I607 Series 5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS Applications: Product Features: Small Surface Mount Package Low Noise Pb Free/ RoHS Complient Compatible with Leadfree Processing SD/HD Video Wireless Base Stations Sonet /SDH Server and Storage 5.0 0.2 7.0 0.3 2.0 Max. Frequency 1 MHz to 77.760 MHz Output Level LVDS LVPECL Duty Cycle Vod = 393 mV Typ., 475 mV Max. ‘0’ = Vcc - 1.63 V Max. ‘1’ = Vcc - 1.02 V Min. 50% ±10% Rise / Fall Time 0.6 nS Max. Output Load LVDS LVPECL Frequency Stability 100 Differential 50 to Vcc - 2.0 VDC 50 ppm Max. Start-up Time 10 mS Max. Supply Voltage 3.3 VDC ± 5% Current LVDS = 90 mA Max., LVPECL = 130 mA Max. Linearity 15% Max. Pullability See Table Below Control Voltage 1.65 VDC ± 1.5 VDC Input Impedance 50K Min. Jitter <1.0 pS RMS (12 kHz to 20 MHz)* Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C 5.08 Recommended Pad Layout 5.08 Part Number Guide Package I607 4.2 Bypass =0.01 uF Pin 1 2 3 4 5 6 Connection Control Voltage Enable / Disable Ground Output N.C. Vdd Dimension Units: mm Sample Part Number: Operating Temperature Stability (in ppm) I607–1BC8H–77.760 Pullability Output Enable / Disable H = Enable 1 = 0 C to +70 C **D = 15 B = 50 ppm 8 = LVDS 3 = -20 C to +70 C A = 25 C = 100 ppm 9 = LVPECL 2 = -40 C to +85 C B = 50 Frequency -77.760 MHz C = 100 NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. *Frequency related, for additional information contact your sales representative. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 10/10_C Specifications subject to change without notice Page 1 2.0 I607 Series 5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 10/10_C Specifications subject to change without notice Page 2