PC3SF21YVZAF

PC3SF21YVZ Series
VDRM : 600V, Reinforced insulation type
Zero cross type
DIP 6pin
Phototriac Coupler for triggering
PC3SF21YVZ
Series
∗
Non-zero cross type is also available.
(PC3SF11YVZ Series)
■ Description
■ Agency approvals/Compliance
PC3SF21YVZ Series reinforced insulation type
Phototriac Coupler include an infrared emitting diode
(IRED) optically coupled to an output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 3SF21)
2. Approved by CSA, file No. CA95323 (as model No.
3SF21)
3. Approved by BSI : BS-EN60065, file No. 6690/BSEN60950, file No. 7421, (as model No. 3SF21)
4. Approved by SEMKO, EN60065/EN60950, file No.
0033029 (as model No. 3SF21)
5. Approved by DEMKO, EN60065/EN60950, file No.
310107 (as model No. 3SF21)
6. Approved by FIMKO, EN60065/EN60950, file No.
15795 (as model No. 3SF21)
7. Approved by VDE ( ∗) (DIN EN 60747-5-2), file No.
40008189 (as model No. 3SF21)
8. Package resin : UL flammability grade (94V-0)
■ Features
1. High repetitive peak off-state voltage (VDRM : 600V)
2. Zero crossing functionality (VOX : MAX. 20V)
3. IFT ranks available (see Model Line-up section in this
datasheet)
4. 6 pin DIP package
5. Reinforced insulation type (MIN. 0.4mm internal
separation)
6. Superior noise immunity (dV/dt : MIN. 1 000V/µs)
7. Double transfer mold construction (Ideal for Flow
Soldering)
8. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
(∗)
DIN EN60747-5-2 : successor standard of DIN VDE0884
Up to Date code "RD" (December 2003), approval of DIN
VDE0884.
From Date code "S1" (January 2004), approval of DIN
EN60747-5-2.
■ Applications
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. AC line control in power supply applications.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A08101FEN
Date Mar. 31. 2004
© SHARP Corporation
PC3SF21YVZ Series
■ Internal Connection Diagram
Anode
Cathode
3 NC
5
4 Anode/Cathode
5 No external connection
4
6 Cathode/Anode
Zero Crossing Circuit
1
1
6
2
3
2
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC3SF21YTZ]
2. Wide Through-Hole Lead-Form [ex. PC3SF21YVZ]
1.2±0.3
SHARP
mark
"S"
4
Rank mark
Rank mark
3SF21
Date code (2 digit)
Date code (2 digit)
1
Factory identification mark
θ
θ
2.54±0.25
θ : 0 to 13˚
Product mass : approx. 0.35g
0.6±0.2
4
Model No.
SHARP
mark
"S"
Rank mark
6.5±0.5
3SF21
Anode
mark
4
5
4
0.26±0.1
Epoxy resin
3
3.5±0.5
7.62±0.3
1.0+0.4
−0
2
Factory identification mark
VDE
identification mark
7.12±0.5
7.62±0.3
Factory identification mark
3.5±0.5
2.54±0.25
0.5
Date code (2 digit)
1
7.12±0.5
2.7MIN.
Rank mark
Anode
mark
3
VDE
identification mark
Model No.
4
3SF21
0.35±0.25
2
Epoxy resin
2.54±0.25
1.0+0.4
−0
0.75
±0.25
10.0+0
−0.5
5
10.16±0.5
0.75±0.25
MAX.
12.0
Product mass : approx. 0.33g
∗Pin
0.26
1.2±0.3
6
Date code (2 digit)
1
10.16
0.25±0.25
5
±0.1
±0.5
0.5±0.1
4. Wide SMT Gullwing Lead-Form [ex. PC3SF21YWP]
1.2±0.3
6
Epoxy resin
Product mass : approx. 0.35g
3. SMT Gullwing Lead-Form [ex. PC3SF21YXP]
0.6±0.2
±0.3
7.62
3.25±0.5
0.5
3.25±0.5
Epoxy resin
2.54±0.25
Factory identification mark
7.12±0.5
0.5TYP.
