Datasheet, Revision 1 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) Features Description • Complete ZL70103-based MICS-Band1 RF Telemetry Radio Solution • Implantable Radio Module Designed to Enable Rapid Development of Implantable Medical Devices • Implant-Grade Quality Assurance • Ultracompact Design and Small Size (4.5×5.5×1.6mm) • RX Sensitivity of −102dBm at 200kbit/s (with packet error rate of 10%) • Additional Lower Data Rates Available (40/18.18kbit/s) • 2.45-GHz wake-up receiver matching network. • Designed to Meet Regulatory Requirements (FDA, FCC, ETSI, and IEC) • Integrated 24-MHz reference frequency crystal. • Decoupling capacitors. Applications • The ZL70323 implantable radio module implements all RFrelated functions needed to deploy the implantable node in a MICS-band RF telemetry system. The integrated antenna tuning circuit allows the module to be used with a wide range of implantable antennas (nominal antenna impedance is 100+j150Ω). Figure 1 shows the module’s major subsystems: • ZL70103-based MICS-band RF transceiver with an integrated matching network, SAW filters for suppression of unwanted blockers, and antenna tuning. Ordering Information Implantable Medical Devices ZL70323MNJ 15-pad LGA – Cardiac Rhythm Management – Neurostimulators – Drug Delivery, Sensors, and Diagnostics VDDA Please refer to "Package Overview" on page 4-3 for details. VDDD GND VDDIO VSUP XTAL WU_EN ZL70103 IRQ SPI_CLK SPI_SDI SPI_SDO SPI_CS_B M MICS-Band 400-MHz RX/TX Ant Match & Tune Wake-up 2.45-GHz RX Match RF400 A C PO2 Figure 1 • SAW RF245 0167v1504.0 ZL70323 Block Diagram 1 MICS is a subset of MedRadio. July 2015 © 2015 Microsemi Corporation I ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) Table of Contents ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) 1 – Product Description 2 – Functional Description General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MICS-Band Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.45-GHz Wake-Up Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Antenna Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2-1 2-1 2-1 3 – Electrical Specifications Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 4 – Mechanical Specifications Pad List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Module Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4-2 4-3 4-3 5 – Typical Application Example 6 – Quality 7 – Glossary 8 – Datasheet Information List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1 Re vi s i o n 1 II ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) List of Figures Figure 1 • ZL70323 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I Figure 4-1 • ZL70323 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Figure 4-2 • ZL70323 Pad Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Figure 5-1 • Typical Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 Re vi s i o n 1 III ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) List of Tables Table 1-1 • Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Table 3-1 • Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Table 3-2 • Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Table 3-3 • Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Table 3-4 • Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Table 3-5 • 400-MHz Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Table 3-6 • 400-MHz Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Table 3-7 • 2.45-GHz Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Table 3-8 • RF Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Table 3-9 • ESD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Table 4-1 • ZL70323 Pad List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Table 4-2 • Pad Type Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Table 4-3 • ZL70323 Package Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Re vi s i o n 1 IV 1 – Product Description The ZL70323 implantable radio module is a second-generation, high-performance, easy-to-use RF module based on the ZL70103 MICS-band transceiver IC. The module is extremely small and is designed to provide good performance while consuming very little power. The ZL70323 RF module integrates all the circuitry and functionality required to deploy a complete radio solution for implantable applications. This allows the circuit complexity to be reduced to placing one single package on your implantable application board. Please refer to Table 1-1 below for all documents related to the