0 RoHS Specification 规 格 书 Customer Name: 客户名称: Customer P/N: 客户品号: Factory P/N:YS-2835H421W80 Series 0000000000000000000000000000000000000000000000000000000 公司品号: Sending Date: 送样日期: Client approval approval 客户审核 早安 审核 Approval Audit Confirmation Approval Audit Confirmation 核准 确认 制作 核准 确认 制作 00000000000000 0 0 □ Qualified 0 接受 林德顺 □ Disqualified 不接受 黄雪梅 DATE: 日期: 注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本. 2.此规格书的最终解释权归早安 股份有限公司 3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式 0 0 http://www.ystone.com.tw PAGE: 1 OF 14 0 YS-2835H421W80 Series Features( 特征) PLCC-2 Package.(PLCC-2 封装) Extremely wide viewing angle.(宽的发光角度) Suitable for all SMT assembly and solder process.(适用于所有的SMT组装和焊接工艺) Available on tape and reel.(适用于载带及卷轴) Moisture sensitivity level: Level 4.(防潮等级 Level 4) Package:4000pcs/reel..(包装每卷4000PCS) RoHS compliant. (RoHS 认证) ATTENTION Description(描述) OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES The White LED which was fabricated using a blue chip and the phosphor 白光LED由蓝光芯片与荧光粉激发而成 注意:操作时应注意静电敏感 释放设备装置 Applications(应用) 0000000000000000000000000000000000000000000000000000000 ■ Optical indicator(光学指示) Package Dimensions(封装尺寸) ■ Indoor display(室内显示) 3.50 [0.14] ■ Automotive lighting(汽车照明) 3.30 [0.13] ■ Backlight for LCD, switch and Symbol, display ■ Tubular light application(用于日光灯管) ■ General use(一般应用) 2.80 [0.11] 2.10 [0.08] (LCD背光、转换器,开关和标志,显示器等) 2.95 [0.12] 0.60 [0.02] 2.60 [0.10] 1.00 [0.04] 0.92 [0.04] 1.80 [0.07] 2.10 [0.08] 2.55 [0.10] 0.60 [0.02] 0.75 [0.03] 0 0 0 0.45 [0.02] Recommended Soldering Pattern 00000000000000 (建议焊盘尺寸图) 1.99 [0.08] Notes:(备注) 1. All dimension units are millimeters.(所有标注尺寸单位为毫米) 2.All dimension tolerance is ±0.15mm unless otherwise noted.(除特别标注外,所有尺寸允许公差±0.15mm ) 0 http://www.ystone.com.tw 0 PAGE: 2 OF 14 0 YS-2835H421W80 Series Selection Guide(选择指南) Part No. 型号 Chip Materials 芯片材料 Lens Type 胶体类型 YS-2835H421W80 Series InGaN Yellow Diffused Mass Production list(批量生产目录) CCT(K) Min CCT(K) Typ CCT(K) Max Φ(lm) Min Φ(lm) Typ Test Conditions 测试条件 YS-2835H421W80-6000K 5700 6000 6500 25 27 IF=60mA YS-2835H421W80-5000K 4750 5000 5300 25 27 IF=60mA 25 27 IF=60mA 24 26 IF=60mA Part No. 型号 0000000000000000000000000000000000000000000000000000000 4000 4250 YS-2835H421W80-4000K 3800 YS-2835H421W80-3000K 2800 3000 3100 Electrical / Optical Characteristics at Ta=25°C 电性与光学特性 Parameter(参数) Symbol (符号) Min. (最小) Typ. (平均) Max. (最大) Units (单位) Test Conditions 测试条件 Forward Voltage 正向电压 VF 2.8 -- 3.4 V IF=60mA Viewing Angle 角度 2θ1/2 -- 120 -- deg IF=60mA Ra 80 -- -- IR -- -- 10 00000000000000 Color Rendering Index 0 显色性指数 0 Reverse Current 反向电流 0 IF=60mA μA VR = 5V Note:(备注) 21/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 21/2 是半值角,指光强是光学中心线光强的1/2处到光学中心线的角度 2. The above luminous flux measurement allowance tolerance is ±10%. 