2.9±0.5
3.5±0.5
7.62±0.3
±0.1
2
VDE
identification mark
3.5±0.5
7.12±0.5
3
0.26
3
6.5±0.5
VDE
identification mark
2
4
2.9±0.5
1
Anode
mark
TYP.
4
Model No.
4
5
3SF21
Anode
mark
SHARP
mark
"S"
6
±0.1
5
6.5±0.5
Model No.
6
6.5±0.5
SHARP
mark
"S"
1.2±0.3
0.6±0.2
0.6±0.2
Product mass : approx. 0.34g
is not allowed external connection
Sheet No.: D2-A08101FEN
2
PC3SF21YVZ Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A08101FEN
3
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
IF
50
Forward current
Input
VR
6
Reverse voltage
I
(rms)
0.1
RMS ON-state current
T
*3
Output Peak one cycle surge current
Isurge
1.2
600
Repetitive peak OFF-state voltage VDRM
*1
Viso (rms)
5.0
Isolation voltage
Topr
−30 to +100
Operating temperature
Tstg
−55 to +125
Storage temperature
*2
Tsol
270 *4
Soldering temperature
(Ta=25˚C)
Unit
mA
V
A
A
V
kV
˚C
˚C
˚C
1mm
PC3SF21YVZ Series
Soldering area
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Repentitive peak OFF-state current
ON-state voltage
Output Holding current
Critical rate of rise of OFF-state voltage
Zero cross voltage
Transfer Minimum trigger current
characteristics Isolation resistance
Turn-on time
Rank A
Rank B
(Ta=25˚C)
Symbol
VF
IR
IDRM
VT
IH
dV/dt
VOX
Conditions
IF=20mA
VR=3V
VD=VDRM
IT=0.1A
VD=4V
−
VD=1/√2 ·VDRM
IF=15mA, Resistance load
IFT
VD=4V, RL=100Ω
RISO
ton
DC500V,40 to 60%RH
VD=4V, RL=100Ω, IF=20mA
MIN. TYP.
−
1.2
−
−
−
−
−
−
0.1
−
1 000 2 000
−
−
−
−
−
−
5×1010 1011
−
−
MAX.
1.4
10
1
2.5
3.5
−
20
10
7
−
50
Unit
V
µA
µA
V
mA
V/µs
V
mA
Ω
µs
Sheet No.: D2-A08101FEN
4
PC3SF21YVZ Series
Model Line-up
Lead Form
Through-Hole
Shipping Package
DIN
EN60747-5-2
Model No.
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
-
Approved
SMT Gullwing
Sleeve
50pcs/sleeve
-
Approved
- PC3SF21YTZAF
- PC3SF21YTZBF
- PC3SF21YXZAF
- PC3SF21YXZBF
Wide SMT Gullwing
Sleeve
50pcs/sleeve
SMT Gullwing
-
Approved
- PC3SF21YWZAF
- PC3SF21YWZBF
-
Wide Through-Hole
-
- PC3SF21YVZAF
- PC3SF21YVZBF
- PC3SF21YXPAF
- PC3SF21YXPBF
-
IFT [mA]
(V D =4V,
R L =100Ω )
A
B
MAX.10
MAX.7
Rank mark
IFT [mA]
(V D =4V,
R L =100Ω )
A
B
MAX.10
MAX.7
Approved
Wide SMT Gullwing
Taping
1 000pcs/reel
Approved
Rank mark
Approved
- PC3SF21YWPAF
- PC3SF21YWPBF
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A08101F EN
5
PC3SF21YVZ Series
Fig.2 RMS ON-state Current vs.
Ambient Temperature
70
175
60
150
RMS ON-state current Ir (rms) (mA)
Forward current IF (mA)
Fig.1 Forward Current vs. Ambient
Temperature
50
40
30
20
10
125
100
75
50
25
0
0
−30
0
50
−30
100
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs.
