YS 2835D1W80 6000K

RoHS
Specification
规 格 书
Customer Name：
客户名称：
Customer P/N：
客户品号：
Factory P/N： YS - 2835D1W80 Series
公司品号：
Sending Date：
送样日期：
Client approval
approval
客户审核
早安审核
Approval
Audit
Confirmation
Approval
Audit
Confirmation
核准
确认
制作
核准
确认
制作
林德顺
□ Qualified
□ Disqualified
接受
不接受
黄雪梅
DATE:
日期：
注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本.
2.此规格书的最终解释权归早安 股份有限公司
3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式
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PAGE: 1 OF 14
YS - 2835D1W80 Series
Features( 特征）
PLCC-2 Package.(PLCC-2 封装）
Extremely wide viewing angle.（宽的发光角度）
Suitable for all SMT assembly and solder process.（适用于所有的SMT组装和焊接工艺）
Available on tape and reel.（适用于载带及卷轴）
Moisture sensitivity level: Level 4.（防潮等级 Level 4）
Package:4000pcs/reel..(包装每卷4000PCS）
RoHS compliant. (RoHS 认证）
ATTENTION
Description（ 述）
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
The White LED which was fabricated using a blue chip and the phosphor
白光LED由蓝光芯片与荧光粉激发而成
注意：操作时应注意静电敏感
释放设备装置
Applications（应用）
■ Optical indicator（光学指示）
光学指示）
Package Dimensions（
Dimensions 封装尺寸）
室内显示）
■ Indoor display（室内显示）
3.50 [0.14]
汽车照明）
■ Automotive lighting（汽车照明）
3.30 [0.13]
■ Backlight for LCD, switch and Symbol, display
■ Tubular light application（用于日光灯管）
一般应用）
■ General use（一般应用）
2.80 [0.11]
2.10 [0.08]
LCD背光、转换器，开关和标志，显示器等）
（LCD背光、转换器，开关和标志，显示器等）
0.60 [0.02]
2.60 [0.10]
1.00 [0.04]
0.92 [0.04]
1.80 [0.07]
2.10 [0.08]
2.55 [0.10]
0.60 [0.02]
0.75 [0.03]
Recommended Soldering Pattern
（建议焊盘尺寸图
图）
0.45 [0.02]
2.95 [0.12]
1.99 [0.08]
Notes:（备注）
1. All dimension units are millimeters.（所有标注尺寸单位为毫米）
2.All dimension tolerance is ±0.15mm unless otherwise noted.（除特别标注外，所有尺寸允许公差±0.15mm ）
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PAGE: 2 OF 14
YS - 2835D1W80 Series
Selection Guide（选择指南）
Part No. 型号
Chip Materials 芯片材料
Lens Type 胶体类型
YS -2835D1W80 - Series
InGaN
Yellow Diffused
Mass Production list（批量生产目录）
CCT（K）
Min
CCT（K）
Typ
CCT（K）
Max
Φ（lm）
Min
Φ（lm）
Typ
Test Conditions
测试条件
YS -2835D1W80 - 6000K
5700
6000
6500
53
58
IF=150mA
YS -2835D1W80 - 5000K
4750
5000
5300
53
58
IF=150mA
YS -2835D1W80 - 4000K
3800
4000
4250
53
58
IF=150mA
YS -2835D1W80 - 3000K
2800
3000
3100
50
55
IF=150mA
Part No. 型号
Electrical
ectrical / Optical Characteristics at Ta=25°C
电
性
Parameter（参数）
（参数）
Symbol
（符号）
Min.
（最小）
Typ.
（平均）
Max.
