ZL70323 Datasheet

Datasheet, Revision 1
ZL70323 MICS-Band RF
Miniaturized Standard Implant Module (MiniSIM)
Features
Description
•
Complete ZL70103-based MICS-Band1 RF Telemetry
Radio Solution
•
Implantable Radio Module Designed to Enable Rapid
Development of Implantable Medical Devices
•
Implant-Grade Quality Assurance
•
Ultracompact Design and Small Size (4.5×5.5×1.6mm)
•
RX Sensitivity of −102dBm at 200kbit/s (with packet error
rate of 10%)
•
Additional Lower Data Rates Available (40/18.18kbit/s)
•
2.45-GHz wake-up receiver matching network.
•
Designed to Meet Regulatory Requirements (FDA, FCC,
ETSI, and IEC)
•
Integrated 24-MHz reference frequency crystal.
•
Decoupling capacitors.
Applications
•
The ZL70323 implantable radio module implements all RFrelated functions needed to deploy the implantable node in a
MICS-band RF telemetry system. The integrated antenna
tuning circuit allows the module to be used with a wide range of
implantable antennas (nominal antenna impedance is
100+j150Ω). Figure 1 shows the module’s major subsystems:
•
ZL70103-based MICS-band RF transceiver with an
integrated matching network, SAW filters for suppression of
unwanted blockers, and antenna tuning.
Ordering Information
Implantable Medical Devices
ZL70323MNJ 15-pad LGA
–
Cardiac Rhythm Management
–
Neurostimulators
–
Drug Delivery, Sensors, and Diagnostics
VDDA
Please refer to "Package Overview" on page 4-3 for details.
VDDD
GND
VDDIO
VSUP
XTAL
WU_EN
ZL70103
IRQ
SPI_CLK
SPI_SDI
SPI_SDO
SPI_CS_B
M
MICS-Band
400-MHz
RX/TX
Ant
Match
&
Tune
Wake-up
2.45-GHz RX
Match
RF400
A
C
PO2
Figure 1 •
SAW
RF245
0167v1504.0
ZL70323 Block Diagram
1 MICS is a subset of MedRadio.
July 2015
© 2015 Microsemi Corporation
I
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
Table of Contents
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
1 – Product Description
2 – Functional Description
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MICS-Band Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.45-GHz Wake-Up Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-1
2-1
2-1
3 – Electrical Specifications
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
4 – Mechanical Specifications
Pad List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Module Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4-1
4-2
4-3
4-3
5 – Typical Application Example
6 – Quality
7 – Glossary
8 – Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
Re vi s i o n 1
II
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
List of Figures
Figure 1 • ZL70323 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Figure 4-1 • ZL70323 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Figure 4-2 • ZL70323 Pad Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Figure 5-1 • Typical Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Re vi s i o n 1
III
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
List of Tables
Table 1-1 • Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Table 3-1 • Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Table 3-2 • Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Table 3-3 • Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Table 3-4 • Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Table 3-5 • 400-MHz Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Table 3-6 • 400-MHz Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Table 3-7 • 2.45-GHz Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Table 3-8 • RF Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Table 3-9 • ESD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Table 4-1 • ZL70323 Pad List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Table 4-2 • Pad Type Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Table 4-3 • ZL70323 Package Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Re vi s i o n 1
IV
1 – Product Description
The ZL70323 implantable radio module is a second-generation, high-performance, easy-to-use RF module based on
the ZL70103 MICS-band transceiver IC. The module is extremely small and is designed to provide good performance
