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L6738
Single-phase PWM controller with light-load efficiency optimization
Datasheet − production data
Features
■
Flexible power supply from 5 V to 12 V bus
■
Power conversion input as low as 1.5 V
■
Light-load efficiency optimization
■
Embedded bootstrap diode
■
VIN detector
■
0.8 V internal reference
■
0.5% output voltage accuracy
■
Remote GND recovery
■
High-current integrated drivers
■
Sensorless and programmable precise-OC
sense across inductor DCR
■
OV protection
■
Programmable oscillator up to 600 kHz
■
LS-less to manage pre-bias startup
■
Adjustable output voltage
■
Disable function
■
Internal soft-start
■
VFQFPN 16 3x3 mm package
VFQFPN16
and the device supply voltage ranging from 5 V to
12 V bus.
The L6738 features a proprietary algorithm that
allows light-load efficiency optimization, boosting
efficiency without compromising the output
voltage ripple.
The integrated 0.8 V reference allows the
generation of output voltages with ±0.5%
accuracy over line and temperature variations.
The oscillator is programmable up to 600 kHz.
The L6738 provides a programmable dual-level
overcurrent protection and overvoltage protection.
The current information is monitored across the
inductor DCR.
Applications
■
Memory and termination supply
■
Subsystem power supply (MCH, IOCH, PCI)
■
CPU and DSP power supply
■
Distributed power supply
■
General DC-DC converter
The L6738 is available in a VFQFPN 16 3x3 mm
package.
Table 1.
Description
The L6738 is a single-phase step-down controller
with integrated high-current drivers that provides
complete control logic and protection to realize a
DC-DC converter.
Device summary
Order code
Package
Packing
L6738
VFQFPN16
Tube
L6738TR
VFQFPN16
Tape and reel
The device flexibility allows the management of
conversions with power input VIN as low as 1.5 V
July 2012
This is information on a product in full production.
Doc ID 18133 Rev 2
1/33
www.st.com
33
Contents
L6738
Contents
1
2
3
Typical application circuit and block diagram . . . . . . . . . . . . . . . . . . . . 6
1.1
Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Connection diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1
Connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
Device description and operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Soft-start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1
6
7
Output voltage setting and protections . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1
Overcurrent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2
Overcurrent threshold setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.1
8
9
10
2/33
LS-less startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
High-current embedded drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.1
Boot capacitor design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.2
Power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Application details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9.1
Compensation network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9.2
Layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Doc ID 18133 Rev 2
L6738
Contents
10.1
Inductor design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.2
Output capacitor(s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10.3
Input capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
11
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Doc ID 18133 Rev 2
3/33
List of tables
L6738
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
4/33
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
L6738 protection at a glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
VFQFPN16 3x3x1.0 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Exposed pad variation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Doc ID 18133 Rev 2
L6738
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Typical application circuit (fast protection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
LS-less startup (left) vs. non-LS-less startup (right) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Current reading network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
ROSC vs. switching frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Bootstrap capacitor design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PWM control loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Example of Type III compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Power connections (heavy lines) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Driver turn-on and turn-off paths. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Inductor current ripple vs. output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VFQFPN16 package drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Doc ID 18133 Rev 2
5/33
Typical application circuit and block diagram
L6738
1
Typical application circuit and block diagram
1.1
Application circuit
Figure 1.
Typical application circuit (fast protection)
VCC = 5V to 12V
CDEC
ROSC
PGOOD
GND
OSC
VIN = 1.5V to 19V
VCC
CDEC
VCCDR
PGOOD
SYNCH
BOOT
SYNCH
L6738
CF
CP
RF
UGATE
HS
RFB
LGATE
ROS
RI
LS
CSP
FBG
CSN
VSEN
L6738 Reference Schematic
6/33
Vout
L
PHASE
FB
CI
CBULK
CHF
COMP
Doc ID 18133 Rev 2
R
COUT
C
LOAD
L6738
Typical application circuit and block diagram
Figure 2.
Typical application circuit
VCC = 5V to 12V
CDEC
ROSC
PGOOD
GND
OSC
VIN = 1.5V to 19V
VCC
CDEC
VCCDR
PGOOD
SYNCH
BOOT
SYNCH
L6738
CF
CP
RF
UGATE
HS
RFB
LGATE
ROS
RI
LS
CSP
FBG
Vout
L
PHASE
FB
CI
CBULK
CHF
COMP
R
COUT
LOAD
C
CSN
VSEN
ROS
RFB
L6738 Reference Schematic
Doc ID 18133 Rev 2
7/33
Typical application circuit and block diagram
Block diagram
Figure 3.
