.3234 0.3151 0.3229 0.3240 SQ4 0.3110 0.3230 0.3124 0.3142 0.3229 0.3240 0.3222 0.3331 SQ5 0.3095 0.3320 0.3110 0.3230 0.3222 0.3331 0.3214 0.3434 SR3 0.3030 0.3050 0.3050 0.2972 0.3136 0.3060 0.3124 0.3142 SR4 0.3011 0.3127 0.3030 0.3050 0.3124 0.3142 0.3110 0.3230 SR5 0.2989 0.3213 0.3011 0.3127 0.3110 0.3230 0.3095 0.3320 Relative Radiant Intensity 00000000000000 0 Relative Spectral Power Distribution 0 1.0 0 0.75 0.5 0.25 0 350 400 450 500 550 600 650 Wavelength(nm) 0 700 750 Relative luminous Intensity(%) Optical Characteristics-1 Typical Spatial Distribution Genealogies angle 0 0 Optical Characteristics -2 150 125 100 75 50 25 0 0 10 5 15 20 25 Relative Luminous Flux .Ambient Temperature Relative Luminous intensity(%) Relative Lumious Flux(%) Relative Luminous Flux .Current 30 Forward Current (mA) Ambient Temperature(°) Electrical Characteristics Thermal Design 25 20 15 10 5 0 1.5 2 2.5 3 3.5 Maximum Current(mA) Forward Current IF(mA) 0000000000000000000000000000000000000000000000000000000 30 Forward Voltage VF(V) Ambient Temperature(°) Ambient Temperature(°) Light effect VS Current Light effect(%) Relative Forward Voltage(%) 00000000000000 Forward Voltage Temperature 0 0 0 Forward Current (mA) 0 0 0 Outline Dimensions 0000000000000000000000000000000000000000000000000000000 REC0MMEND PADLAYOUT 00000000000000 0 0 0 § All dimensions are in millimeters. § Tolerance is ±0.1 ㎜ unless other specified § Specifications are subject to change without notice. 0 0 0 Reflow Profile 1. IR reflow soldering Profile Lead Free solder 300 ℃ 250 temperature 10sec. max 1-5℃/sec 2-5℃/sec 230℃ max Pre heating 150-180℃ 200 260℃ max 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec 2.IR reflow soldering Profile Lead solder 0000000000000000000000000000000000000000000000000000000 300 ℃ 1-5℃/sec temperature 250 10sec. max 210℃ max Pre heating 150-180℃ 200 240℃ max 2-5℃/sec 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 00000000000000 0 0 NOTES: 0 0 50 100 Time 150 200 250 300 sec 1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2.Don’t cause stress to the silicone resin while it is exposed to high temperature. 3.Number of reflow process shall be 1 time. 0 0 0 Test circuit and handling precautions Test circuit V LED Handling precautions 1. Over-current-proof 0000000000000000000000000000000000000000000000000000000 Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is 00000000000000 Opened, the products should be used within a week or they should be keeping to stored at 0 ≦20%R.H. with zip-lock sealed. 0 3.Baking 0 It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70±3℃ x 24hrs and ＜5%RH, taped reel type 3.2 100±3℃ x 2hrs , bulk type 3.3 130±3℃ x(15~30min), bulk type It shall be normal to see slight color fading of carrier(light yellow) after baking in process 0 0 0 Packing -1 3020 Single-Color High Performance SMD Top LEDs Packaging Specifications Feeding Direction Dimensions of Reel (Unit: mm) Feeding Direction Dimensions of Tape (Unit: mm) Polarity Mark 0000000000000000000000000000000000000000000000000000000 Arrangement of Tape 00000000000000 0 0 0 NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing smds is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4. 2,000pcs/Reel 0 0 0 Packing-2 3020 Single-Color High Performance SMD Top LEDs Packaging Specifications Packaging specifications 0000000000000000000000000000000000000000000000000000000 NOTES: 00000000000000 Reeled products (The most numbers of products are 2,000pcs) packed in a seal off moisture-proof bag 0 0 along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of 0 products are 14,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the section request form on the cardboard box.) . 0 0 0 Precautions 1、Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. Outer diameter of collet should be larger than the lighting area Outer diameter of collet 0000000000000000000000000000000000000000000000000000000 Picture 1（） Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 00000000000000 0 0 0 Picture 3（） Picture 4（×） No.3、Other points for attention A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0 0 Test items and results of reliability Type Test Item Test Standard Test Conditions Environmental Sequence Temperature Cycle Thermal Shock High Temperature Storage Humidity Heat Storage JEITA ED-4701 300 303 JEITA ED-4701 200 303 JEITA ED-4701 200 201 Note Number of Damaged 100 cycle 0/50 20 cycle 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 500 hrs 0/22 1000 hrs 0/22 -40℃ 30min ↑↓5 min 100℃ 30min -10℃ 15min ↑↓5sec 100℃ 15min Ta=100℃ JEITA ED-4701 Ta=60℃ 100 103 RH=90% 0000000000000000000000000000000000000000000000000000000 Low Temperature Storage JEITA ED-4701 200 202 Tested with Life Test Brightek Operation Sequence standard High Humidity Heat Life Test 00000000000000 Low Temperature Life Test 0 0 0 Tested with Brightek standard Tested with Brightek standard Ta=-40℃ Ta=25℃ IF=20mA 60℃ RH=90% IF=15mA Ta=-20℃ IF=20mA Judgment criteria of failure for the reliability Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage Vf(V) IF=20mA Over U×1.2 Reverse current IR(uA) Vr=5V Over U×2 0 0