ZL70103 family of products. These documents can be found on Microsemi's website or by contacting Microsemi's CMPG sales for more information. Table 1-1 • Related Documentation Product ZL70103 MICS-Band RF Transceiver Document(s) ZL70103 Datasheet ZL70103 Design Manual Description The ZL70103 MICS-Band RF Transceiver is designed specifically for use in implantable medical devices (such as pace makers and neurostimulators). It also supports external applications (such as programmers and patient controllers). ZL70123 MICS-Band RF Base Station Module (BSM) (in development) ZL70123 Datasheet (in development) The ZL70123 BSM is a ZL70103-based RF module that integrates additional circuitry and functionality required for external applications. ZL70120 MICS-Band RF Base Station Module (BSM) ZL70120 Datasheet The ZL70120 BSM is a ZL70102-based RF module that integrates additional circuitry and functionality required for external applications. The RF link of the ZL70120 BSM is compatible with the ZL70323 Miniaturized Standard Implant Module. ZLE70103 Application Development Kit (ADK) ZLE70103 ADK Users Guide Re vi s i o n 1 The ADK combines hardware and software to provide an end-to-end MICS-band communication system based on the ZL70120 Base Station Module and the ZL70323 Miniaturized Standard Implant Module (MiniSIM). Additionally, source code with programming examples is available with a source code license agreement (SCLA). 1-1 2 – Functional Description General The ZL70323 module provides all the circuitry needed to deploy a complete, implanted, MICS-band, RF telemetry radio solution (PHY- and MAC-layers). The ZL70323 is designed to be versatile so it can serve a broad range of applications with different antenna, feed-through, and case implementations. Please refer to the ZL70103 Data Sheet and the ZL70103 Design Manual for further details on using the ZL70103. Power Supply Requirements The module contains a decoupling capacitor on the VSUP power supply input as well as integrated decoupling capacitors required by the analog and digital regulators of the ZL70103. The VDDA and VDDD pads are test pads and should be neither loaded nor used in the user application. They are connected to the internal analog and digital regulators of the ZL70103 and are intended only for production testing by Microsemi. MICS-Band Transceiver The MICS-band transceiver is based on the ZL70103 IC. The transceiver signal chain is equipped with a matching network, a SAW filter, and antenna tuning to allow a wide range of antennas to be used with the module. Please refer to "Antenna Requirements" for more details. Reference Frequency Crystal The ZL70323 module is equipped with a 24-MHz reference frequency crystal supporting the integrated XO of the ZL70103. Please refer to Chapter 10 in the ZL70103 Design Manual for information on tuning the XO. General Purpose I/O The ZL70323 module provides access to the PO2 pad of the ZL70103. 2.45-GHz Wake-Up Receiver The 2.45-GHz wake-up receiver is integrated on the ZL70103 radio IC and provides a very power-efficient wake-up subsystem. All necessary RF matching is integrated on the ZL70323 module, and the RF245 and RF400 ports can be shorted together and connected directly to the antenna. If the ZL70323 module is operated without using the 2.45-GHz wake-up, the RF245 connection should be grounded. Antenna Requirements Antenna Tuning The ZL70323 takes advantage of the integrated antenna tuning capacitors (MATCH1 and MATCH2). This allows the RF port to be tuned to the actual antenna impedance (within the supported tuning range). Please refer to Section 3.6 of the ZL70103 Design Manual for details. Re vi s i o n 1 2-1 3 – Electrical Specifications Tables 3-1 through 3-9 provide the absolute maximum ratings and other electrical characteristics for the ZL70323. Voltages are with respect to ground (GND) unless otherwise stated. Absolute Maximum Ratings Table 3-1 • Absolute Maximum Ratings Limits ID Parameter Symbol Min. Typ. Max.1 Unit Note 1.0 Supply voltage VSUP 0 3.6 V Note 1 1.1 Input voltage (digital I/O) VDDIO 0 VSUP V Note 2 1.2 Storage temperature Tstg −40 +125 °C 1.3 Burn-in temperature Tbi +125 °C Notes 3, 4 Notes: 1. Application of voltage beyond the stated absolute maximum rating may cause permanent damage to the device or cause reduced reliability. 2. VDDIO must never be higher than VSUP even during system startup. 3. Device may be powered during burn-in but operation is not guaranteed. 