Block diagram
OVP
VCC
PGOOD
1.2
L6738
UVP
OVER CURRENT
CSN
CSP
CONTROL LOGIC,
MONITOR, PROTECTIONS
&
EFFICIENCY OPTIMIZATION
OCP
2.2
BOOT
OVP
PWM
+25%
ERROR AMPLIFIER
10k
PROGRAMMABLE
OSCILLATOR
SYNCH
8/33
FBG
FB
COMP
VSEN
-25%
Doc ID 18133 Rev 2
0.80V
PHASE
VCCDR
LGATE
LS
UVP
+
-
UGATE
HS
10k
OSC
ADAPTIVE ANTI
CROSS CONDUCTION
CLOCK
L6738
GND
L6738
Connection diagram and pin description
2
Connection diagram and pin description
2.1
Connection diagram
Pin connection (top view)
GND
VCC
OSC / EN
CSP
Figure 4.
16 15 14 13
VCCDR
LGATE
PHASE
BOOT
1
12
2
11
L6738
3
10
9
4
6
7
8
UGATE
PGOOD
SYNCH
COMP
5
CSN
FBG
VSEN
FB
2.2
Pin description
Table 2.
Pin description
Pin#
Name
Function
1
VCCDR
Low-side driver section power supply.
Operative voltage is 5 V to 12 V bus. Filter with 1 µF MLCC to GND.
2
LGATE
Low-side driver output.
Connect directly to the low-side MOSFET gate. A small series resistor can be useful to
reduce dissipated power especially in high frequency applications.
3
PHASE
High-side driver return path.
Connect to the high-side MOSFET source. This pin is also monitored for the adaptive
dead-time management.
4
BOOT
High-side driver supply.
This pin supplies the high-side floating driver. Connect through the CBOOT capacitor to the
PHASE pin. The pin is internally connected through a boot diode to the VCCDR pin. A 2.2
Ohm series resistor is also provided. See Section 8 for a guide to designing the capacitor
value.
5
UGATE
High-side driver output.
Connect to high-side MOSFET gate. A small series resistor may help in reducing the
PHASE pin negative spike as well as cooling the device.
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9/33
Connection diagram and pin description
Table 2.
Pin#
L6738
Pin description (continued)
Name
Function
6
PGOOD
Power good.
It is an open-drain output set free after SS (with 3x clock cycle delay) as long as the output voltage monitored through VSEN is within specifications. Pull up to 3.3 V (typ.) or
lower, if not used it can be left floating.
7
SYNCH
Synchronization pin.
The controller synchronizes on the falling edge of a square wave provided to this pin.
Short to GND if not used. See Section 7.1 for details.
8
COMP
Error amplifier output.
Connect with an RF - CF to FB. The device cannot be disabled by grounding this pin.
9
FB
10
VSEN
11
FBG
Remote ground sense.
Connect to the negative side of the load for remote sensing.
12
CSN
Current sense negative input.
Connect to the output side of the main inductor. Filter with 100 nF (typ.) to GND.
13
CSP
Current sense positive input.
Connect through an R-C filter to the phase side of the main inductor.
Error amplifier inverting input.
Connect with a resistor RFB to VSEN and with an RF - CF to COMP.
Output voltage monitor.
It manages OVP and UVP protections and PGOOD. Connect to the positive side of the
load for remote sensing. See Section 6 for details.
14
OSC / EN
OSC: internally set to 1.24 V, it allows the programming of the switching frequency FSW of
the device. Switching frequency can be increased according to the resistor ROSC
connected to SGND with a gain of 10 kHz/µA (see Section 7 for details). If floating, the
switching frequency is 200 kHz.
EN: pull low to disable the device (also protection latch reset).
15
VCC
Device power supply. The embedded bootstrap diode is internally connected to this pin.
Operative voltage is 5 V to 12 V bus. Filter with 1 mF MLCC to GND.
For proper operation, VCC needs to be >1.5 V higher than the programmed VOUT.
16
GND
All internal references, logic and driver return path are referenced to this pin. Connect to
the PCB GND ground plane and filter to VCC and VCCDR.
Thermal
PAD
The thermal pad connects the silicon substrate and makes good thermal contact with the
PCB. Use VIAs to connect to the PGND plane.
2.3
Thermal data
Table 3.
Symbol
10/33
Thermal data
Parameter
Value
Unit
RTHJA
Thermal resistance junction-to-ambient
(device soldered on 2s2p PC board)
45
°C/W
RTHJC
Thermal resistance junction to case
1
°C/W
Doc ID 18133 Rev 2
L6738
Electrical specifications
Table 3.
Thermal data (continued)
Symbol
Parameter
Value
Unit
150
°C
TMAX
Maximum junction temperature
TSTG
Storage temperature range
-40 to 150
°C
TJ
Junction temperature range
-40 to 125
°C
3
Electrical specifications
3.1
Absolute maximum ratings
Table 4.
Absolute maximum ratings
Symbol
Value
Unit
to GND
-0.3 to 15
V
VBOOT, VUGATE
to GND
to PHASE
to GND, VCCDR = 12 V, t < 200 nsec.
-0.3 to 41
15
45
V
VPHASE
to GND
to GND, VCCDR = 12 V, t < 200 nsec.
