4 Pad Ceramic Package Quartz Crystal, 1.0 mm x 1.2 mm Product Features: ILCX21 Series Applications: Low Cost SMD Package Ultra Miniature Package Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 IOT 36 MHz to 80 MHz (Contact Sales Representative for developed frequencies) Frequency ESR (Equivalent Series Resistance) 36.0 MHz – 40.0 MHz 40.0 MHz – 48.0 MHz 48.0 MHz – 80.0 MHz 150 Max. 80 Max. 60 Max. Shunt Capacitance (C0) 3.0 pF Max. Frequency Tolerance @ 25 C 30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature 50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 6 pF Standard Drive Level 100 µW Max. Aging 3 ppm Max. / Year Standard Temperature Operating -20 C to +70 C (see Part Number Guide for more options) Storage -40 C to +85 C Part Number Guide Package ILCX21 - Sample Part Number: Tolerance (ppm) at Room Temperature ILCX21 - FB1F6 - 37.400 Stability (ppm) over Operating Temperature Operating Temperature Range B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = ±30 ppm F = ±30 ppm** 1 = 0°C to +70°C G = ±25 ppm G = ±25 ppm** 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm** 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** 9 = -10°C to +50°C Mode (overtone) F = Fundamental Load Capacitance (pF) 6 pF Standard Or Specify Frequency - 37.400 MHz * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 01/20/16_A Page 1 of 2 4 Pad Ceramic Package Quartz Crystal, 1.0 mm x 1.2 mm Pb Free Solder Reflow Profile: ILCX21 Series Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 5000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I, Date Code (yww) ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 01/20/16_A Page 2 of 2