（最大）
Units
（单位）
Test Conditions
测试条件
Forward
rward Voltage
正向电压
VF
2.8
--
3.4
V
IF=150mA
Viewing
ewing Angle
角度
2θ1/2
--
120
--
deg
IF=150mA
Color
lor Rendering Index
显色性指数
Ra
80
--
--
Reverse Current
反向电流
IR
--
--
10
IF=150mA
μA
VR = 5V
Note:(备注）
21/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
21/2 是半值角,指光强是光学中心线光强的1/2处到光学中心线的角度
2. The above luminous flux measurement allowance tolerance is ±10%.
上述发光通量的测试允许公差为±10%
3. The above Color Rendering Index measurement allowance tolerance is ±2
以上显色性指数的测试允许公差为±2
4. The above forward voltage measurement allowance tolerance is ±0.1V.
以上所示电压测量误差±0.1V
5. The above color coordinates measurement allowance tolerance is ±0.003.
以上所示坐标测量误差±0.003
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PAGE: 3 OF 14
YS - 2835D1W80 Series
Absolute Maximum Ratings at Ta=25°C
绝对最大额定值
Parameter（参数）
Symbol（符号）
Rating（值）
Units（单位）
Power Dissipation（功耗）
Pd
500
mW
Forward Current（正向电流）
IF
150
mA
Peak
ak Forward Current [1]（峰值正向电流）
IFP
200
mA
Reverse
verse Voltage（反向电压）
VR
5
V
Electrostatic
ectrostatic Discharge (HBM)（静电）
ESD
1000
V
Operating
erating Temperature（操作温度）
Topr
-40 ~ +85
℃
Storage
orage Temperature（保存温度）
Tstg
-40 ~ +100
℃
Rthj-s
22
℃/W
Tj
115
℃
Thermal
ermal Resistance （Junction / Soldering
point）
热阻
Junction
ction Temperature结温
Note:（备注）
1. 1/10 Duty cycle, 0.1ms pulse width.（脉宽0.1ms,周期1/10）
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PAGE: 4 OF 14
YS - 2835D1W80 Series
Typical optical characteristics curves 典型光学特性曲线
Forward Current VS. Relative Intensity
Soldering Temperature vs. Forward Current
正向电流与相对光强特性曲线
焊盘温度与正向电流特性曲线
1.4
Relative Luminous Intensity
Forward Current(mA)
200
150
100
50
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
0
0
20
40
60
80
Soldering Temperature
50
150
200
Forward Current(mA)
100
Ts(℃)
Forward Voltage VS. Forward Current
100
Ambient Temperature VS. Relative Intensity
正向电压与正向电流特性曲线
环境温度与相对光强特性曲线
3.0
160
Relative Luminous Intensity
140
Forward Current(mA)
120
100
80
60
40
20
2.5
2.0
1.5
1.0
0.5
0
0
0.5
1
1.5
2
2.5
Forward Voltage (V)
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3
3.5
0.0
-40
-20
0
20
Ambient Temperature
40
60
80
Ta(℃)
PAGE: 5 OF 14
YS - 2835D1W80 Series
Typical optical characteristics curves 典型光学特性曲线
Relative spectral emission
Cool White
相对光谱分布特性曲线
Warm White
Neural White
Relative luminous intensity
1.0
0.8
0.6
0.4
0.2
0.0
380
460
540
620
Wavelength(nm)
Radiation diagram
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700
780
辐射图特性曲线
PAGE: 6 OF 14
YS - 2835D1W80 Series
Y0.44
3000K
0.42
W42
W43
0.4
4000K
W44
W52 W62
W53 W63
W54
W64
N52
N42
0.38
N53
5000K
N43
N12
0.36
C62
N13
6000K
00K
C42
0.34
C63
C32
C43
0.32
0.3
0.3
0.32
0.34
0.36
0.38
0.4
0.42
0.44
0.46
X
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PAGE: 7 OF 14
YS - 2835D1W80 Series
Bin Range of Chromaticity Coordinate Bin区分类及色坐标范围
CCT 色温
Bin Code Bin代码
CIE_x
CIE_y
0.3205
0.3481
0.3117
0.3393
C32 6000-6500K
Bin Code Bin代码
CIE_x
CIE_y
0.3211
0.3468
0.3294
0.3542
C42 5700-6000K
0.3131
0.329
0.3296
0.3429
0.3213
0.3371
0.3219
0.3360
0.3213
0.3371
0.3219
0.3360
0.3131
0.329
0.3296
0.3429
6000K
C33
3 6000-6500K
C43 5700-6000K
0.3150
0.3190
0.3298
0.3315
0.3226
0.3262
0.3227
0.3251
0.3376
0.3616
0.3461
0.3685
0.3461
0.3685