上述发光通量的测试允许公差为±10% 3. The above Color Rendering Index measurement allowance tolerance is ±2 以上显色性指数的测试允许公差为±2 4. The above forward voltage measurement allowance tolerance is ±0.1V. 以上所示电压测量误差±0.1V 5. The above color coordinates measurement allowance tolerance is ±0.003. 以上所示坐标测量误差±0.003 0 http://www.ystone.com.tw 0 PAGE: 3 OF 14 0 YS-2835H421W80 Series Absolute Maximum Ratings at Ta=25°C 绝对最大额定值 Parameter(参数) Symbol(符号) Rating(值) Units(单位) Power Dissipation(功耗) Pd 210 mW Forward Current(正向电流) IF 60 mA Peak Forward Current [1](峰值正向电流) IFP 150 mA Reverse Voltage(反向电压) VR 5 V 1000 V 0000000000000000000000000000000000000000000000000000000 ESD Electrostatic Discharge (HBM)(静电) Operating Temperature(操作温度) Topr -40 ~ +85 ℃ Storage Temperature(保存温度) Tstg -40 ~ +100 ℃ Rthj-s 35 ℃/W Tj 115 ℃ Thermal Resistance (Junction / Soldering point) 热阻 Junction Temperature结温 00000000000000 0 Note:(备注) 0 1. 1/10 Duty cycle, 0.1ms pulse width.(脉宽0.1ms,周期1/10) 0 0 0 http://www.ystone.com.tw PAGE: 4 OF 14 0 YS-2835H421W80 Series Typical optical characteristics curves 典型光学特性曲线 Forward Current VS. Relative Intensity Soldering Temperature vs. Forward Current 正向电流与相对光强特性曲线 焊盘温度与正向电流特性曲线 2.0 Junction Temperture<115℃ Relative Luminous Intensity Forward Current(mA) 100 80 60 1.5 1.0 40 0000000000000000000000000000000000000000000000000000000 20 0.5 0.0 0 0 20 40 60 Soldering Temperature 0 80 100 Ts(℃) Forward Voltage VS. Forward Current 20 30 40 50 60 70 80 90 Forward Current(mA) Ambient Temperature VS. Relative Intensity 正向电压与正向电流特性曲线 环境温度与相对光强特性曲线 3.0 Relative Luminous Intensity 00000000000000 0 0 0 10 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 Ambient Temperature 40 60 80 Ta(℃) 0 0 http://www.ystone.com.tw PAGE: 5 OF 14 0 YS-2835H421W80 Series Typical optical characteristics curves 典型光学特性曲线 Relative spectral emission Cool White 相对光谱分布特性曲线 Warm White Neural White Relative luminous intensity 1.0 0.8 0.6 0.4 0000000000000000000000000000000000000000000000000000000 0.2 0.0 380 460 540 620 Wavelength(nm) Radiation diagram 700 780 辐射图特性曲线 00000000000000 0 0 0 0 0 http://www.ystone.com.tw PAGE: 6 OF 14 0 YS-2835H421W80 Series Y0.44 3000K 0.42 W42 W43 0.4 4000K W44 W52 W62 W53 W63 W54 W64 N52 N42 0.38 N53 5000K N43 N12 0000000000000000000000000000000000000000000000000000000 0.36 C62 N13 6000K C42 0.34 C63 C32 C43 C33 0.32 0.3 00000000000000 0.3 0 0 0 0.32 0.34 0.36 0.38 0.4 0.42 0.44 0.46 X 0 0 http://www.ystone.com.tw PAGE: 7 OF 14 0 YS-2835H421W80 Series Bin Range of Chromaticity Coordinate Bin区分类及色坐标范围 CCT 色温 Bin Code Bin代码 CIE_x CIE_y 0.3205 0.3481 0.3117 0.3393 C32 6000-6500K Bin Code Bin代码 CIE_x CIE_y 0.3211 0.3468 0.3294 0.3542 C42 5700-6000K 0.3131 0.329 0.3296 0.3429 0.3213 0.3371 0.3219 0.3360 0.3213 0.3371 0.3219 0.3360 0.3131 0.329 0.3296 0.3429 6000K C33 6000-6500K C43 5700-6000K 0.3150 0.3190 0.3298 0.3315 0.3226 0.3262 0.3227 0.3251 0.3461 0.3685 0.3545 0.3754 0.3376 0.3616 0000000000000000000000000000000000000000000000000000000 0.3461 0.3685 C62 5000-5300K N12 