RadReport MUX8530 (3/10)

March 15, 2010
Radiation Performance Data Package
MUX8530-S
MUX8530-S DSCC SMD Part Number: 5962-0923001KXC
16 channel analog multiplexer,
high impedance analog input, single output with ESD protection
Prepared by:
Aeroflex Plainview, Inc.
35 South Service Road
Plainview, NY 11803
1. MUX8530-S:
1.1
1.1.1
1.2
Part Description
16 channel analog multiplexer, high impedance analog input, single output with ESD protection.
Applicable Documents
1.2.1
Appendix A:
Data Sheet:
MUX8530
16-Channel Analog Multiplexer Module,
Radiation Tolerant & ESD Protected
1.2.2
Appendix B:
NESREC:
NGCP3580
A Radiation Hardened High Voltage 16:1 Analog
Multiplexer for Space Applications
1.2.3
Appendix C:
DSCC SMD:
5962-09230
MICROCIRCUIT, HYBRID, LINEAR,
16 CHANNEL, ANALOG MULTIPLEXER
2. Radiation Performance
2.1
2.1.1
2.2
2.2.1
2.3
2.3.1
Total Dose:
150 krads(Si), Dose rate = 50 - 300 rads(Si)/s
Every wafer lot is subjected to RLAT testing at the stated total dose and dose rate.
SEU:
Immune: Tested to 90 MeV-cm2/mg
See Appendix B: 2008 NSREC Radiation Effects Data Workshop Proceedings, pp 82-84.
SEL:
Immune, guaranteed by process design
See Appendix B: 2008 NSREC Radiation Effects Data Workshop Proceedings, pp 82-84.
PAGE 2 of 2
Standard Products
MUX8530 16-Channel Analog Multiplexer Module
Radiation Tolerant & ESD Protected
www.aeroflex.com/mux
April 20, 2009
FEATURES
❑
❑
16 Channels provided by one multiplexer
Radiation performance
- Total dose:
150 krads(Si), Dose rate = 50 - 300 rads(Si)/s
- SEU:
Immune up to 90 MeV-cm2/mg
- SEL:
Immune by process design
❑
Full military temperature range
❑
Low power consumption < 15mW
❑
One address bus (A0-3), and one enable line
❑
All channel Inputs protected by ±20V nominal transorbs
❑
Fast access time < 500ns typical
❑
Break-Before-Make switching
❑
High analog input impedance (power on or off)
❑
❑
❑
Designed for aerospace and high reliability space applications
Packaging – Hermetic ceramic
- 56 leads, 0.80"Sq x 0.20"Ht quad flat pack
- Typical Weight 6 grams
DSCC SMD 5962-09230 pending
Note: Aeroflex Plainview does not currently have a DSCC certified Radiation Hardened Assurance Program.
GENERAL DESCRIPTION
Aeroflex’s MUX8530 is a radiation tolerant, 16 channel multiplexer MCM (Multi Chip Module) with
electrostatic discharge (ESD) protection on all channel inputs.
The MUX8530 has been specifically designed to meet exposure to radiation environments. It is available
in a 56 lead High Temperature Co-Fired Ceramic (HTCC) Quad Flatpack (CQFP). It is guaranteed
operational from -55°C to +125°C. Available screened in accordance with MIL-PRF-38534, the
MUX8530 is ideal for demanding military and space applications.
ORGANIZATION AND APPLICATION
The MUX8530 consists of one 16 channel multiplexer arranged as shown in the block diagram,
addressable by bus A0~A3 including enable which connects the addressed channel to a single output.
SCD8530 Rev A
CH 0
•
•
•
16
16
VR
MUX
CH 15
OUTPUT (0-15)
EN 0-15
A0
A1
A2
A3
+VEE
-VEE
VREF
GND
MUX8530: 16 CHANNEL ANALOG MUX BLOCK DIAGRAM
SCD8530 Rev A 4/20/09
2
Aeroflex Plainview
ABSOLUTE MAXIMUM RATINGS 1/
Parameter
Range
Units
Case Operating Temperature Range
-55 to +125
°C
Storage Temperature Range
-65 to +150
°C
+20
-20
+7.5
V
V
V
< VREF +.5
> GND -.5
V
V
±18V
V
Supply Voltage
+VEE (Pin 18)
-VEE (Pin 46)
VREF (Pin 39)
Digital Input Overvoltage
VEN (Pin 13), VA (Pins 14, 15, 16, 17)
Analog Input Over Voltage
VS
Notes:
1/ All measurements are made with respect to ground.