4. Condition: 3.3V on VSUP and VDDIO Operating Conditions Recommended Operating Conditions The recommended operating conditions in Table 3-2 define the nominal conditions for the device. Table 3-2 • Recommended Operating Conditions Limits ID Parameter Symbol Min. Typ. Max.1 Unit Note 2.0 Supply voltage VSUP 2.05 3.5 V Note 2 2.1 Input voltage (digital I/O) VDDIO 1.5 VSUP V Note 1 2.2 Operating temperature Top 0 +55 °C +37 Notes: 1. Application of voltage beyond the stated absolute maximum rating may cause permanent damage to the device or cause reduced reliability. 2. For voltages less than 2.1V, a production trim procedure must be followed. Re vi s i o n 1 3-1 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) Electrical Characteristics Default register and mode settings are assumed unless noted. The RF ports are assumed to have a nominal load equal to an antenna impedance of 100+j150Ω at 403.5MHz and 50Ω at 2442MHz when the two RF ports are combined. Electrical testing during production is used to ensure that delivered parts fulfill the limits defined herein. In some cases it is not possible to perform electrical testing or the testing has been carried out in a different way. These exceptions are marked in the "Exceptn" column of Tables 3-4 to 3-8; refer to legend below. These parameters are guaranteed by production tests but with different limits to what is specified in the data sheet. This is due to limitations in the capabilities of the automated test equipment. The production tests that are carried out have been correlated to tests carried out in the lab environment. These parameters are guaranteed by production tests; however, these may be carried out in a different manner to that defined in the data sheet. These parameters are tested during production test but the limits are for design guide only. These parameters are for design aid only: not guaranteed and not subject to production testing. Typical values according to the specified condition. If no conditions are specified, then the typical figures assume 37°C and VSUP at 3.0V. Typical values are for design aid only: not guaranteed and not subject to production testing. Digital Interface The characteristics in Table 3-3 are valid for the following interconnects: • Digital inputs: WU_EN, SPI_CS_B, SPI_CLK, SPI_SDI • Digital outputs: IRQ, SPI_SDO, PO2 Table 3-3 • Digital Interface Limits ID Parameter Symbol Min. Max. Unit Note 3.0 Digital input low VIL 0 0.2×VDDIO mV Note 1 3.1 Digital input high VIH 0.8×VDDIO VDDIO mV Note 2 3.2 Digital output low VOL 0 0.2×VDDIO mV 3.3 Digital output high VOH 0.8×VDDIO VDDIO mV 3.4 Maximum SPI clock rate 4 MHz fclk Note 3 Notes: 1. VIL is the required input voltage to ensure internal signal switching from high to low. 2. VIH is the required input voltage to ensure internal signal switching from low to high. 3. Default value. The maximum SPI clock rate can be programmed to 1, 2, or 4MHz. R e visi on 1 3-2 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) Performance Characteristics Current Consumption Table 3-4 • Current Consumption Limits ID 4.0 Parameter SLEEP state current Symbol Condition Isleep Typ. Max. Unit Exceptn Note Top ≤ 37°C 10 50 nA Note 1 Top ≤ 55°C 10 150 nA Note 1 −20°C ≤ Top ≤ 60°C 10 200 nA Note 1, 2 Iidle 0.95 1.1 mA 4.3 5.0 mA VSUP = 2.05V 5.2 5.7 mA VSUP = 3.0V 5.6 6.1 mA 4.0 4.7 mA <5 µA 4.1 IDLE state current 4.2 400-MHz receive state current IRX400 4.3 400-MHz transmit state current ITX400 4.4 400-MHz RSSI sniff current Isniff400 4.5 400-MHz average wake-up current Iwu400 4.6 Wake-up strosc (strobe oscillator) current Istrosc 4.7 Wake-up 2.45-GHz RX sniff current Min. Note 3 Note 4 VSUP = 2.05V 270 320 nA VSUP = 3.0V 320 365 nA 1.4 1.8 mA Note 6 −20°C ≤ Top ≤ 60°C 1.4 2.1 mA Note 2, 6 Isniff245 Note 5 4.8 Average wake-up current (external pulse on WU_EN) Iwu245_ext Top ≤ 37°C 290 410 nA Note 6, 7 4.9 Average wake-up current (internal strobe oscillator) Iwu245_int Top ≤ 37°C 600 810 nA Note 6, 7 Notes: 1. WU_EN low between external strobe pulses. 2. The extended temperature operating conditions specify a temperature range where the chip is operating but has limited performance. The purpose of this temperature range is to provide a wider temperature range for devices that are powered on but are in stand-by and stored before use. Under these conditions, the device always powers up and communicates as expected. 3. Register setting for power code reg_rf_txrfpwrdefaultset is 48. 