-5 to 26
-8 to 30
V
VLGATE
to GND
-0.3 to VCCDR + 0.3
V
SYNCH
to GND, VCC < 7 V
to GND, VCC > 7 V
-0.3 to VCC + 0.3
-0.3 to 7
V
to GND(1)
-0.3 to VCC - 1.5
V
-0.3 to 3.6
V
VCC,VCCDR
CSP, CSN
Parameter
All other pins to GND
1. The current sense network needs to be properly biased and loop closed.
Doc ID 18133 Rev 2
11/33
Electrical specifications
3.2
L6738
Electrical characteristics
(VCC = 5 V to 12 V; Tj = 0 to 70 ° C unless otherwise specified.)
Table 5.
Electrical characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Supply current and power-on
ICC
ICCDR
9
mA
8
mA
VCC supply current
EN = GND
VCCDR supply current
UVLOVCC, Turn-on threshold
UVLOVCCDR Hysteresis
UGATE and LGATE = open
2.6
5
mA
EN = GND UGATE and LGATE =
open
0.3
3.8
mA
4.1
V
VCC, VCCDR rising
0.2
V
Oscillator, synchronization, and soft-start
FSW
Main oscillator accuracy
OSC = open
kOSC
Oscillator gain
Current sink/source from OSC
DIS
Disable threshold
OSC falling
Tss
Soft-start time
OSC = open
4.5
SS delay
OSC = open, before SS
4.5
Tssdelay
∆VOSC
d
SYNCH
180
200
10
PWM ramp amplitude
0.5
V
5.12
5.7
msec
5.12
5.7
msec
0
VIL
VIH
2.5
Vout to FBG
-0.5
kHz
kHz/µA
2
Duty cycle
Synchronization input
220
V
100
%
1.0
V
V
Reference and error amplifier
Output voltage accuracy
A0
GBWP
SR
DC
gain(1)
Gain-bandwidth
Slew rate
product(1)
(1)
-
0.5
%
120
dB
15
MHz
8
V/µs
A
Gate driver
IUGATE
HS source current(1)
BOOT - PHASE = 12 V; CUGATE to
PHASE = 3.3 nF
2
RUGATE
HS sink resistance
BOOT - PHASE = 12 V; 100 mA
2
CLGATE to GND = 5.6 nF
3
100 mA
1
1.5
Ω
20
23
mV
current(1)
ILGATE
LS source
RLGATE
LS sink resistance
2.5
Ω
A
Current sense amplifier
VOCTH
12/33
OC current threshold
CSP - CSN; 7x masking
Doc ID 18133 Rev 2
17
L6738
Table 5.
Symbol
Device description and operation
Electrical characteristics (continued)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VSEN rising
0.970
1.000
1.030
V
Un-latch, VSEN falling
0.350
0.400
0.450
V
VSEN falling
0.570
0.600
0.630
V
PGOOD and protection
OVP threshold
PGOOD
UVP threshold
1. Guaranteed by design, not subject to test.
4
Device description and operation
The L6738 is a single-phase PWM controller with embedded high-current drivers that
provides complete control logic and protection to realize a general DC-DC step-down
converter. Designed to drive N-channel MOSFETs in a synchronous buck topology, with its
high level of integration, this 16-pin device allows a reduction of cost and size of the power
supply solution and also provides real-time PGOOD in a compact VFQFPN16 3x3 mm.
The L6738 is designed to operate from a 5 V or 12 V supply. The output voltage can be
precisely regulated to as low as 0.8 V with ±0.5% accuracy over line and temperature
variations. The controller performs remote GND recovery to prevent losses and GND drops
to affect the regulation.
The switching frequency is internally set to 200 kHz and adjustable through the OSC pin.
The IC can be disabled by pulling the OSC pin low.
The L6738 provides a simple control loop with a voltage-mode error amplifier. The error
amplifier features a 15 MHz gain-bandwidth product and 8 V/µs slew rate, allowing high
regulator bandwidth for fast transient response.
To avoid load damages, the L6738 provides overcurrent protection, and overvoltage and
undervoltage protection. The overcurrent trip threshold is monitored through the inductor
DCR, assuring optimum precision, saving the use of an expensive and space-consuming
sense resistor. The output voltage is monitored through the dedicated VSEN pin.
The L6738 implements soft-start by increasing the internal reference in closed loop
regulation. The low-side-less feature allows the device to perform the soft-start over prebiased output avoiding high-current return through the output inductor and dangerous
negative spikes at the load side.
The device features a unique synchronization feature that allows the reduction of the input
capacitor RMS current resulting in a cheap and cost-effective system design.
The L6738 is available in a compact VFQFN16 3x3 mm package with exposed pad.