0.3545
0.3754
C62
2 5000-5300K
N12 4750-5000K
0.3451
0.3561
0.3530
0.3625
0.3372
0.3497
0.3451
0.3561
0.3372
0.3497
0.3451
0.3561
0.3451
0.3561
0.3530
0.3625
5000K
C63
3 5000-5300K
N13 4750-5000K
0.3441
0.3437
0.3514
0.3496
0.3368
0.3378
0.3441
0.3437
0.3731
0.3853
0.3839
0.3920
0.3839
0.3920
0.3947
0.3987
N42 4000-4250K
N52 3800-4000K
0.3803
0.3777
0.3903
0.3839
0.3703
0.3716
0.3803
0.3777
0.3703
0.3716
0.3803
0.3777
0.3803
0.3777
0.3903
0.3839
4000K
N43 4000-4250K
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N53 3800-4000K
0.3767
0.3634
0.3858
0.3690
0.3675
0.3578
0.3767
0.3634
PAGE: 8 OF 14
YS - 2835D1W80 Series
Bin Range of Chromaticity Coordinate Bin区分类及色坐标范围
CCT 色温
Bin Code Bin代码
CIE_x
CIE_y
0.4354
0.4142
0.4430
0.4165
W42 3000-3100K
CIE_x
CIE_y
0.4316
0.4059
0.4390
0.4082
W43 3000-3100K
0.4390
0.4082
0.4350
0.3998
0.4316
0.4059
0.4279
0.3975
0.4279
0.3975
0.4430
0.4165
0.4350
0.3998
0.4505
0.4189
W44
4 3000-3100K
3000K
Bin Code Bin代码
W52 2900-3000K
0.4310
0.3915
0.4463
0.4106
0.4241
0.3892
0.4390
0.4082
0.4390
0.4082
0.4350
0.3998
0.4463
0.4106
0.4420
0.4022
W53
3 2900-3000K
W54 2900-3000K
0.4420
0.4022
0.4378
0.3939
0.4350
0.3998
0.4310
0.3915
0.4505
0.4189
0.4463
0.4106
0.4581
0.4212
0.4536
0.4129
W62
2 2800-2900K
W63 2800-2900K
0.4536
0.4129
0.4492
0.4045
0.4463
0.4106
0.4420
0.4022
0.4420
0.4022
0.4492
0.4045
0.4447
0.3962
0.4378
0.3939
W64 2800-2900K
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PAGE: 9 OF 14
YS - 2835D1W80 Series
Reliability Test Items And Conditions 信赖性测试项目及条件
Test Items
项目
Ref. Standard
参考标准
Test Condition
测试条件
Time
时间
Quantity
数量
Ac/Re
接收/拒收
Reflow
回流焊
JESD22-B106
Temp:260℃max
T=10 sec
3 times.
22Pcs.
0/1
Temperature Cycle
温度循环
JESD22-A104
100℃±5℃ 30 min.
↑↓5 min
-40℃±5℃ 30 min.
100 Cycles
22Pcs.
0/1
High Temperature Storage
高温保存
JESD22-A103
Temp:100℃±5℃
1000Hrs.
22Pcs.
0/1
Low
w Temperature Storage
低温保存
JESD22-A119
Temp:-40℃±5℃
1000Hrs.
22Pcs.
0/1
Life Test
常温通电
JESD22-A108
Ta=25℃±5℃
IF=150mA
1000Hrs.
22Pcs.
0/1
High
gh Temperature
High Humidity Life Test
高温高湿通电
JESD22-A101
85℃±5℃/ 85%RH
IF=100mA
1000Hrs.
22Pcs.
0/1
Failure Criteria 失
Test Items
项目
Symbol
符号
Failure Criteria
判定标准
Test Condition
测试条件
Min. 最小
Max. 最大
Forward Voltage
正向电压
VF
IF=150mA
--
U.S.L*)x1.1
Reverse Current
反向电流
IR
VR = 5V
--
U.S.L*)x2.0
Luminous Flux
光通量
Lm
IF=150mA
L.S.L*)x0.7
--
U.S.L: Upper Specification Limit 规格上限
L.S.L: Lower Specification Limit 规格下限
*The technical information shown in the data sheets is limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license.
数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许可的
授权.
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PAGE: 10 OF 14
YS - 2835D1W80 Series
SMT Reflow Soldering Instructions SMT回流焊说明
1.Reflow soldering should not be done more than two times. 回流焊不可以做两次以上
2.When soldering , do not put stress on the LEDs during heating
当焊接时，不要在材料受热时用力压胶体表面
Soldering iron
1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds
当手工焊接时，烙铁的温度必须小于300℃，时间不可超过3秒
2.The hand solder should be done only one times
手工焊接只可焊接一次
Repairing 修补
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used (as below figure). It should be confirmed in advance
whether the characteristics of LEDs will or will not be damaged by repairing.