4. Average sleep/sniff current consumption for a 400-MHz sniff based on a sniff interval of 5 seconds and a sniff duration of 9.375ms. 5. WU_EN low between internal strobe pulses. 6. Register setting for bias code reg_wakeup_lnabiasis10; reg_wakeup_wk_rx_lna_negrtrim1 based on trimming. 7. Wake-up strobe periodis 1s; register setting for reg_wakeup_stroscpwidth1 is 7. R e visi on 1 3-3 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) 400-MHz Transmitter Table 3-5 • 400-MHz Transmitter Limits ID Parameter 5.0 Transmit power 5.1 Minimum transmit power 5.2 5.3 Symbol Condition Min. Typ. Max. Unit Exceptn PTX400max Top = 37°C and VSUP = 2.1V −7.4 −5.6 dBm Top = 37°C and VSUP = 3.0V −4.5 −3.5 dBm Note Note 1 PTX400min −31 dBm Unwanted emissions outside the 401.75 – 405.25-MHz band Eoutband −30 dBc Note 3 Unwanted emissions within the 401.75 – 405.25-MHz band Einband −20 dBc Note 4 Note 2 Notes: 1. 2. 3. 4. Register setting for power code reg_rf_txrfpwrdefaultset is 48. Register setting for power code reg_rf_txrfpwrdefaultset is 0. Fulfills FCC CFR47.95. Requires trimming; please refer to the ZL70103 Design Manual for details. Fulfills FCC CFR47.95. 400-MHz Receiver Table 3-6 • 400-MHz Receiver Limits ID Parameter Symbol Condition Min. Typ. 33 dB ICP1 −41 dBm Note 1 IIP3 −32 dBm Note 1 6.4 RX sensitivity (2FSK-fallback with Barker11 spreading) PRX_2F_FB_B11 −108 dBm Note 2 6.5 RX sensitivity (2FSK-fallback with Barker5 spreading) PRX_2F_FB_B5 −104 dBm Note 2 6.6 RX sensitivity (2FSK-fallback) PRX_2F_FB −98 dBm Note 2 PRX_2F −85 dBm Note 2 GRX 6.1 Maximum RF amplifier and mixer gain GRX 6.2 1-dB compression point referred to input 6.3 Third-order input intercept point 6.7 RX sensitivity (2FSK) 24 16 Note dB 6.0 Minimum RF amplifier and mixer gain 11 Max. Unit Exceptn Note: 1. Register reg_rf_rxrflnagaintrim set to 127 (second highest gain). 2. The sensitivity is based on the application circuit in Figure 5-1 on page 5-1, at the reference point of the dual-band antenna including the optional prematch for 50-ohm testing. This value represents a packet error rate of 10%. R e visi on 1 3-4 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) 2.45-GHz Receiver Table 3-7 • 2.45-GHz Receiver Limits ID Parameter Symbol Condition 7.0 Sensitivity at RF245 pad (normal mode) PRX245 Top ≤ 37°C 7.1 Sensitivity at RF245 pad (sensitive mode) PRX245 Top ≤ 37°C Min. Typ. Max. Unit Exceptn Note −73 dBm Note 1 −75 dBm Note 2 Notes: 1. 3-µs RF-on time. No frequency hopping. 2.45-GHz receiver trimmed for the conditions. Register reg_wakeup_lnabias is 10; reg_wakeup_wk_rx_lna_negrtrim1 is based on trimming. 2. 6-µs RF-on time. No frequency hopping. 2.45-GHz receiver trimmed for the conditions. Register reg_wakeup_lnabias is 10; reg_wakeup_wk_rx_lna_negrtrim1 is based on trimming. RF Ports Table 3-8 • RF Ports Limits ID Parameter Symbol Condition Min. Typ. Max. Unit Exceptn Note 8.0 400-MHz nominal port impedance, resistive part R400 100 Ω Note 1 8.1 400-MHz nominal port impedance, reactive part X400 −j150 Ω Note 1 8.2 2.45-GHz nominal port impedance, resistive part R245 50 Ω Note 2 8.3 2.45-GHz nominal port impedance, reactive part X245 0 Ω Note 2 Note: 1. This impedance is measured at the RF_400 pad. 2. This impedance is measured at the RF_245 pad. ESD Table 3-9 • ESD Limits ID 9.0 Parameter ESD Symbol Min. VESD 500 Typ. Max. Unit Note V Note 1 Note: 1. Human Body Model (HBM). R e visi on 1 3-5 4 – Mechanical Specifications Pad List Table 4-1 describes each pad on the ZL70323 module, and Table 4-2 provides definitions of the pad types listed in Table 4-1. Proper ground is essential for good and stable performance. Please ensure all ground pads are connected. Table 4-1 • Pad ZL70323 Pad List Symbol Description Type A1 IRQ Interrupt request output DO A2 SPI_SDI Data input for SPI bus interface DI A3 VDDD B1 WU_EN Wake-up enable signal B2 VDDIO Digital I/O supply SUP B3 GND Ground supply connection GND C1 SPI_SDO Data output for SPI bus interface DO C2 SPI_CLK Clock for SPI bus interface DI C3 RF400 Antenna RF input and output for the MICS band RF D1 SPI_CS_B SPI chip select (active low) DI D2 PO2 Programmable output 2 DO D3 RF245 Wake-up receiver RF input RF E1 GND Ground supply connection GND E2 VDDA Internal signal, not for customer use (analog on-chip regulated power; sensitive to noise) INT E3 VSUP Positive supply connection (3.3 V typical) SUP Internal signal, not for customer use (digital on-chip regulated power; sensitive to noise) Notes INT DI Pad Type Definitions Table 4-2 • Pad Type Definitions Type Description SUP Supply pad. GND Ground