Doc ID 18133 Rev 2
13/33
Soft-start
5
L6738
Soft-start
The L6738 implements a soft-start to smoothly charge the output filter avoiding the
requirement of high in-rush currents to the input power supply. During this phase, the device
increases the internal reference from zero up to 0.8 V in closed loop regulation. The softstart is implemented only when VCC and VCCDR are above their own UVLO threshold and
the EN pin is set free. When SS takes place, the IC initially waits for 1024 clock cycles and
then starts ramping up the reference in 1024 clock cycles in closed-loop regulation. At the
end of the digital soft-start, the PWRGOOD signal is set free with 3x clock cycles delay.
Protections are active during this phase, as follows:
●
undervoltage is enabled when the reference voltage reaches 80% of the final value
●
overvoltage is always enabled
●
FB disconnection is enabled.
Soft-start time depends on the programmed frequency, initial delay and reference ramp-up
lasts for 1024 clock cycles. SS time and initial delay can be determined as follows:
Equation 1
1024
T SS [ ms ] = -----------------------------Fsw [ kHz ] ]
5.1
LS-less startup
In order to avoid any kind of negative undershoot on the load side during startup, the L6738
performs a special sequence in enabling the drivers for both sections: during the soft-start
phase, the LS MOSFET is kept OFF until the first PWM pulse. This particular sequence
avoids the dangerous negative spike on the output voltage that can occur if starting over a
pre-biased output.
Low-side MOSFET turn-on is masked only from the control loop point of view: protections
are still allowed to turn on the low-side MOSFET in the case of overvoltage, if needed.
Figure 5.
14/33
LS-less startup (left) vs. non-LS-less startup (right)
Doc ID 18133 Rev 2
L6738
6
Output voltage setting and protections
Output voltage setting and protections
The L6738 is capable of precisely regulating an output voltage as low as 0.8 V. In fact, the
device comes with a fixed 0.8 V internal reference that guarantees the output regulated
voltage to be within ±0.5% tolerance over line and temperature variations (excluding output
resistor divider tolerance, when present).
Output voltage higher than 0.8 V can be easily achieved by adding a resistor ROS between
the FB pin and ground. Referring to Figure 1, the steady-state DC output voltage is:
Equation 2
R FB ⎞
V OUT = V REF ⋅ ⎛ 1 + ---------⎝
R ⎠
OS
where VREF is 0.8 V.
The L6738 monitors the voltage at the VSEN pin and compares it to the internal reference
voltage in order to provide undervoltage and overvoltage protection, as well as PGOOD
signal. According to the level of VSEN, different actions are performed from the controller:
●
PGOOD
If the voltage monitored through VSEN exits from the PGOOD window limits, the device
de-asserts the PGOOD signal. PGOOD is asserted at the end of the soft-start phase
with 3x clock cycles delay.
●
Undervoltage protection (UV)
If the voltage at the VSEN pin drops below the UV threshold, the device turns off both
HS and LS MOSFETs, latching the condition. Cycle VCC or EN to recover. UV is also
active during SS acting as VIN detection protection. See description below.
●
Overvoltage protection (OV)
If the voltage at the VSEN pin rises over the OV threshold, overvoltage protection turns
off the HS MOSFET and turns on the LS MOSFET. The LS MOSFET is turned off as
soon as VSEN goes below Vref/2. The condition is latched, cycle VCC/EN to recover.
Note that, even if the device is latched, the device still controls the LS MOSFET and
can switch it on whenever VSEN rises above the OV threshold.
●
PreOVP protection
Monitors VSEN when IC is disabled. If VSEN surpasses the OV threshold, IC turns on
the low-side MOSFET to protect the load. On the EN rising edge, the protection is
disabled and the IC implements the SS procedure. PreOVP is disabled when EN is
high but the OV protection becomes operative.
●
VIN detection
UV protection active during SS allows the IC to detect whether input voltage VIN is
present. If UV is triggered during the soft-start, it resets the SS procedure: the
controller re-implements the initial delay and re-ramps-up the reference with the same
SS timings described in Section 5. The UV protection then avoids that IC starts up if
VIN is not present.
Protections are active also during soft-start (see Section 5).
For proper operations, VCC needs to be at least 1.5 V higher than the programmed output
voltage.
Doc ID 18133 Rev 2
15/33
Output voltage setting and protections
Table 6.
L6738
L6738 protection at a glance
L6738
Overvoltage
(OV)
Undervoltage (UV)
PGOOD
Overcurrent (OC)
6.1
Comments
VSEN = +25% above reference.
Action: IC latch; LS=ON until VSEN = 50% of Vref; PGOOD = GND. Action
(EN=0): IC latch; LS=ON; reset by EN rising edge (PreOVP).
VSEN = -25% below reference.
Action: IC latch; HiZ; PGOOD = GND. Action (SS): SS reset (VIN detection).
PGOOD is set to zero whenever VSEN falls outside +/-25% of Vref.
Action: PGOOD transition coincides with OV/UV protection set.
Current monitor across inductor DCR.
Action: 1st threshold (20 mV): IC latch after 7 consecutive constant current
events.