while consuming very little power.
The ZL70323 RF module integrates all the circuitry and functionality required to deploy a complete radio solution for
implantable applications. This allows the circuit complexity to be reduced to placing one single package on your
implantable application board.
Please refer to Table 1-1 below for all documents related to the ZL70103 family of products. These documents can be
found on Microsemi's website or by contacting Microsemi's CMPG sales for more information.
Table 1-1 • Related Documentation
Product
ZL70103 MICS-Band
RF Transceiver
Document(s)
ZL70103 Datasheet
ZL70103 Design Manual
Description
The ZL70103 MICS-Band RF Transceiver is
designed specifically for use in implantable
medical devices (such as pace makers and
neurostimulators). It also supports external
applications (such as programmers and
patient controllers).
ZL70123 MICS-Band RF Base
Station Module (BSM)
(in development)
ZL70123 Datasheet
(in development)
The ZL70123 BSM is a ZL70103-based RF
module that integrates additional circuitry and
functionality required for external applications.
ZL70120 MICS-Band RF Base
Station Module (BSM)
ZL70120 Datasheet
The ZL70120 BSM is a ZL70102-based RF
module that integrates additional circuitry and
functionality required for external applications.
The RF link of the ZL70120 BSM is compatible
with the ZL70323 Miniaturized Standard
Implant Module.
ZLE70103 Application
Development Kit (ADK)
ZLE70103 ADK Users Guide
Re vi s i o n 1
The ADK combines hardware and software to
provide an end-to-end MICS-band
communication system based on the ZL70120
Base Station Module and the ZL70323
Miniaturized Standard Implant Module
(MiniSIM). Additionally, source code with
programming examples is available with a
source code license agreement (SCLA).
1-1
2 – Functional Description
General
The ZL70323 module provides all the circuitry needed to deploy a complete, implanted, MICS-band, RF telemetry
radio solution (PHY- and MAC-layers). The ZL70323 is designed to be versatile so it can serve a broad range of
applications with different antenna, feed-through, and case implementations. Please refer to the ZL70103 Data Sheet
and the ZL70103 Design Manual for further details on using the ZL70103.
Power Supply Requirements
The module contains a decoupling capacitor on the VSUP power supply input as well as integrated decoupling
capacitors required by the analog and digital regulators of the ZL70103.
The VDDA and VDDD pads are test pads and should be neither loaded nor used in the user application. They are
connected to the internal analog and digital regulators of the ZL70103 and are intended only for production testing by
Microsemi.
MICS-Band Transceiver
The MICS-band transceiver is based on the ZL70103 IC. The transceiver signal chain is equipped with a matching
network, a SAW filter, and antenna tuning to allow a wide range of antennas to be used with the module. Please refer
to "Antenna Requirements" for more details.
Reference Frequency Crystal
The ZL70323 module is equipped with a 24-MHz reference frequency crystal supporting the integrated XO of the
ZL70103. Please refer to Chapter 10 in the ZL70103 Design Manual for information on tuning the XO.
General Purpose I/O
The ZL70323 module provides access to the PO2 pad of the ZL70103.
2.45-GHz Wake-Up Receiver
The 2.45-GHz wake-up receiver is integrated on the ZL70103 radio IC and provides a very power-efficient wake-up
subsystem. All necessary RF matching is integrated on the ZL70323 module, and the RF245 and RF400 ports can be
shorted together and connected directly to the antenna.
If the ZL70323 module is operated without using the 2.45-GHz wake-up, the RF245 connection should be grounded.
Antenna Requirements
Antenna Tuning
The ZL70323 takes advantage of the integrated antenna tuning capacitors (MATCH1 and MATCH2). This allows the
RF port to be tuned to the actual antenna impedance (within the supported tuning range). Please refer to Section 3.6 of