pad. RF RF pad. Ensure proper isolation and track impedance. RFGND RF ground pad. DI Digital input pad. DO Digital output pad. INT Internal signal. These signals are used inside the module and are made available only for Microsemi production testing. Re vi s i o n 1 4-1 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) Package Dimensions Figure 4-1 and Figure 4-2 show the ZL70323 package dimensions and pad configuration, respectively. A 1 2 3 3 B Dotted line indicates approximate location of QR code label 3 4 ( x7) Component Heights C D E Comp 1 2 3 4 Min 0.4 - Nom 0.45 - Max 0.55 0.5 0.7 0.4 Max values include 50-μm solder height a b c d f g e f Min 5.40 4.40 0.62 - Nom 5.50 4.50 4 2 2.7 1.35 1 0.5 0.5 dia Max 5.60 4.60 0.7 0.9 1.6 - All dimensions in mm 0169v1507.1 Figure 4-1 • Symbol A B C D E a b c d e f g ZL70323 Package Dimensions R e visi on 1 4-2 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) A B C D E 1 IRQ WU_ EN SPI_ SDO SPI_ CS_B GND 2 SPI_ SDI VDDIO SPI_ CLK PO2 VDDA 3 VDDD GND RF400 RF245 VSUP 0168v1503.0 Note: View from top Figure 4-2 • ZL70323 Pad Configuration Module Assembly It is recommended that the module be attached using an automated pick-and-place machine and reflow oven. The reflow profile should be based upon JESD-20-C, ensuring that the maximum and minimum parameters of the standard are not exceeded when creating a profile for the customer’s chosen assembly process. Any rework operations undertaken need to be verified to ensure that no damage comes to the product being removed. Microsemi does not guarantee the product reliability once it’s been reworked. The solder alloys to be used are either a lead-free SAC 0305 or 0405 alloy, although the module can be assembled to the customer’s board with a leaded alloy. The product is designed to be cleaned, but this is at the customer’s discretion depending upon their assembly requirements. Package Overview Table 4-3 provides additional specifications Miniaturized Standard Implant Module (MiniSIM). for the ZL70323 MICS-Band RF 15-pad LGA Delivery Form Temp Range (°C) 30-piece waffle pack 0 to +55 Yes R e visi on 1 Application Area Implant Grade Package Pb Free Table 4-3 • ZL70323 Package Overview Implant Devices External Devices Yes Yes No 4-3 5 – Typical Application Example Figure 5-1 shows a typical application example. For a detailed circuit example, please refer to the AIM300 documentation included with the ZL70103 ADK (refer to related documentation listed in Table 1-1 on page 1-1). The AIM300 is an Application Implant Module (AIM) board that features the ZL70323 implant module. Note that the ADK AIM300 prematch is designed for a 50-Ω antenna suitable for evaluation in air. Application Controller SPI_CLK SPI_DI SPI_DO Digital output Digital input Digital output 75 Ω 75 Ω 75 Ω SPI_CLK SPI_SDO SPI_SDI SPI_CS_B IRQ WU_EN PO2 ZL70323 VDDD VDDA GND VSUP VDDIO I/O Supply Supply GND RF245 Antenna 100+j150 Ω 0Ω RF400 DNP GND Optional Prematch 0170v1503.0 Figure 5-1 • Typical Application Example Comments: 1. Connect VSUP to supply. VSUP is decoupled inside the module with a 100-nF capacitor. 2. Connect VDDIO to the I/O supply (alternatively VDDIO can be connected to VSUP if the SPI bus operates at the same supply level as VSUP). 3. PO2 can be left unconnected. 4. Add resistors (approximately 75Ω) on the application host controller side to the SPI digital output lines to suppress ringing. This is highly recommended to avoid an increased risk of reduced receiver sensitivity during SPI bus activity. 5. IRQ and SPI_SDO have series 68-Ω resistors to suppress reflections and ringing. 6. RF245 and RF400 are connected together. Positions for additional antenna matching components (prematch) are reserved if the impedance of the target antenna has to be adapted to the tunable range (DNP stands for Do Not Populate). 