LED回流焊后不应该修复，当修复是不可避免时，必须使用双头烙铁（如下图），但必须事先确认此种方式会或不会
损坏LED本身的特性。
Cautions 注意事项
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on
the top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use
the picking up nozzle, the pressure on the silicone resin should be proper.
LED封装为硅胶，故LED胶体表面较软，用力按压胶体表面会影响LED可靠性，因此应有预防措施避免在封装的零件上的
强大压力，当使用吸嘴时，胶体表面的压力应是恰当的。
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PAGE: 11 OF 14
YS - 2835D1W80 Series
Handling Precautions 处理防备措施
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its
characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force . As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED products, Failure to comply might leads to damage and premature failure of
the LED.
相对环氧树脂较脆较硬而言，硅胶封装较柔软且有弹性，虽然它的特性大大减少了热应力，但易受机械外力损坏，因此
在手工处理方面须要对硅胶封装材料做预防措施，若未按要求操作，可能会导致LED损坏和光衰
1.Handle the component along the side surface by using forceps or appropriate tools; do not directly
touch or Handle the silicone lens surface, it may damage the internal circuitry.
通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路
2.The
The outer diameter of the SMD pickup nozzle should not exceed the size
of the LED to prevent air leaks. The inner diameter of the nozzle should be
as large as possible. A pliable material is suggested for the nozzle tip to avoid
scratching or damaging the LED surface during pickup. The dimensions of the
component must be accurately programmed in the pick-and-place machine to
insure precise pickup and avoid damage during production.
为防止气压泄漏，SMD吸咀外径不可以超过LED尺寸，吸咀内径尺寸应尽可能大，吸咀顶端材
质建议采用柔软材料以防在吸取期间刮伤或损坏LED胶体表面，元件的尺寸必须在取放机里准
确的编程好，以确保精确的吸取和避免生产过程中的损害
3.Do not stack together assembled PCBs containing
LEDs. Impact may scratch the silicone lens or damage
the internal circuitry
4.Not suitable to operate in acidic environment, PH<7
不可用在PH<7的酸性场所
不可将模组材料堆积在一起，它可能会损坏内部电路
<PH7
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PAGE: 12 OF 14
5.LED operating environment and sulfur element composition cannot be over 100PPM in the LED
mating usage material.
LED工作环境及与LED适配的材料中硫元素及化合物成份不可超过100PPM
6.When we need to use external glue for LED application products, please make sure that the external glue matches the LED packaging glue. Additionally ,as most of LED packaging glue is silica gel,
and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LED, which may cause the malfunction of LED, the single
content of Bromine element is required to be less than 900PPM,the single content of Chlorine element
is required to be less than 900PPM,the total content of Bromine element and Chlorine element in the
external glue of the application products is required to be less than 1500PPM
当我们需要使用外封胶涂抹LED产品时，应确保外封胶与LED封装胶水相匹配，因为大多数LED的封装胶水为硅胶，它有较
强的氧化性和较强的吸湿性，必须防止外封材质进入LED内部以造成LED的损伤，单一的溴元素含量要求小于900PPM，单
一氯元素含量要求小于900PPM，在涂抹LED产品时要求外封胶溴元素与氯元素总含量必须小于1500PPM
7.Other points for attention, please refer to our LED user manual.
其它注意事项请参照我们的LED使用手册
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PAGE: 13 OF 14
YS - 2835D1W80 Series
Label 标签
IV: Luminous intensity rank 亮度等级
VF: Forward voltage rank
电压等级
X/Y: Coordinate rank
色坐标
色温
TC: Color temperature
Reel Dimensions
卷轴尺寸
178.00±0.20
载带规格（单位：mm)
60.00±0.40
Tape Specifications (Units : mm)
13
±
.50
0
0.3
8.00±0.50
Moisture Resistant Packaging
防潮带包装
Note: The tolerances unless mentioned is ±0.1mm , Unit: mm
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REV NO: A/2
注：标注公差为±0.1mm ，单位：mm
DATE: MAR/04/2015
PAGE: 14 OF 14