Overcurrent
The overcurrent function protects the converter from a shorted output or overload, by
sensing the output current information across the inductor DCR. This method reduces costs
and enhances converter efficiency by avoiding the use of expensive and space-consuming
sense resistors.
The inductor DCR current sense is implemented by comparing and monitoring the
difference between the CSP and CSN pins. If the monitored voltage is bigger than the
internal thresholds, an overcurrent event is detected.
DCR current sensing requires time constant matching between the inductor and the reading
network:
Equation 3
L
------------- = R ⋅ C
DCR
⇒
VCSP-CSN = DCR ⋅ IOUT
The L6738 monitors the voltage between CSP and CSN, when this voltage exceeds the OC
threshold, an overcurrent is detected. The IC works in constant current mode, turning on the
low-side MOSFET immediately while the OC persists and, in any case, until the next clock
cycle. After seven consecutive OC events, overcurrent protection is triggered and the IC
latches.
When overcurrent protection is triggered, the device turns off both LS and HS MOSFETs in
a latched condition.
To recover from an overcurrent protection triggered condition, VCC power supply or EN
must be cycled.
For proper current reading, the CSN pin must be filtered by 100 nF (typ.) MLCC to GND.
16/33
Doc ID 18133 Rev 2
L6738
6.2
Output voltage setting and protections
Overcurrent threshold setting
The L6738 detects OC when the difference between CSP and CSN is equal to 20 mV (typ.).
By properly designing the current reading network, it is possible to program the OC
threshold as desired (see Figure 6).
Equation 4
20mV R1 + R2
I OCP = ---------------- ⋅ ---------------------DCR
R2
Time constant matching is, in this case, designed considering:
Equation 5
L
------------- = ( R1//R2 ) ⋅ C
DCR
This means that once the inductor has been chosen, the two conditions above define the
proper values for R1 and R2.
Figure 6.
Current reading network
DCR
L
R1
R2 (Opt)
C
CSP
CSN
Doc ID 18133 Rev 2
17/33
Main oscillator
7
L6738
Main oscillator
The controller embeds a programmable oscillator. The internal oscillator generates the
sawtooth waveform for the PWM charging with a constant current and resets an internal
capacitor. The switching frequency, FSW, is internally fixed at 200 kHz.
The current delivered to the oscillator is typically 20 µA (corresponding to the free running
frequency FSW = 200 kHz) and it may be varied using an external resistor (ROSC) typically
connected between the OSC pin and GND. As the OSC pin is fixed at 1.240 V, the
frequency is varied proportionally to the current sunk from the pin considering the internal
gain of 10 KHz/µA (see Figure 7).
Connecting ROSC to GND, the frequency is increased (current is sunk from the pin),
according to the following relationships:
Equation 6
1.240V
kHz
F SW = 200kHz + ------------------- ⋅ 10 ----------R OSC
µA
Connecting ROSC to a positive voltage, the frequency is reduced (current is forced into the
pin), according to the following relationships:
Equation 7
+V – 1.240
kHz
FSW = 200kHz – ---------------------------- ⋅ 10 ----------R OSC
µA
where +V is the positive voltage to which the ROSC resistor is connected.
Figure 7.
18/33
ROSC vs. switching frequency
Doc ID 18133 Rev 2
L6738
7.1
Main oscillator
Synchronization
The L6738 provides the user with the possibility to synchronize with an external signal when
properly connected to the SYNCH pin. Synchronization allows different converters to share
the same input filter reducing the resulting IRMS and so reducing the total capacitor count
required to sustain the load. Furthermore, synchronized systems generally exhibit higher
noise immunity and better regulation.
The device synchronizes the high-side MOSFET turn-on with the falling-edge of the synch
signal locking the internal sawtooth generator to the external signal.
Doc ID 18133 Rev 2
19/33
High-current embedded drivers
8
L6738
High-current embedded drivers
The L6738 provides high-current driving control. The driver for the high-side MOSFET uses
the BOOT pin for supply and the PHASE pin for return. The driver for the low-side MOSFET
uses the VCCDR pin for supply and the GND pin for return.
The embedded driver embodies an anti-shoot-through and adaptive dead-time control to
minimize the low-side body diode conduction time maintaining good efficiency and saving
the use of Schottky diodes: when the high-side MOSFET turns off, the voltage on its source
begins to fall; when the voltage reaches about 2 V, the low-side MOSFET gate drive voltage
is suddenly applied. When the low-side MOSFET turns off, the voltage at the LGATE pin is
sensed. When it drops below about 1 V, the high-side MOSFET gate drive voltage is
suddenly applied. If the current flowing in the inductor is negative, the source of the highside MOSFET never drops. To allow the low-side MOSFET to turn on even in this case, a
watchdog controller is enabled: if the source of the high-side MOSFET doesn't drop, the lowside MOSFET is switched on, so allowing the negative current of the inductor to recirculate.
This mechanism allows the system to regulate even if the current is negative.