NOTICE: Stresses above those listed under "Absolute Maximums Rating" may cause permanent damage to the device. These are stress rating
only; functional operation beyond the "Operation Conditions" is not recommended and extended exposure beyond the "Operation Conditions" may
affect device reliability.
RECOMMENDED OPERATING CONDITIONS 1/
Symbol
Parameter
Typical
Units
+VEE
+15V Power Supply Voltage
+15.0
V
-VEE
-15V Power Supply Voltage
-15.0
V
VREF
Reference Voltage
+5.00
V
VAL
Logic Low Level
+0.8
V
VAH
Logic High Level
+4.0
V
1/ Power Supply turn-on sequence shall be as follows: -VEE, VREF, followed by +VEE.
DC ELECTRICAL PERFORMANCE CHARACTERISTICS 1/
(TC = -55°C TO +125°C, -VEE = -15V, VREF = +5.0V, +VEE = +15V -- UNLESS OTHERWISE SPECIFIED)
Parameter
Supply Current
Address Input Current
Enable Input Current
SCD8530 Rev A 4/20/09
Symbol
Conditions
Min
Max
Units
+IEE
VEN(0-15) = VA(0-3) = 0
0
0.5
mA
-IEE
VEN(0-15) = VA(0-3) = 0
-0.5
0
mA
+ISBY
VEN(0-15) = 4V, VA(0-3) = 0 7/
0
0.5
mA
-ISBY
VEN(0-15) = 4V, VA(0-3) = 0 7/
-0.5
0
mA
IAL(0-3)A
VA = 0V
-1
1
µA
IAH(0-3)A
VA = 5V
-1
1
µA
IENL(0-15)
VEN(0-15) = 0V
-1
1
µA
IENH(0-15)
VEN(0-15) = 5V
-1
1
µA
3
Aeroflex Plainview
DC ELECTRICAL PERFORMANCE CHARACTERISTICS 1/ (continued)
(TC = -55°C TO +125°C, -VEE = -15V, VREF = +5.0V, +VEE = +15V -- UNLESS OTHERWISE SPECIFIED)
Parameter
Symbol
Conditions
Min
Max
Units
Positive Input Leakage
Current CH0-CH15
+ISOFFOUTPUT(ALL)
VIN = +10V, VEN = 4V, output and all unused MUX inputs
under test = -10V 2/, 3/
-100
+1000
nA
Negative Input Leakage
Current CH0-CH15
-ISOFFOUTPUT(ALL)
VIN = -10V, VEN = 4V, output and all unused MUX inputs
under test = +10V 2/, 3/
-100
+1000
nA
Positive Output
Leakage Current
OUTPUTS (pin 12)
+IDOFFOUTPUT(ALL)
VOUT = +10V, VEN = 4V, output and all unused MUX
inputs under test = -10V 3/, 4/
-100
+100
nA
Negative Output
Leakage Current
OUTPUTS (pin 12)
-IDOFFOUTPUT(ALL)
VOUT = -10V, VEN = 4V, output and all unused MUX
inputs under test = +10V 3/, 4/
-100
+100
nA
+25°C
+125°C
-55°C
18.0
18.0
17.5
23.0
23.5
22.5
V
V
V
+25°C
+125°C
-55°C
-23.0
-23.5
-22.5
-18.0
-18.0
-17.5
V
V
V
Input Clamped Voltage
CH0 - CH15
+VCLMP
Input Clamped Voltage
CH0 - CH15
-VCLMP
Switch ON Resistance
OUTPUTS
(pin 12)
6/
VEN = 4V, all unused MUX inputs under test
are open. 3/
RDS(ON)(0-15)A
VIN = +15V, VEN = 0.8V, IOUT = -1mA 2/, 3/, 5/
200
1000
Ω
RDS(ON)(0-15)B
VIN = +5V, VEN = 0.8V, IOUT = -1mA 2/, 3/, 5/
200
1500
Ω
RDS(ON)(0-15)C
VIN = -5V, VEN = 0.8V, IOUT = +1mA 2/, 3/, 5/
200
2500
Ω
Notes:
1/ Measure inputs sequentially. Ground all unused inputs of the device under test. VA is the applied input voltage to the address lines A(0-3).
2/ VIN is the applied input voltage to the input channels CH0-CH15.
3/ VEN is the applied input voltage to the enable lines EN(0-15).
4/ VOUT is the applied input voltage to the output lines OUTPUT(0-15).
5/ Negative current is the current flowing out of each of the MUX pins. Positive current is the current flowing into each MUX pin.
6/ The MUX8530 cannot be operated with analog inputs from -15 to -5 volts.