Ambient Temperature
10
Minimum trigger current IFT (mA)
Ta=75˚C
Forward current IF (mA)
VD=4V
RL=100Ω
9
100
50
50˚C
25˚C
0˚C
10
5
−25˚C
8
7
6
5
4
3
2
1
1
0.9
1
1.1
1.2
1.3
1.4
0
−40
1.5
−20
Forward voltage VF (V)
0
20
40
60
Fig.6 ON-state Voltage vs.
Ambient Temperature
1.3
IT=100mA
2.4
1.2
2.2
ON-state voltage VT (V)
Relative repetitive peak OFF-state voltage
VDRM (Tj=Ta) / VDRM (Tj=25˚C)
100
Ambient temperature Ta (˚C)
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
1.1
1
0.9
0.8
0.7
−40
80
2
1.8
1.6
1.4
1.2
−20
0
20
40
60
80
1
−40
100
Ambient temperature Ta (˚C)
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Sheet No.: D2-A08101FEN
6
PC3SF21YVZ Series
Fig.7 Holding Current vs.
Ambient Temperature
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
10−5
1
Repetitive peak OFF-state current IDRM (A)
Holding current IH (mA)
VD=4V
0.1
0.01
−40
−20
0
20
40
60
80
VD=600V
10−6
10−7
10−8
10−9
−40
100
−20
Ambient temperature Ta (˚C)
40
60
80
100
Fig.10 Zero-cross Voltage vs.
Ambient Temperature
20
VD=6V
RL=100Ω
Ta=25˚C
Resistance load,
IF=15mA
18
Zero-cross voltage VOX (V)
Turn-on time tON (µs)
20
Ambient temperature Ta (˚C)
Fig.9 Turn-on Time vs. Forward Current
100
0
10
16
14
12
10
8
6
4
2
0
−40
1
1
10
100
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D2-A08101FEN
7
PC3SF21YVZ Series
■ Design Considerations
● Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are
intended to be used as triggering device for main Triacs. Please ensure that the output rating of these
devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in
malfunctions.
For applications with inductive loads such as motors,please use caution in utilizing a zero crossing type
Phototraiac Coupler as this may cause undesired operations due to the phase difference between voltage
and current of load.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit. Please keep in mind the Sharp Phototriac Coupler
incorporate superrior dV/dt ratings which can eliminate the need for a snubber circuit.
For over voltage protection, a Varistor may be used.
● Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
Wide SMT Gullwing Lead-form
10.2
1.7
1.7
2.54
2.54
2.54
2.54
8.2
2.2
2.2
(Unit : mm)
Sheet No.: D2-A08101FEN
8
PC3SF21YVZ Series
● Standard Circuit (Medium/High Power Triac Drive Circuit)
PC3SF21YVZ
1
6
Load
2
5
3
Triac
AC Line
4
Zero Crossing
Circuit
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A08101FEN
9
PC3SF21YVZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A08101FEN
10
PC3SF21YVZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A08101FEN
11
PC3SF21YVZ Series
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
±2
5.9
10.8
520
6.35
(Unit : mm)
Sheet No.: D2-A08101FEN
12
PC3SF21YVZ Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
I
5˚
X.
MA
H
H
A
B
C
E
K
Dimensions List
A
B
±0.3
16.0
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
7.8±0.1
E
2.0±0.1
F
4.0±0.1
(Unit:mm)
G
+0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
17.5±1.5
e
f
±1.0
23
2.0±0.5
f
a
b
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A08101FEN
13
PC3SF21YVZ Series
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
G
E
I
J
MA
X.
H
H
A
B
C
Dimensions List
A
B
24.0±0.3
11.5±0.1
H
I
±0.1
12.2
0.4±0.05
5˚
K
C
1.75±0.1
J
4.15±0.1
D
12.0±0.1
K
7.6±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
a
Dimensions List
a
b
330
25.5±1.5
e
f
±1.0
23
2.0±0.5
f
b
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A08101FEN
14
PC3SF21YVZ Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
Sheet No.: D2-A08101FEN
15