the ZL70103 Design Manual for details.
Re vi s i o n 1
2-1
3 – Electrical Specifications
Tables 3-1 through 3-9 provide the absolute maximum ratings and other electrical characteristics for the ZL70323.
Voltages are with respect to ground (GND) unless otherwise stated.
Absolute Maximum Ratings
Table 3-1 • Absolute Maximum Ratings
Limits
ID
Parameter
Symbol
Min.
Typ.
Max.1
Unit
Note
1.0
Supply voltage
VSUP
0
3.6
V
Note 1
1.1
Input voltage (digital I/O)
VDDIO
0
VSUP
V
Note 2
1.2
Storage temperature
Tstg
−40
+125
°C
1.3
Burn-in temperature
Tbi
+125
°C
Notes 3, 4
Notes:
1. Application of voltage beyond the stated absolute maximum rating may cause permanent damage to the device or
cause reduced reliability.
2. VDDIO must never be higher than VSUP even during system startup.
3. Device may be powered during burn-in but operation is not guaranteed.
4. Condition: 3.3V on VSUP and VDDIO
Operating Conditions
Recommended Operating Conditions
The recommended operating conditions in Table 3-2 define the nominal conditions for the device.
Table 3-2 •
Recommended Operating Conditions
Limits
ID
Parameter
Symbol
Min.
Typ.
Max.1
Unit
Note
2.0
Supply voltage
VSUP
2.05
3.5
V
Note 2
2.1
Input voltage (digital I/O)
VDDIO
1.5
VSUP
V
Note 1
2.2
Operating temperature
Top
0
+55
°C
+37
Notes:
1. Application of voltage beyond the stated absolute maximum rating may cause permanent damage to the device or
cause reduced reliability.
2. For voltages less than 2.1V, a production trim procedure must be followed.
Re vi s i o n 1
3-1
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
Electrical Characteristics
Default register and mode settings are assumed unless noted. The RF ports are assumed to have a nominal load
equal to an antenna impedance of 100+j150Ω at 403.5MHz and 50Ω at 2442MHz when the two RF ports are
combined.
Electrical testing during production is used to ensure that delivered parts fulfill the limits defined herein. In some cases
it is not possible to perform electrical testing or the testing has been carried out in a different way. These exceptions
are marked in the "Exceptn" column of Tables 3-4 to 3-8; refer to legend below.
 These parameters are guaranteed by production tests but with different limits to what is specified in the data
sheet. This is due to limitations in the capabilities of the automated test equipment. The production tests that are
carried out have been correlated to tests carried out in the lab environment.
 These parameters are guaranteed by production tests; however, these may be carried out in a different manner
to that defined in the data sheet.
 These parameters are tested during production test but the limits are for design guide only.
 These parameters are for design aid only: not guaranteed and not subject to production testing.
 Typical values according to the specified condition. If no conditions are specified, then the typical figures assume
37°C and VSUP at 3.0V. Typical values are for design aid only: not guaranteed and not subject to production
testing.
Digital Interface
The characteristics in Table 3-3 are valid for the following interconnects:
•
Digital inputs: WU_EN, SPI_CS_B, SPI_CLK, SPI_SDI
•
Digital outputs: IRQ, SPI_SDO, PO2
Table 3-3 •
Digital Interface
Limits
ID
Parameter
Symbol
Min.
Max.
Unit
Note
3.0
Digital input low
VIL
0
0.2×VDDIO
mV
Note 1
3.1
Digital input high
VIH
0.8×VDDIO
VDDIO
mV
Note 2
3.2
Digital output low
VOL
0
0.2×VDDIO
mV
3.3
Digital output high
VOH
0.8×VDDIO
VDDIO
mV
3.4
Maximum SPI clock rate
4
MHz
fclk
Note 3
Notes:
1. VIL is the required input voltage to ensure internal signal switching from high to low.
2. VIH is the required input voltage to ensure internal signal switching from low to high.
3. Default value. The maximum SPI clock rate can be programmed to 1, 2, or 4MHz.
R e visi on 1
3-2
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
Performance Characteristics
Current Consumption
Table 3-4 •
Current Consumption
Limits
ID
4.0
Parameter
SLEEP state current
Symbol
Condition
Isleep
Typ.
Max.
Unit
Exceptn
Note
Top ≤ 37°C
10
50
nA