7/ Not tested, guaranteed to the specified limits.
SWITCHING CHARACTERISTICS
(TC = -55°C TO +125°C, -VEE = -15V, VREF = +5.0V, +VEE = +15V -- UNLESS OTHERWISE SPECIFIED)
Parameter
Switching Test MUX
Symbol
tAHL
tALH
Conditions
RL = 10KΩ, CL = 50pF
tONEN
tOFFEN
SCD8530 Rev A 4/20/09
RL = 1KΩ, CL = 50pF
4
Min
Max
Units
10
1000
ns
10
1000
ns
10
1000
ns
10
1000
ns
Aeroflex Plainview
TRUTH TABLE (CH0 – CH15)
A3
A2
A1
A0
EN (0-15)
"ON" CHANNEL 1/
X
X
X
X
H
NONE
L
L
L
L
L
CH0
L
L
L
H
L
CH1
L
L
H
L
L
CH2
L
L
H
H
L
CH3
L
H
L
L
L
CH4
L
H
L
H
L
CH5
L
H
H
L
L
CH6
L
H
H
H
L
CH7
H
L
L
L
L
CH8
H
L
L
H
L
CH9
H
L
H
L
L
CH10
H
L
H
H
L
CH11
H
H
L
L
L
CH12
H
H
L
H
L
CH13
H
H
H
L
L
CH14
H
H
H
H
L
CH15
1/ Between CH0-15 and OUTPUT (0-15)
SCD8530 Rev A 4/20/09
5
Aeroflex Plainview
Address Lines
(A0 - A3)
4.0V
50%
0.8V
11.6V MIN
50%
MUX Output
0V
t AHL
Definition of t AHL
4.0V
Address Lines
(A0 - A3)
50%
0.8V
11.6V MIN
MUX Output
50%
0V
t ALH
Definition of t ALH
4.0V
EN Lines
50%
0.8V
~3V to 12.5V
MUX Output
50%
0V
tONEN
tOFFEN
Definition of tONEN and tOFFEN
NOTE: f = 10KHz, Duty cycle = 50%.
MUX8530 SWITCHING DIAGRAMS
SCD8530 Rev A 4/20/09
6
Aeroflex Plainview
PIN NUMBERS & FUNCTIONS
MUX8530 – 56 Leads Ceramic QUAD Flat Pack
Pin #
Function
Pin #
Function
1
CH0
29
NC
2
CH1
30
NC
3
CH2
31
NC
4
CH3
32
NC
5
CH4
33
NC
6
CH5
34
NC
7
GND
35
GND
8
GND
36
GND
9
CH6
37
NC
10
CH7
38
NC
11
CASE GND
39
VREF
12
OUTPUT (0-15)
40
NC
13
EN 0-15
41
NC
14
A0
42
NC
15
A1
43
NC
16
A2
44
NC
17
A3
45
NC
18
+VEE
46
-VEE
19
CH15
47
NC
20
CH14
48
NC
21
GND
49
GND
22
GND
50
GND
23
CH13
51
NC
24
CH12
52
NC
25
CH11
53
NC
26
CH10
54
NC
27
CH9
55
NC
28
CH8
56
NC
Notes:
1. It is recommended that all "NC" or "no connect pin", be grounded. This eliminates or minimizes any ESD or static buildup.
2. Package lid is internally connected to circuit ground (Pins 7, 8, 11, 21, 22, 35, 36, 49, 50).
SCD8530 Rev A 4/20/09
7
Aeroflex Plainview
ORDERING INFORMATION
Model
DSCC SMD #
Screening
MUX8530-S
-
Military Temperature, -55°C to +125°C
Screened in accordance with MIL-PRF-38534, Class K
MUX8530-7
-
Commercial Flow, +25°C testing only
5962-0923001KXC
(Pending)
In accordance with DSCC SMD
MUX8530-201-1S
PACKAGE OUTLINE
Package
QUAD Flat
Pack
0.650 ±.005
(13 Spaces at .050)
Tol Non-Cum
4 Sides
Pin 1
Pin 7
.200
MAX
Pin 50
Pin 49
Pin 8
.0165
±.003
0.800 SQ
±.010
Pin 21
(.650)
Pin 36
Pin 35
Pin 22
Note: Outside ceramic tie bars
not shown for clarity. Contact
factory for details.
.006
±.002
EXPORT CONTROL:
EXPORT WARNING:
This product is controlled for export under the International Traffic in
Arms Regulations (ITAR). A license from the U.S. Department of
State is required prior to the export of this product from the United
States.