4750-5000K 0.3451 0.3561 0.3530 0.3625 0.3372 0.3497 0.3451 0.3561 0.3372 0.3497 0.3451 0.3561 0.3451 0.3561 0.3530 0.3625 5000K C63 5000-5300K 00000000000000 0 0 0 4000K N13 4750-5000K 0.3441 0.3437 0.3514 0.3496 0.3368 0.3378 0.3441 0.3437 0.3731 0.3853 0.3839 0.3920 0.3839 0.3920 0.3947 0.3987 N42 4000-4250K N52 3800-4000K 0.3803 0.3777 0.3903 0.3839 0.3703 0.3716 0.3803 0.3777 0.3703 0.3716 0.3803 0.3777 0.3803 0.3777 0.3903 0.3839 N43 4000-4250K N53 3800-4000K 0.3767 0.3634 0.3858 0.3690 0.3675 0.3578 0.3767 0.3634 0 0 http://www.ystone.com.tw PAGE: 8 OF 14 0 YS-2835H421W80 Series Bin Range of Chromaticity Coordinate Bin区分类及色坐标范围 CCT 色温 Bin Code Bin代码 CIE_x CIE_y 0.4354 0.4142 0.4430 0.4165 W42 3000-3100K Bin Code Bin代码 0.4316 0.4059 0.4390 0.4082 0.4390 0.4082 0.4350 0.3998 0.4316 0.4059 0.4279 0.3975 0.4279 0.3975 0.4430 0.4165 0.4350 0.3998 0.4505 0.4189 W52 2900-3000K 0.4310 0.3915 0.4463 0.4106 0.4241 0.3892 0.4390 0.4082 0.4390 0.4082 0.4350 0.3998 0.4463 0.4106 0.4420 0.4022 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 CIE_y W43 3000-3100K W44 3000-3100K 3000K CIE_x W53 2900-3000K W54 2900-3000K 0.4420 0.4022 0.4378 0.3939 0.4350 0.3998 0.4310 0.3915 0.4505 0.4189 0.4463 0.4106 0.4581 0.4212 0.4536 0.4129 W62 2800-2900K W63 2800-2900K 0.4536 0.4129 0.4492 0.4045 0.4463 0.4106 0.4420 0.4022 0.4420 0.4022 0.4492 0.4045 0.4447 0.3962 0.4378 0.3939 W64 2800-2900K 0 0 http://www.ystone.com.tw PAGE: 9 OF 14 0 YS-2835H421W80 Series Reliability Test Items And Conditions 信赖性测试项目及条件 Test Items 项目 Ref. Standard 参考标准 Test Condition 测试条件 Time 时间 Quantity 数量 Ac/Re 接收/拒收 Reflow 回流焊 JESD22-B106 Temp:260℃max T=10 sec 3 times. 22Pcs. 0/1 Temperature Cycle 温度循环 JESD22-A104 100℃±5℃ 30 min. ↑↓5 min -40℃±5℃ 30 min. 100 Cycles 22Pcs. 0/1 High Temperature Storage 高温保存 JESD22-A103 Temp:100℃±5℃ 1000Hrs. 22Pcs. 0/1 Low Temperature Storage 低温保存 JESD22-A119 Temp:-40℃±5℃ 1000Hrs. 22Pcs. 0/1 1000Hrs. 22Pcs. 0/1 1000Hrs. 22Pcs. 0/1 Life Test Ta=25℃±5℃ JESD22-A108 IF=60mA 常温通电 0000000000000000000000000000000000000000000000000000000 High Temperature High Humidity Life Test 高温高湿通电 JESD22-A101 85℃±5℃/ 85%RH IF=40mA Failure Criteria 失效判定标准 Test Items 项目 Forward Voltage 正向电压 00000000000000 Reverse Current 0 反向电流 0 Luminous Flux 0 光通量 Symbol 符号 Failure Criteria 判定标准 Test Condition 测试条件 Min. 最小 Max. 最大 VF IF=60mA -- U.S.L*)x1.1 IR VR = 5V -- 10uA lm IF=60mA L.S.L*)x0.7 -- U.S.L: Upper Specification Limit 规格上限 L.S.L: Lower Specification Limit 规格下限 *The technical information shown in the data sheets is limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许可的 授权. 0 http://www.ystone.com.tw 0 PAGE: 10 OF 14 0 YS-2835H421W80 Series SMT Reflow Soldering Instructions SMT回流焊说明 1.Reflow soldering should not be done more than two times. 