Note 1
Top ≤ 55°C
10
150
nA

Note 1
−20°C ≤ Top ≤ 60°C
10
200
nA

Note 1, 2
Iidle
0.95
1.1
mA

4.3
5.0
mA

VSUP = 2.05V
5.2
5.7
mA

VSUP = 3.0V
5.6
6.1
mA

4.0
4.7
mA

<5
µA
4.1
IDLE state current
4.2
400-MHz receive state current
IRX400
4.3
400-MHz transmit state current
ITX400
4.4
400-MHz RSSI sniff current
Isniff400
4.5
400-MHz average wake-up current
Iwu400
4.6
Wake-up strosc (strobe oscillator)
current
Istrosc
4.7
Wake-up 2.45-GHz RX sniff current
Min.
Note 3
Note 4
VSUP = 2.05V
270
320
nA

VSUP = 3.0V
320
365
nA

1.4
1.8
mA

Note 6
−20°C ≤ Top ≤ 60°C
1.4
2.1
mA

Note 2, 6
Isniff245
Note 5
4.8
Average wake-up current (external
pulse on WU_EN)
Iwu245_ext
Top ≤ 37°C
290
410
nA

Note 6, 7
4.9
Average wake-up current (internal
strobe oscillator)
Iwu245_int
Top ≤ 37°C
600
810
nA

Note 6, 7
Notes:
1. WU_EN low between external strobe pulses.
2. The extended temperature operating conditions specify a temperature range where the chip is operating but has limited performance.
The purpose of this temperature range is to provide a wider temperature range for devices that are powered on but are in stand-by and
stored before use. Under these conditions, the device always powers up and communicates as expected.
3. Register setting for power code reg_rf_txrfpwrdefaultset is 48.
4. Average sleep/sniff current consumption for a 400-MHz sniff based on a sniff interval of 5 seconds and a sniff duration of 9.375ms.
5. WU_EN low between internal strobe pulses.
6. Register setting for bias code reg_wakeup_lnabiasis10; reg_wakeup_wk_rx_lna_negrtrim1 based on trimming.
7. Wake-up strobe periodis 1s; register setting for reg_wakeup_stroscpwidth1 is 7.
R e visi on 1
3-3
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
400-MHz Transmitter
Table 3-5 •
400-MHz Transmitter
Limits
ID
Parameter
5.0
Transmit power
5.1
Minimum transmit power
5.2
5.3
Symbol
Condition
Min. Typ. Max. Unit Exceptn
PTX400max
Top = 37°C
and
VSUP = 2.1V
−7.4
−5.6
dBm

Top = 37°C
and
VSUP = 3.0V
−4.5
−3.5
dBm


Note
Note 1
PTX400min
−31
dBm
Unwanted emissions outside the
401.75 – 405.25-MHz band
Eoutband
−30
dBc
Note 3
Unwanted emissions within the
401.75 – 405.25-MHz band
Einband
−20
dBc
Note 4
Note 2
Notes:
1.
2.
3.
4.
Register setting for power code reg_rf_txrfpwrdefaultset is 48.
Register setting for power code reg_rf_txrfpwrdefaultset is 0.
Fulfills FCC CFR47.95. Requires trimming; please refer to the ZL70103 Design Manual for details.
Fulfills FCC CFR47.95.
400-MHz Receiver
Table 3-6 •
400-MHz Receiver
Limits
ID
Parameter
Symbol
Condition Min.
Typ.

33
dB

ICP1
−41
dBm

Note 1
IIP3
−32
dBm

Note 1
6.4 RX sensitivity (2FSK-fallback
with Barker11 spreading)
PRX_2F_FB_B11
−108
dBm

Note 2
6.5 RX sensitivity (2FSK-fallback
with Barker5 spreading)
PRX_2F_FB_B5
−104
dBm

Note 2
6.6 RX sensitivity (2FSK-fallback)
PRX_2F_FB
−98
dBm

Note 2
PRX_2F
−85
dBm

Note 2
GRX
6.1 Maximum RF amplifier and
mixer gain
GRX
6.2 1-dB compression point referred
to input
6.3 Third-order input intercept point
6.7 RX sensitivity (2FSK)
24
16
Note
dB
6.0 Minimum RF amplifier and mixer
gain
11
Max. Unit Exceptn
Note:
1. Register reg_rf_rxrflnagaintrim set to 127 (second highest gain).
2. The sensitivity is based on the application circuit in Figure 5-1 on page 5-1, at the reference point of the dual-band
antenna including the optional prematch for 50-ohm testing. This value represents a packet error rate of 10%.
R e visi on 1
3-4
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
2.45-GHz Receiver
Table 3-7 •
2.45-GHz Receiver
Limits
ID
Parameter
Symbol
Condition
7.0 Sensitivity at RF245 pad
(normal mode)
PRX245
Top ≤ 37°C
7.1 Sensitivity at RF245 pad
(sensitive mode)
PRX245
Top ≤ 37°C
Min.
Typ.
Max.
Unit
Exceptn
Note
−73
dBm