8.1
Boot capacitor design
The bootstrap capacitor needs to be designed in order to show a negligible discharge due to
the high-side MOSFET turn on. In fact, it must give a stable voltage supply to the high-side
driver during the MOSFET turn-on, also minimizing the power dissipated by the embedded
boot diode. Figure 8 gives some guidelines on how to select the capacitance value for the
bootstrap according to the desired discharge and depending on the selected MOSFET.
To prevent extra-charge of the bootstrap capacitor, as a consequence of large negative
spikes, an internal 2.2 Ohms series resistance RBOOT is provided in series to the BOOT
diode pin.
Figure 8.
Bootstrap capacitor design
2.5
2500
Cboot = 47nF
Qg = 10nC
Cboot = 100nF
2.0
Qg = 25nC
2000
Cboot = 220nF
Qg = 50nC
Qg = 100nC
Cboot = 470nF
Bootstrap Cap [uF]
BOOT Cap discharge [V]
Cboot = 330nF
1.5
1.0
1500
1000
500
0.5
0
0.0
0.2
0.4
0.6
0.0
0
10
20
30
40
50
60
70
80
90
100
High -Side MOSFET Gate Charge [nC]
20/33
Doc ID 18133 Rev 2
Boot Cap Delta Voltage [V]
0.8
1.0
L6738
8.2
High-current embedded drivers
Power dissipation
It is important to consider the power that the device is going to dissipate in driving the
external MOSFETs in order to avoid surpassing the maximum junction operative
temperature.
Two main terms contribute to the device power dissipation: bias power and driver power.
●
Bias power (PDC) depends on the static consumption of the device through the supply
pins and it is simply quantifiable as follows:
Equation 8
P DC = V CC ⋅ I CC + V VCCDR ⋅ IVCCDR
●
Driver power is the power needed by the driver to continuously switch ON and OFF the
external MOSFETs; it is a function of the switching frequency and total gate charge of
the selected MOSFETs. It can be quantified considering that the total power PSW,
dissipated to switch the MOSFETs, is dissipated by three main factors: external gate
resistance (when present), intrinsic MOSFET resistance and intrinsic driver resistance.
This last term is the important one to be determined in order to calculate the device
power dissipation.
The total power dissipated to switch the MOSFETs for each phase featuring an
embedded driver results:
Equation 9
P SW = FSW ⋅ ( Q GHS ⋅ VCCDR + Q GLS ⋅ VCCDR )
where QGHS is the total gate charge of the HS MOSFETs and QGLS is the total gate
charge of the LS MOSFETs.
Doc ID 18133 Rev 2
21/33
Application details
L6738
9
Application details
9.1
Compensation network
The control loop shown in Figure 9 is a voltage-mode control loop. The output voltage is
regulated to the internal reference (when present, an offset resistor between FB node and
GND can be neglected in control loop calculation).
Error amplifier output is compared to the oscillator sawtooth waveform to provide a PWM
signal to the driver section. The PWM signal is then transferred to the switching node with
VIN amplitude. This waveform is filtered by the output filter.
The converter transfer function is the small signal transfer function between the output of the
EA and VOUT. This function has a double pole at frequency FLC depending on the L-COUT
resonance and a zero at FESR depending on the output capacitor ESR. The DC gain of the
modulator is simply the input voltage VIN divided by the peak-to-peak oscillator voltage
∆VOSC.
Figure 9.
PWM control loop
VIN
OSC
∆V OSC
_
L
+
R
V OUT
COUT
PWM
COMPARATOR
ESR
ERROR
AMPLIFIER
+
CF
VREF
_
RFB
RF
CS
RS
ZFB
CP
ZF
The compensation network closes the loop joining VOUT and EA output with transfer
function ideally equal to -ZF/ZFB.
The compensation goal is to close the control loop assuring high DC regulation accuracy,
good dynamic performance and stability. To achieve this, the overall loop needs high DC
gain, high bandwidth and good phase margin.
High DC gain is achieved giving an integrator shape to the compensation network transfer
function. Loop bandwidth (F0dB) can be fixed choosing the right RF/RFB ratio, however, for
stability, it should not exceed FSW/2π. To achieve a good phase margin, the control loop gain
must cross the 0dB axis with -20 dB/decade slope.
For example, Figure 10 shows an asymptotic Bode plot of a Type III compensation.
