GP1S54J0000F GP1S54J0000F Gap : 3mm, Slit : 0.5mm Phototransistor Output, Case package Transmissive Photointerrupter ■Description ■Agency approvals/Compliance GP1S54J0000F is a standard, phototransistor output, transmissive photointerrupter with opposing emitter and detector in a case, providing non-contact sensing. For this family of devices, the emitter and detector are inserted in a case, resulting in a through-hole design. This device uses positioning pins to insure accurate placement and avoid miss-orientation of the emitter and detector. 1. Compliant with RoHS directive (2002/95/EC) ■Applications 1. General purpose detection of object presence or motion. Example : Printer, FAX, Optical storage unit ■Features 1. Transmissive with phototransistor output 2. Highlights : ・Vertical Slit for alternate motion detection ・Positioning Pin to prevent misalignment 3. Key Parameters : ・Gap Width : 3mm ・Slit Width (detector side): 0.5mm ・Package : 12.2×8×5mm 4. RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: OP14024EN 1 GP1S54J0000F ■Internal Connection Diagram ① ② ③ ④ ■Outline Anode Cathode Collector Emitter Drawing No. CY12645i02A Unit : 1/1 mm 1) Unspecified tolerances shall be followed the list below. Dimension Tolerance(±) 0.1 d ≦ 6 0.2 6 < d ≦ 18 2) Dimensions in parenthesis are shown for reference. 3) portion : Marking model No., Company name and date code. Sheet No.: OP14024EN 2 GP1S54J0000F ■Absolute maximum ratings Ta=25°C Parameter Input Symbol Rating Unit *1 Forward current IF 50 mA *1, 2 Peak forward current IFM 1 A Reverse voltage VR 6 V P 75 mW Collector-emitter voltage VCEO 35 V Emitter-collector voltage VECO 6 V Collector current Ic 20 mA Collector power dissipation Pc 75 mW Operating temperature Topr -25 to +85 °C Storage temperature Tstg -40 to +100 °C Power dissipation Output *1 *3 Soldering temperature Tsol 260 °C *1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1, 2, 3. *2 Pulse width≦100μs, Duty ratio : 0.01 *3 For 5s ■Electro-optical Characteristics Parameter Input Symbol TYP. MAX. Ta=25°C Unit VF IF=20mA - 1.2 1.4 V Peak forward voltage VFM IFM=0.5A - 3 4 V VR=3V - - 10 μA VCE=20V - 1 100 μA 0.5 - 5.0 mA - - 0.4 V - 3 15 μs - 4 20 μs IR Dark current Transfer characteristics MIN. Forward voltage Reverse current Output Conditions ICEO Collector current Ic Collector-emitter saturation voltage VCE(sat) Response time (Rise) tr Response time (Fall) tf VCE=5V, IF=20mA IF=40mA, Ic=0.5mA VCE=2V, Ic=2mA RL=100Ω (Test circuit for response time) Vcc Input RL 10% Test pin Output 90% ▽ tr tf Sheet No.: OP14024EN 3 GP1S54J0000F Fig.1 Forward current vs. ambient temperature IF (mA) 50 40 Forward current 30 20 10 0 -25 0 Collector power dissipation Pc (mW) Fig.2 25 50 Ambient temperature Ta (°C) 100 Collector power dissipation vs. ambient temperature 100 75 80 60 40 15 20 0 -25 0 25 50 Ambient temperature Ta (°C) Fig.3 75 85 100 Peak forward current vs. duty ratio (Pulse width≦100μs 2000 Peak forward current IFM (mA) 75 85 Ta=25°C) 1000 500 200 100 50 20 10-3 2 5 10-2 2 10-1 5 2 5 100 Duty ratio Sheet No.: OP14024EN 4 GP1S54J0000F ■Supplements ●Parts This product uses the below parts. 1) Light detector (PT481, Quantity : 1) Type Material Maximum sensitivity wavelength (nm) Sensitivity wavelength (nm) Response time (μs) Phototransistor Silicon (Si) 800 400 to 1200 3 2) Light emitter (GL480, Quantity : 1) Type Material Maximum light emitting wavelength (nm) I/O Frequency (MHz) Infrared light emitting diode (non-coherent) GaAs 950 0.3 3) Material Case Lead flame finish Black NORYL resin Solder dip (Sn-3.0Ag-0.5Cu) 4) Others This product shall not be radiation flux proof. ●ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) ●Specified brominated flame retardants Specified brominated flame retardants (PBB and PBDE) are not used in this device at all. ●Compliance with each regulation 1) The RoHS directive (2002/95/EC) This product complies with the RoHS directive (2002/95/EC). Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) 2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法). Toxic and hazardous substances Hexavalent Polybrominated Polybrominated Category Lead Mercury Cadmium chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) PHOTOINTERRUPTER ✓ ✓ ✓ ✓ ✓ ✓ ✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. ●Product mass : Approx. 0.45g ●Country of origin : Japan, Indonesia, Philippine, China Sheet No.: OP14024EN 5 GP1S54J0000F ■Notes ●Circuit design In circuit designing, make allowance for the degradation of the light emitting diode output that results from long continuous operation. (50% degradation/5 years) ●Position of opaque board Opaque board shall be installed at place 4mm or more from the top of elements. (Example) 4mm or more In case opaque board is the material with an low light blocking effect, There is a possibility of malfunctioning because the light of LED transmits the opaque board. When you design the opaque board, please note transmittance of infrared rays wave length (950nm) and the thickness of the opaque board. And, please adjust the amount of transmitted light to 0.1% or less. ●Soldering To solder onto lead pins, solder at 260°C for 5 seconds or less. Please take care not to let any external force exert on lead pins when soldering or just after soldering. Please don't do soldering with preheating, and please don't do soldering by reflow. ●Cleaning conditions : (1) Solvent cleaning : Solvent temperature 45°C or less Immersion 3 min. or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. (3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol ●Flux Some flux, which is used in soldering, may crack the package due to synergistic effect of alcohol in flux and the rise in temperature by heat in soldering. Therefore, in using flux, please make sure that it does not have any influence on appearance and reliability of the photointerrupter. Sheet No.: OP14024EN 6 GP1S54J0000F ■Packing specification No. Name 1 Device case 2 Partition 3 Maltplane Antistatic electricity bag Kraft tape 4 5 Material Corrugated cardboard Corrugated cardboard Urethane Polyethylene Paper Quantity 1/1000 1/1000 2/1000 1/100 - ● Packing method 1) Put 100 devices into antistatic electricity bag, and seal. <Fig. 1> 2) Put a maltplane and partition into a device case. Put a bag into a partition box (10 bags per case) and put a maltplane. <Fig. 2> 3) Seal device case with Kraft tape. <Fig. 3> 4) Indication phase items The contents of the carton indication conforms to EIAJ C-3 and the following items are described in “A part”. Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin <Fig. 3> (1000pcs./a packing box) (Approximately 810g/a packing mass) Sheet No.: OP14024EN 7 GP1S54J0000F ■Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: OP14024EN 8