7. VDDA and VDDD are sensitive to noise since they are connected to the regulated side of the on-chip analog and digital voltage regulators. These pads should have no external circuitry or tracks connected. Re vi s i o n 1 5-1 6 – Quality The ZL70323 module is intended for implantable applications. Manufacturing processes are carried out in ISO9001-approved facilities and all products are fully tested and qualified to ensure conformance to this data sheet. The following additional stages are implemented among others: • Enhanced change notification. • Die acceptance testing. • – Every ZL70103 die used is individually tested at 37°C. – Every ZL70103 die used is visually inspected. Every module is individually tested at room temperature. For implantable products, the following additional stages are implemented in addition to the above: • A comprehensive system of change notification and approval is invoked. No major changes to the product are made without notification to and/or approval from the customer. • Material traceability: For each module all components and consumables are traceable to the incoming material lot number. • Process traceability: Each module is identified with a unique serial number using a QR code (not human readable). Traceability is maintained to the individual module level. • Enhanced record retention: Quality records are retained for the expected duration of production and use of end products. Re vi s i o n 1 6-1 7 – Glossary Term Definition ADK Application Development Kit AIM Application Implant Module Ant Antenna BSM Base Station Module CMPG Microsemi's Communication-Medical Products Group DNP Do Not Populate ESD Electrostatic Discharge ETSI European Telecommunications Standards Institute Exceptn Exception (to testing parameters for Electrical Characteristics) FCC Federal Communications Commission (USA) FDA Food and Drug Administration (USA) FSK Frequency Shift Keying HBM Human body model I/O Input/output IC Integrated Circuit ID Identifier IEC International Electrotechnical Commission inf Infinity LGA Land Grid Array MAC Media Access Controller Max Maximum MICS Medical Implantable Communication Service Min Minimum MiniSIM Miniaturized Standard Implant Module Nom Nominal ref Reference RF Radio Frequency RoHS Restriction of Hazardous Substances RSSI Received Signal Strength Indicator RX Receive SAC SnAgCu (tin-silver-copper alloy) SAW Surface Acoustic Wave SCLA Source Code License Agreement Re vi s i o n 1 7-1 ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM) Term Definition SPI Serial Peripheral Interface strosc Strobe oscillator Temp Temperature TX Transmit Typ Typical XO Crystal Oscillator XTAL Crystal Note: Table 4-2 on page 4-1 defines the Pad Type abbreviations that are used in that chapter. They are not included in the list above. R e visi on 1 7-2 8 – Datasheet Information List of Changes The following table lists substantive changes that were made Miniaturized Standard Implant Module (MiniSIM) datasheet (151827). Revision Revision 1 (July 2015) Changes Initial release. in the ZL70323 MICS-Band RF Page All Datasheet Categories In order to provide the latest information to designers, some datasheet parameters are published before data has been fully characterized from silicon devices. The data provided for a given device is designated as either "Product Brief," "Advance," "Preliminary," or "Production." The definitions of these categories are as follows: Product Brief The product brief is a summarized version of a datasheet (advance or production) and contains general product information. This document gives an overview of specific device and family information. Advance This advance version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production. This label is used only when the data has not been fully characterized. Preliminary The preliminary datasheet contains information based on simulation and/or initial characterization. The information is believed to be correct, but changes are possible. Production The production version contains information that is considered to be final. Safety Critical, Life Support, and High-Reliability Applications Policy The products described in an advance status document may not have completed the Microsemi qualification process. Products may be amended or enhanced during the product introduction and qualification process, resulting in changes in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any product (but especially a new product) for a particular purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications. Consult the Microsemi CMPG Products Group Terms and Conditions for specific liability exclusions relating to life-support applications. A reliability report covering all of the CMPG Products Group’s products is available from Microsemi upon request. Microsemi also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for additional reliability information. Re vi s i o n 1 8-1 Microsemi Corporate Headquarters One Enterprise Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 E-mail: [email protected] Web: www.microsemi.com ©2015 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. ZL70323-DS/151827-1/07.15