Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP I202 / I203 Series I203 Package Product Features: 20.7 Applications: 4 3 1 2 12.6 CMOS/TTL Compatible Logic Levels Low Noise Compatible with Leadfree Processing RoHS Compliant Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 7.62 15.24 Frequency 1 MHz to 51.840 MHz 5.1 Max. 6 Min. Output Level HC-MOS TTL ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. Duty Cycle 50% ±5% Rise / Fall Time 10 nS Max.* 0.048 0.36 I202 Package 12.6 Output Load HC-MOS TTL Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL 15 pF Frequency Stability See Frequency Stability Table Supply Voltage See Input Voltage Table, tolerance ±10 % Current 50 mA Max.* Control Voltage 1.65 VDC ±1.5 VDC for Vcc = 3.3 VDC, 2.5 VDC ±2.0 VDC for VCC = 5.0 VDC Slope Positive 4 3 1 2 12.6 7.62 7.62 5.1 Max. 6 Min. 0.48 Jitter <1.0 pS RMS (12 kHz to 20 MHz)** Operating See Operating Temperature Table in Part Number Guide Storage Package I202 I203 - 0.36 -55° C to +125° C Part Number Guide Operating Temperature Dimension Units: mm Pin Connection 1 Control Voltage 2 GND 3 Output 4 Vcc Frequency Stability Sample Part Number: I202-1BC3-27.000 MHz Pullability Supply Voltage 1 = 0° C to +70° C F = ±20 ppm B = ±50 ppm min. 5 = 5.0 VDC 3 = -20° C to +70° C X = ±30 ppm C = ±100 ppm min. 3 = 3.3 VDC 4 = -30° C to +75° C B = ±50 ppm K = ±150 ppm min. 2 = -40° C to +85° C C = ±100 ppm L = ±200 ppm min. Frequency - 27.000 MHz NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Frequency, supply, and load related parameters. Frequency related, for additonal information contact your sales representative. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 10/10_B Specifications subject to change without notice Page 1 Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP I202 / I203 Series Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4- (Sn / Cu / Ag over Ni over Kovar base metal). Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: XXXX (Part Number detail = I203-XXXX-Freq.) Line 3: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 10/10_B Specifications subject to change without notice Page 2