22/33
Doc ID 18133 Rev 2
L6738
Application details
Figure 10. Example of Type III compensation
Gain
[dB]
open loop
EA gain
FZ1 FZ2
FP2
FP1
closed
loop gain
compensation
gain
20log (RF /RFB)
open loop
converter gain
20log (VIN/∆VOSC )
0dB
F0dB
F LC
●
Log (Freq)
FESR
Open loop converter singularities:
Equation 10
●
a)
1
F LC = ------------------------------------2π L ⋅ C OUT
b)
1
FESR = -----------------------------------------------2π ⋅ C OUT ⋅ ESR
Compensation network singularity frequencies:
Equation 11
a)
1
F Z1 = ----------------------------------2π ⋅ R F ⋅ C F
b)
1
F Z2 = ---------------------------------------------------------2π ⋅ ( R FB + R S ) ⋅ C S
c)
1
FP1 = -------------------------------------------------------CF ⋅ CP
2π ⋅ R F ⋅ ⎛ ----------------------⎞
⎝ CF + CP ⎠
d)
1
F P2 = -----------------------------------2π ⋅ R S ⋅ C S
Doc ID 18133 Rev 2
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Application details
L6738
To place the poles and zeros of the compensation network, the following suggestions may
be followed:
a)
Set the gain RF/RFB in order to obtain the desired closed loop regulator bandwidth
according to the approximated formula (suggested values for RFB are in the range
of some kΩ):
Equation 12
F 0dB ∆VOSC
RF
---------= ------------ ⋅ ------------------F LC
V IN
R FB
b)
Place FZ1 below FLC (typically 0.5*FLC):
1
C F = ---------------------------------π ⋅ R F ⋅ FLC
c)
Place FP1 at FESR:
CF
C P = -----------------------------------------------------------------2π ⋅ R F ⋅ CF ⋅ F ESR – 1
d)
Place FZ2 at FLC and FP2 at half of the switching frequency:
R FB
R S = ----------------------------F SW
-------------------- – 1
2 ⋅ F LC
1
C S = -----------------------------------π ⋅ R S ⋅ F SW
9.2
e)
Check that compensation network gain is lower than open loop EA gain before
F0dB
f)
Check phase margin obtained (it should be greater than 45°) and repeat if
necessary.
Layout guidelines
The L6738 provides control functions and a high-current integrated driver to implement
high-current step-down DC-DC converters. In this kind of application, a good layout is very
important.
The first priority of component placement for these applications must be reserved for the
power section, minimizing the length of each connection and loop as much as possible. To
minimize noise and voltage spikes (EMI and losses) power connections (highlighted in
Figure 11) must be a part of a power plane and realized by wide and thick copper traces:
loop must be minimized. The critical components, i.e. the Power MOSFETs, must be close
to one another. The use of a multi-layer printed circuit board is recommended.
The input capacitance (CIN), or at least a portion of the total capacitance needed, must be
placed close to the power section in order to eliminate the stray inductance generated by the
copper traces. Low ESR and ESL capacitors are preferred, MLCCs are recommended to be
connected near the HS drain.
Use a proper number of vias when power traces must move between different planes on the
PCB in order to reduce both parasitic resistance and inductance. Moreover, reproducing the
24/33
Doc ID 18133 Rev 2
L6738
Application details
same high-current trace on more than one PCB layer reduces the parasitic resistance
associated to that connection.
Connect output bulk capacitors (COUT) as near as possible to the load, minimizing parasitic
inductance and resistance associated to the copper trace, also adding extra de-coupling
capacitors along the way to the load when this results in being far from the bulk capacitors
bank.
Remote sense connection must be routed as parallel nets from the FBG/VSEN pins to the
load in order to avoid the pick-up of any common mode noise. Connecting these pins in
points far from the load causes a non-optimum load regulation, increasing output tolerance.
Locate current reading components close to the device. The PCB traces connecting the
reading point must use dedicated nets, routed as parallel traces in order to avoid the pick-up
of any common mode noise. It's also important, to avoid any offset in the measurement and
obtain better precision, to connect the traces as close as possible to the sensing elements.
A small filtering capacitor can be added, near the controller, between VOUT and GND, on the
CSN line to allow higher layout flexibility.
Figure 11. Power connections (heavy lines)
VIN
CIN
UGATE
PHASE
L
L6738
COUT
LGATE
LOAD
GND
Gate traces and phase trace must be sized according to the driver RMS current delivered to
the Power MOSFET. The device robustness allows the managing of applications with the
power section far from the controller without losing performance. However, when possible, it
is recommended to minimize the distance between the controller and power section.
Small signal components and connections to critical nodes of the application, as well as
bypass capacitors for the device supply, are also important. Locate the bypass capacitor
(VCC and bootstrap capacitor) and feedback compensation components as close to the
device as is practical.
Figure 12. Driver turn-on and turn-off paths
LS DRIVER
LS MOSFET
HS DRIVER
VCCDR
HS MOSFET
BOOT
CGD
RGATE
CGD
RINT
RGATE
LGATE
RINT
UGATE
CGS
CDS
GND
CGS
CDS
PHASE
Doc ID 18133 Rev 2
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Application information
L6738
10
Application information
10.1
Inductor design
The inductance value is defined through a compromise between the dynamic response
time, the efficiency, the cost, and the size. The inductor must be calculated to maintain the
ripple current (∆IL) between 20% and 30% of the maximum output current (typ.). The
inductance value can be calculated with the following relationship:
Equation 13
V IN – V OUT V OUT
L = ------------------------------ ⋅ -------------F SW ⋅ ∆I L
V IN
where FSW is the switching frequency, VIN is the input voltage and VOUT is the output
voltage. Figure 13 shows the ripple current vs. the output voltage for different values of the
inductor, with VIN = 5 V and VIN = 12 V.
