uClamp2511T Datasheet

uClamp2511T
Low Profile μClamp®
1-Line ESD protection
PROTECTION PRODUCTS - MicroClamp®
Description
Features
®
The μClamp series of Transient Voltage Suppressors
(TVS) are designed to replace multilayer varistors
(MLVs) in portable applications such as cell phones,
notebook computers, and PDAs. They offer superior
electrical characteristics such as lower clamping
voltage and no device degradation when compared to
MLVs. They are designed to protect sensitive semiconductor components from damage or upset due to
electrostatic discharge (ESD), lightning, electrical fast
transients (EFT), and cable discharge events (CDE).
‹ Transient protection for data lines to
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The μClamp®2511T is constructed using Semtech’s
proprietary EPD process technology. The EPD process
provides low standoff voltages with significant reductions in leakage currents and capacitance over siliconavalanche diode processes. They feature a true
operating voltage of 2.5 volts for superior protection
when compared to traditional pn junction devices.
The μClamp2511T is in a 2-pin SLP1006P2T package.
It measures 1.0 x 0.6 x 0.4mm. The leads are spaced
at a pitch of 0.65mm and are finished with lead-free
NiPdAu. Each device will protect one line operating at
2.5 volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practical. They may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (±15kV air,
±8kV contact discharge). The combination of small
size and high ESD surge capability makes them ideal
for use in portable applications such as cellular
phones, digital cameras, and MP3 players.
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.4mm)
Protects one data line
Low reverse current: 10nA typical (VR=2.5V)
Working voltage: 2.5V
Low leakage current
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SLP1006P2T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.4 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code
Packaging : Tape and Reel
Applications
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Dimensions
Cellular Handsets & Accessories
Portable Instrumentation
Keypads, Side Keys, LCD Displays
Notebooks & Desktop Computers
MP3 Players
Schematic & PIN Configuration
1.0
0.60
0.65
0.40
Nominal Dimensions (mm)
Revision 10/09/2009
SLP1006P2T (Bottom View)
1
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uClamp2511T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
40
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
5
Amps
VESD
+/- 20
+/- 15
kV
TJ
-40 to +85
°C
TSTG
-55 to +150
°C
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Reverse Stand-Off Voltage
Symbol
Conditions
Minimum
VRWM
Punch-Through Voltage
V PT
IPT = 2μA
2.7
Snap -Back Voltage
VSB
ISB = 50mA
2.8
Reverse Leakage Current
IR
VRWM = 2.5V
Clamp ing Voltage
VC
Clamp ing Voltage
Junction Cap acitance
© 2009 Semtech Corp.
Typical
3.1
Maximum
Units
2.5
V
3.6
V
V
0.05
μA
IPP = 1A, tp = 8/20μs
5.5
V
VC
IPP = 5A, tp = 8/20μs
8
V
I/O p in to Gnd
VR = 0V, f = 1MHz
10
pF
Cj
2
0.01
6
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uClamp2511T
PROTECTION PRODUCTS
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current
10
1
Clamping Voltage - VC (V)
Peak Pulse Power - P PP (kW)
9
0.1
8
7
6
5
4
3
Waveform
Parameters:
tr = 8μs
td = 20μs
2
1
0
0.01
0.1
1
10
100
0
1000
1
2
3
4
5
Peak Pulse Current - IPP (A)
Pulse Duration - tp (s)
Typical Insertion Loss (S21)
Normalized Junction Capacitance vs. Reverse Voltage
CH1 S21
LOG
6 dB / REF 0 dB
1: -2.2287 dB
800 MHz
1.6
f = 1 MHz
1.4
1.2
Cj(VR) / Cj(VR=0V)
2: -2.3884 dB
900 MHz
0 dB
12
-6 dB
1
-18 dB
0.6
-24 dB
0.4
-30 dB
0.2
-36 dB
0
-42 dB
0.5
1
1.5
2
Reverse Voltage - VR (V)
2.5
3
-48 dB
4
4: -13.643 dB
2.5 GHz
1
MHz
10
MHz
100
MHz
START . 030 MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
ESD Clamping (Pin 1 to 2 and 2 to 1)
(-8kV Contact per IEC 61000-4-2)
ESD Clamping (Pin 1 to 2 and 2 to 1)
(8kV Contact per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
© 2009 Semtech Corp.
3: -5.5200 dB
1.8 GHz
3
-12 dB
0.8
0
6
Note: Data is taken with a 10x attenuator
3
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uClamp2511T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Device Schematic & Pin Configuration
The μClamp2511T is designed to protect one data line
operating up to 2.5 volts. It will present a high
impedance to the protected line up to 2.5 volts. It will
“turn on” when the line voltage exceeds 2.7 volts. The
device is bidirectional and may be used on lines where
the signal polarity is above and below ground. These
devices are not recommended for use on DC power
supply lines due to their snap-back voltage
characteristic.
EPD TVS Characteristics
These devices are constructed using Semtech’s
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional avalanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 2.5V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in traditional silicon-avalanche TVS diodes. The EPD mechanism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will “punch-through” to a conducting state. This structure results in a device with superior DC electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
© 2009 Semtech Corp.
4
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uClamp2511T
PROTECTION PRODUCTS
Applications Information - Spice Model
Spice Model
uClamp2511T Spice Parameters
© 2009 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
1E-20
1E-20
BV
Volt
2.2
2.2
VJ
Volt
0.7
0.7
RS
Ohm
0.3
0.3
IB V
Amp
1E-3
1E-3
CJO
Farad
12E-12
12E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.05
0.05
N
--
1.1
1.1
EG
eV
1.11
1.11
5
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uClamp2511T
PROTECTION PRODUCTS
Outline Drawing - SLP1006P2T
A
B
D
E
DIM
TOP VIEW
A
SEATING
PLANE
aaa C
C
A1
A
A1
b
D
E
e
L
R
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.015 .016 .017
.000 .001 .002
.018 .020 .022
.035 .039 .043
.020 .024 .028
.026 BSC
.008 .010 .012
.002 .004 .006
2
.003
.004
0.37 0.40 0.43
0.00 0.03 0.05
0.45 0.50 0.55
0.90 1.00 1.10
0.50 0.60 0.70
0.65 BSC
0.20 0.25 0.30
0.05 0.10 0.15
2
0.08
0.10
PIN 1 ID
R
bxN
bbb
C A B
2x L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006P2T
Y
(C)
DIM
C
G
X
Y
Z
Z
G
X
DIMENSIONS
INCHES
MILLIMETERS
(.033)
(0.85)
.012
0.30
.024
0.60
.022
0.55
.055
1.40
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2009 Semtech Corp.
6
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uClamp2511T
PROTECTION PRODUCTS
Marking Code
Ordering Information
51
Part Number
Working
Voltage
Qty per
Reel
Reel
Size
uClamp 2511T.TCT
2.5V
3,000
7 Inch
Notes:
1) This is a lead-free, RoHS/WEEE compliant product
MicroClamp, uClamp and μClamp are marks of Semtech
Corporation
Notes:
1)Marking will also include line matrix date code
2) Device is electrically symmetrical
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
0.69 +/-0.10 mm
B0
K0
1.19 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.4 mm
±0.25
(.031)
E
1.750±.10
mm
(.069±.004)
F
P
P0
P2
T
W
3.5±0.05
mm
(.138±.002)
4.0±0.10
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05
mm
(.079±.002)
0.254±0.02
mm (.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2009 Semtech Corp.
7
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