回流焊不可以做两次以上 2.When soldering , do not put stress on the LEDs during heating 0000000000000000000000000000000000000000000000000000000 当焊接时,不要在材料受热时用力压胶体表面 Soldering iron 烙铁焊接 1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds 当手工焊接时,烙铁的温度必须小于300℃,时间不可超过3秒 2.The hand solder should be done only one times 手工焊接只可焊接一次 Repairing 修补 Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or will not be damaged by repairing. LED回流焊后不应该修复,当修复是不可避免时,必须使用双头烙铁(如下图),但必须事先确认此种方式会或不会 00000000000000 损坏LED本身的特性。 0 0 0 Cautions 注意事项 The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED封装为硅胶,故LED胶体表面较软,用力按压胶体表面会影响LED可靠性,因此应有预防措施避免在封装的零件上的 强大压力,当使用吸嘴时,胶体表面的压力应是恰当的。 0 0 http://www.ystone.com.tw PAGE: 11 OF 14 0 YS-2835H421W80 Series Handling Precautions 处理防备措施 Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force . As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED products, Failure to comply might leads to damage and premature failure of the LED. 相对环氧树脂较脆较硬而言,硅胶封装较柔软且有弹性,虽然它的特性大大减少了热应力,但易受机械外力损坏,因此 在手工处理方面须要对硅胶封装材料做预防措施,若未按要求操作,可能会导致LED损坏和光衰 1.Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry. 通过使用适当的工具从材料侧面夹取,不可直接用手或尖锐金属压胶体表面,它可能会损坏内部电路 0000000000000000000000000000000000000000000000000000000 2.The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 为防止气压泄漏,SMD吸咀外径不可以超过LED尺寸,吸咀内径尺寸应尽可能大,吸咀顶端材 质建议采用柔软材料以防在吸取期间刮伤或损坏LED胶体表面,元件的尺寸必须在取放机里准 确的编程好,以确保精确的吸取和避免生产过程中的损害 00000000000000 0 0 3.Do not stack together assembled PCBs containing 0 LEDs. Impact may scratch the silicone lens or damage the internal circuitry 4.Not suitable to operate in acidic environment, PH<7 不可用在PH<7的酸性场所 不可将模组材料堆积在一起,它可能会损坏内部电路 <PH7 0 0 http://www.ystone.com.tw PAGE: 12 OF 14 0 5.LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material. LED工作环境及与LED适配的材料中硫元素及化合物成份不可超过100PPM 6.When we need to use external glue for LED application products, please make sure that the external glue matches the LED packaging glue. Additionally ,as most of LED packaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of Chlorine element is required to be less than 900PPM,the total content of Bromine element and Chlorine element in the external glue of the application products is required to be less than 1500PPM 当我们需要使用外封胶涂抹LED产品时,应确保外封胶与LED封装胶水相匹配,因为大多数LED的封装胶水为硅胶,它有较 强的氧化性和较强的吸湿性,必须防止外封材质进入LED内部以造成LED的损伤,单一的溴元素含量要求小于900PPM,单 一氯元素含量要求小于900PPM,在涂抹LED产品时要求外封胶溴元素与氯元素总含量必须小于1500PPM 0000000000000000000000000000000000000000000000000000000 00000000000000 0 7.Other points for attention, please refer to our LED user manual. 0 其它注意事项请参照我们的LED使用手册 0 0 0 http://www.ystone.com.tw PAGE: 13 OF 14 0 YS-2835H421W80 Series Label 标签 IV: Luminous intensity rank 亮度等级 VF: Forward voltage rank 电压等级 X/Y: Coordinate rank 色坐标 TC: Color temperature 色温 Tape Specifications (Units : mm) 载带规格(单位:mm) Reel Dimensions 卷轴尺寸 13 ± .50 0 0.3 00000000000000 0 0 0 Moisture Resistant Packaging 8.00±0.50 防潮带包装 Note: The tolerances unless mentioned is ±0.1mm , Unit: mm 0 http://www.ystone.com.tw 178.00±0.20 60.00±0.40 0000000000000000000000000000000000000000000000000000000 注:标注公差为±0.1mm ,单位:mm 0 PAGE: 14 OF 14