Note 1
−75
dBm

Note 2
Notes:
1. 3-µs RF-on time. No frequency hopping. 2.45-GHz receiver trimmed for the conditions. Register reg_wakeup_lnabias
is 10; reg_wakeup_wk_rx_lna_negrtrim1 is based on trimming.
2. 6-µs RF-on time. No frequency hopping. 2.45-GHz receiver trimmed for the conditions. Register reg_wakeup_lnabias
is 10; reg_wakeup_wk_rx_lna_negrtrim1 is based on trimming.
RF Ports
Table 3-8 •
RF Ports
Limits
ID
Parameter
Symbol
Condition
Min.
Typ.
Max. Unit
Exceptn
Note
8.0
400-MHz nominal port impedance,
resistive part
R400
100
Ω

Note 1
8.1
400-MHz nominal port impedance,
reactive part
X400
−j150
Ω

Note 1
8.2
2.45-GHz nominal port impedance,
resistive part
R245
50
Ω

Note 2
8.3
2.45-GHz nominal port impedance,
reactive part
X245
0
Ω

Note 2
Note:
1. This impedance is measured at the RF_400 pad.
2. This impedance is measured at the RF_245 pad.
ESD
Table 3-9 •
ESD
Limits
ID
9.0
Parameter
ESD
Symbol
Min.
VESD
500
Typ.
Max.
Unit
Note
V
Note 1
Note:
1. Human Body Model (HBM).
R e visi on 1
3-5
4 – Mechanical Specifications
Pad List
Table 4-1 describes each pad on the ZL70323 module, and Table 4-2 provides definitions of the pad types listed in
Table 4-1. Proper ground is essential for good and stable performance. Please ensure all ground pads are connected.
Table 4-1 •
Pad
ZL70323 Pad List
Symbol
Description
Type
A1
IRQ
Interrupt request output
DO
A2
SPI_SDI
Data input for SPI bus interface
DI
A3
VDDD
B1
WU_EN
Wake-up enable signal
B2
VDDIO
Digital I/O supply
SUP
B3
GND
Ground supply connection
GND
C1
SPI_SDO
Data output for SPI bus interface
DO
C2
SPI_CLK
Clock for SPI bus interface
DI
C3
RF400
Antenna RF input and output for the MICS band
RF
D1
SPI_CS_B
SPI chip select (active low)
DI
D2
PO2
Programmable output 2
DO
D3
RF245
Wake-up receiver RF input
RF
E1
GND
Ground supply connection
GND
E2
VDDA
Internal signal, not for customer use (analog on-chip
regulated power; sensitive to noise)
INT
E3
VSUP
Positive supply connection (3.3 V typical)
SUP
Internal signal, not for customer use (digital on-chip
regulated power; sensitive to noise)
Notes
INT
DI
Pad Type Definitions
Table 4-2 •
Pad Type Definitions
Type
Description
SUP
Supply pad.
GND
Ground pad.
RF
RF pad. Ensure proper isolation and track impedance.
RFGND
RF ground pad.
DI
Digital input pad.
DO
Digital output pad.
INT
Internal signal. These signals are used inside the module and are made available only for Microsemi
production testing.
Re vi s i o n 1
4-1
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
Package Dimensions
Figure 4-1 and Figure 4-2 show the ZL70323 package dimensions and pad configuration, respectively.
A
1
2
3
3
B
Dotted line
indicates
approximate
location of
QR code
label
3
4 ( x7)
Component Heights
C
D
E
Comp
1
2
3
4
Min
0.4
-
Nom
0.45
-
Max
0.55
0.5
0.7
0.4
Max values include 50-μm solder height
a
b
c
d
f
g
e
f
Min
5.40
4.40
0.62
-
Nom
5.50
4.50
4
2
2.7
1.35
1
0.5
0.5 dia
Max
5.60
4.60
0.7
0.9
1.6
-
All dimensions in mm
0169v1507.1
Figure 4-1 •
Symbol
A
B
C
D
E
a
b
c
d
e
f
g
ZL70323 Package Dimensions
R e visi on 1
4-2
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
A
B
C
D
E
1
IRQ
WU_
EN
SPI_
SDO
SPI_
CS_B
GND
2
SPI_
SDI
VDDIO
SPI_
CLK
PO2
VDDA
3
VDDD
GND
RF400
RF245
VSUP
0168v1503.0
Note: View from top
Figure 4-2 •
ZL70323 Pad Configuration
Module Assembly
It is recommended that the module be attached using an automated pick-and-place machine and reflow oven. The
reflow profile should be based upon JESD-20-C, ensuring that the maximum and minimum parameters of the standard
are not exceeded when creating a profile for the customer’s chosen assembly process.
Any rework operations undertaken need to be verified to ensure that no damage comes to the product being removed.
Microsemi does not guarantee the product reliability once it’s been reworked.
The solder alloys to be used are either a lead-free SAC 0305 or 0405 alloy, although the module can be assembled to
the customer’s board with a leaded alloy. The product is designed to be cleaned, but this is at the customer’s discretion
depending upon their assembly requirements.
Package Overview
Table 4-3
provides
additional
specifications
Miniaturized Standard Implant Module (MiniSIM).
for
the
ZL70323
MICS-Band
RF
15-pad LGA
Delivery Form
Temp