Increasing the value of the inductance reduces the current ripple but, at the same time,
increases the converter response time to a dynamic load change. The response time is the
time required by the inductor to change its current from initial to final value. Until the inductor
has finished its charging time, the output current is supplied by the output capacitors.
Minimizing the response time can minimize the output capacitance required. If the
compensation network is well designed, during a load variation the device is able to set a
duty cycle value very different (0% or 80%) from the steady-state one. When this condition
is reached, the response time is limited by the time required to change the inductor current.
Figure 13. Inductor current ripple vs. output voltage
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Doc ID 18133 Rev 2
L6738
10.2
Application information
Output capacitor(s)
The output capacitors are basic components to define the ripple voltage across the output
and for the fast transient response of the power supply. They depend on the output voltage
ripple requirements, as well as any output voltage deviation requirement during a load
transient.
During steady-state conditions, the output voltage ripple is influenced by both the ESR and
capacitive value of the output capacitors as follows:
Equation 14
∆V OUT_ESR = ∆I L ⋅ ESR
1
∆V OUT_C = ∆IL ⋅ -------------------------------------------8 ⋅ C OUT ⋅ F SW
where ∆IL is the inductor current ripple. In particular, the expression that defines ∆VOUT_C
takes into consideration the output capacitor charge and discharge as a consequence of the
inductor current ripple.
During a load variation, the output capacitors supply the current to the load or absorb the
current stored in the inductor until the converter reacts. In fact, even if the controller
immediately recognizes the load transient and sets the duty cycle at 80% or 0%, the current
slope is limited by the inductor value. The output voltage has a drop that, also in this case,
depends on the ESR and capacitive charge/discharge as follows:
Equation 15
∆V OUT_ESR = ∆I OUT ⋅ ESR
L ⋅ ∆IOUT
∆V OUT_C = ∆IOUT ⋅ ------------------------------------------2 ⋅ C OUT ⋅ ∆V L
where ∆VL is the voltage applied to the inductor during the transient response
( D MAX ⋅ V IN – VOUT for the load appliance or VOUT for the load removal).
MLCC capacitors have typically low ESR to minimize the ripple but also have low
capacitance which does not minimize the voltage deviation during dynamic load variations.
On the contrary, electrolytic capacitors have large capacitance to minimize voltage deviation
during load transients while they do not show the same ESR values as the MLCC, resulting
therefore in higher ripple voltages. For these reasons, a mix between electrolytic and MLCC
capacitors is suggested to minimize ripple as well as reduce voltage deviation in dynamic
mode.
Doc ID 18133 Rev 2
27/33
Application information
10.3
L6738
Input capacitors
The input capacitor bank is designed considering mainly the input RMS current that
depends on the output deliverable current (IOUT) and the duty-cycle (D) for the regulation as
follows:
Equation 16
Irms = I OUT ⋅
D ⋅ (1 – D )
The equation reaches its maximum value, IOUT/2, with D = 0.5. The losses depend on the
input capacitor ESR and, in the worst case, are:
Equation 17
P = ESR ⋅ ( IOUT ⁄ 2 )
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Doc ID 18133 Rev 2
2
L6738
11
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions, and product status are available at www.st.com.
ECOPACK® is an ST registered trademark.
Table 7.
VFQFPN16 3x3x1.0 mechanical data
mm
Dim.
Min.
Typ.
Max.
0.80
0.90
1.00
A1
0.02
0.05
A2
0.65
1.00
A3
0.20
A
b
0.18
0.25
0.30
D
2.85
3.00
3.15
D1
1.50
D2
See next table
E
2.85
3.00
E1
1.50
E2
See next table
3.15
e
0.45
0.50
0.55
L
0.30
0.40
0.50
ddd
Table 8.
0.08
Exposed pad variation
D2
E2
Variation
Min.
Typ.
Max.
Min.
Typ.
Min.
A
0.95
1.10
1.25
0.95
1.10
1.25
B
1.45
1.60
1.75
1.45
1.60
1.75
Doc ID 18133 Rev 2
29/33
Package mechanical data
L6738
Figure 14. VFQFPN16 package drawing
7185330_G
30/33
Doc ID 18133 Rev 2
L6738
Package mechanical data
Figure 15. Recommended footprint
AM10265v1
Doc ID 18133 Rev 2
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Revision history
12
L6738
Revision history
Table 9.
32/33
Document revision history
Date
Revision
Changes
03-Nov-2010
1
Initial release.
04-Jul-2012
2
Updated PGOOD limits in Table 5.
Minor text changes.
Doc ID 18133 Rev 2
L6738
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