Range (°C)
30-piece waffle pack
0 to +55
Yes
R e visi on 1
Application Area
Implant
Grade
Package
Pb Free
Table 4-3 • ZL70323 Package Overview
Implant
Devices
External
Devices
Yes
Yes
No
4-3
5 – Typical Application Example
Figure 5-1 shows a typical application example. For a detailed circuit example, please refer to the AIM300
documentation included with the ZL70103 ADK (refer to related documentation listed in Table 1-1 on page 1-1). The
AIM300 is an Application Implant Module (AIM) board that features the ZL70323 implant module. Note that the ADK
AIM300 prematch is designed for a 50-Ω antenna suitable for evaluation in air.
Application
Controller
SPI_CLK
SPI_DI
SPI_DO
Digital output
Digital input
Digital output
75 Ω
75 Ω
75 Ω
SPI_CLK
SPI_SDO
SPI_SDI
SPI_CS_B
IRQ
WU_EN
PO2
ZL70323
VDDD
VDDA
GND
VSUP
VDDIO
I/O Supply
Supply
GND
RF245
Antenna
100+j150 Ω
0Ω
RF400
DNP
GND
Optional
Prematch
0170v1503.0
Figure 5-1 • Typical Application Example
Comments:
1. Connect VSUP to supply. VSUP is decoupled inside the module with a 100-nF capacitor.
2. Connect VDDIO to the I/O supply (alternatively VDDIO can be connected to VSUP if the SPI bus operates at
the same supply level as VSUP).
3. PO2 can be left unconnected.
4. Add resistors (approximately 75Ω) on the application host controller side to the SPI digital output lines to
suppress ringing. This is highly recommended to avoid an increased risk of reduced receiver sensitivity during
SPI bus activity.
5. IRQ and SPI_SDO have series 68-Ω resistors to suppress reflections and ringing.
6. RF245 and RF400 are connected together. Positions for additional antenna matching components (prematch)
are reserved if the impedance of the target antenna has to be adapted to the tunable range (DNP stands for Do
Not Populate).
7. VDDA and VDDD are sensitive to noise since they are connected to the regulated side of the on-chip analog
and digital voltage regulators. These pads should have no external circuitry or tracks connected.
Re vi s i o n 1
5-1
6 – Quality
The ZL70323 module is intended for implantable applications.
Manufacturing processes are carried out in ISO9001-approved facilities and all products are fully tested and qualified
to ensure conformance to this data sheet.
The following additional stages are implemented among others:
•
Enhanced change notification.
•
Die acceptance testing.
•
–
Every ZL70103 die used is individually tested at 37°C.
–
Every ZL70103 die used is visually inspected.
Every module is individually tested at room temperature.
For implantable products, the following additional stages are implemented in addition to the above:
•
A comprehensive system of change notification and approval is invoked. No major changes to the product are
made without notification to and/or approval from the customer.
•
Material traceability: For each module all components and consumables are traceable to the incoming material
lot number.
•
Process traceability: Each module is identified with a unique serial number using a QR code (not human
readable). Traceability is maintained to the individual module level.
•
Enhanced record retention: Quality records are retained for the expected duration of production and use of end
products.
Re vi s i o n 1
6-1
7 – Glossary
Term
Definition
ADK
Application Development Kit
AIM
Application Implant Module
Ant
Antenna
BSM
Base Station Module
CMPG
Microsemi's Communication-Medical Products Group
DNP
Do Not Populate
ESD
Electrostatic Discharge
ETSI
European Telecommunications Standards Institute
Exceptn
Exception (to testing parameters for Electrical Characteristics)
FCC
Federal Communications Commission (USA)
FDA
Food and Drug Administration (USA)
FSK
Frequency Shift Keying
HBM
Human body model
I/O
Input/output
IC
Integrated Circuit
ID
Identifier
IEC
International Electrotechnical Commission
inf
Infinity
LGA
Land Grid Array
MAC
Media Access Controller
Max
Maximum
MICS
Medical Implantable Communication Service
Min
Minimum
MiniSIM
Miniaturized Standard Implant Module
Nom
Nominal
ref
Reference
RF
Radio Frequency
RoHS
Restriction of Hazardous Substances
RSSI
Received Signal Strength Indicator
RX
Receive
SAC
SnAgCu (tin-silver-copper alloy)
SAW
Surface Acoustic Wave
SCLA
Source Code License Agreement
Re vi s i o n 1
7-1
ZL70323 MICS-Band RF Miniaturized Standard Implant Module (MiniSIM)
Term
Definition
SPI
Serial Peripheral Interface
strosc
Strobe oscillator
Temp
Temperature
TX
Transmit
Typ
Typical
XO
Crystal Oscillator
XTAL
Crystal
Note: Table 4-2 on page 4-1 defines the Pad Type abbreviations that are used in that chapter. They are not included
in the list above.
R e visi on 1
7-2
8 – Datasheet Information
List of Changes
The following table lists substantive changes that were made
Miniaturized Standard Implant Module (MiniSIM) datasheet (151827).
Revision
Revision 1
(July 2015)
Changes
Initial release.
in
the
ZL70323
MICS-Band
RF
Page
All
Datasheet Categories
In order to provide the latest information to designers, some datasheet parameters are published before data has been
fully characterized from silicon devices. The data provided for a given device is designated as either "Product Brief,"
"Advance," "Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general product
information. This document gives an overview of specific device and family information.
Advance
This advance version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label is used only when the data has
not been fully characterized.
Preliminary
The preliminary datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
The production version contains information that is considered to be final.
Safety Critical, Life Support, and High-Reliability Applications Policy
The products described in an advance status document may not have completed the Microsemi qualification process.
Products may be amended or enhanced during the product introduction and qualification process, resulting in changes
in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any product (but
especially a new product) for a particular purpose, including appropriateness for safety-critical, life-support, and other
high-reliability applications. Consult the Microsemi CMPG Products Group Terms and Conditions for specific liability
exclusions relating to life-support applications. A reliability report covering all of the CMPG Products Group’s products
is available from Microsemi upon request. Microsemi also offers a variety of enhanced qualification and lot acceptance
screening procedures. Contact your local sales office for additional reliability information.
Re vi s i o n 1
8-1
Microsemi Corporate Headquarters
One Enterprise
Aliso Viejo, CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100
Sales: +1 (949) 380-6136
Fax: +1 (949) 215-4996
E-mail: [email protected]
Web: www.microsemi.com
©2015 Microsemi Corporation. All rights
reserved. Microsemi and the Microsemi
logo are trademarks of Microsemi
Corporation. All other trademarks and
service marks are the property of their
respective owners.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions
for communications, defense & security, aerospace and industrial markets. Products include high-performance
and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management
products; timing and synchronization devices and precise time solutions, setting the world’s standard for time;
voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper
products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi
is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at
www.microsemi.com.
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability
of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of
the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi
have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications.
Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all
performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not
rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to
independently determine suitability of any products and to test and verify the same. The information provided by
Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information
is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any
other IP rights, whether with regard to such information itself or anything described by such information. Information
provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the
information in this document or to any products and services at any time without notice.
ZL70323-DS/151827-1/07.15