Aeroflex’s military and space products are controlled for export under
the International Traffic in Arms Regulations (ITAR) and may not be
sold or proposed or offered for sale to certain countries. (See ITAR
126.1 for complete information.)
PLAINVIEW, NEW YORK
Toll Free: 800-THE-1553
Fax: 516-694-6715
INTERNATIONAL
Tel: 805-778-9229
Fax: 805-778-1980
NORTHEAST
Tel: 603-888-3975
Fax: 603-888-4585
SE AND MID-ATLANTIC
Tel: 321-951-4164
Fax: 321-951-4254
WEST COAST
Tel: 949-362-2260
Fax: 949-362-2266
CENTRAL
Tel: 719-594-8017
Fax: 719-594-8468
www.aeroflex.com
[email protected]
Aeroflex Microelectronic Solutions reserves the right to
change at any time without notice the specifications, design,
function, or form of its products described herein. All
parameters must be validated for each customer's application
by engineering. No liability is assumed as a result of use of
this product. No patent licenses are implied.
SCD8530 Rev A 4/20/09
Our passion for performance is defined by three
attributes represented by these three icons:
solution-minded, performance-driven and customer-focused
8
1
A Radiation Hardened High Voltage 16:1
Analog Multiplexer for Space Applications
(NGCP3580)
[Published in 2008 NSREC Radiation Effects Data Workshop Proceedings, pp 82-84]
Dennis A. Adams, Herbert A. Barnes, Michael D. Fitzpatrick, Norman P.
Goldstein, William L. Hand, William L. Jackson, Rocky Koga, Michael B.
Pennock, Henry J. Remenapp, Joseph T. Smith
Abstract – Many space systems require the multiplexing of high
voltage analog signals around the spacecraft to drive actuators
and motors for telemetry control. While considerable resources
have supported the radiation hardening of digital electronics,
very little has been focused on this critical high voltage analog
requirement. To address this issue, Northrop Grumman has
developed a radiation hardened high voltage (+/-15 V) 16:1
analog multiplexer for space applications which is described.
This device has completed qualification testing with initial
production deliveries beginning in January, 2008. Using a
combination of process (CMOS/ SOI) and design techniques,
this device features latch-up immune operation and 300 krad(Si)
total dose hardness. Life testing has been successfully completed
(1000 hours at +150 C). The NGCP3580 has been designed to
operate with Analog Inputs as high as 10 V outside of the +/-15
V supply voltage range. A low voltage (+/-5 V) version of this
device (NGCL3571) has been in production since 2001.
I.
KEY FEATURES FOR NGCP3580
• 30 V CMOS using SOI starting material
• Total Dose up to 300 krad (Si)
• Up to 40 V maximum operating voltage
+/-15 V)
(Nominal:
Manuscript received May 25, 2008.
D. A. Adams is with Northrop Grumman Corporation, Baltimore, MD
21203 USA (e-mail: [email protected]).
H. A. Barnes is with Northrop Grumman Corporation, Baltimore, MD
21203 USA.
M. D. Fitzpatrick is with Northrop Grumman Corporation, Baltimore, MD
21203 USA.
N. P. Goldstein is with Northrop Grumman Corporation, Baltimore, MD
21203 USA.
W. L. Hand is with Northrop Grumman Corporation, Baltimore, MD
21203 USA.
W. L. Jackson is with Northrop Grumman Corporation, Baltimore, MD
21203.
R. Koga is with the Aerospace Corporation, Los Angeles, CA 90009
USA.
M. B. Pennock is with Northrop Grumman Corporation, Baltimore, MD
21203.
H. J. Remenapp is with Northrop Grumman Corporation, Baltimore, MD
21203.
J. T. Smith is with Northrop Grumman Corporation, Baltimore, MD
21203.
Fig. 1. NGCP3580 HV 16:1 Analog MUX block diagram
• < 500 Ohm nominal PMOS ON switch impedance
• < 1500 Ohm worst case PMOS ON switch impedance
• Break-before-make switching
• < 500 ns access time over temperature and post rad
• > 100 MOhm OFF switch impedance
• High OFF state impedance maintained under powered
down conditions - ideal for redundant applications
•
•
•
•
Low power dissipation: <500 uA standby current
>1 kV electrostatic discharge protection (human body)
Available in 28 pin ceramic flatpacks, or bare die
SEL / SEU immune (by design)
II. HV 16:1 ANALOG MULTIPLEXER FUNCTIONAL
DESCRIPTION
The NGCP3580 has 16 Analog Inputs that are selected one
at a time by the state of four Address Pins and an Enable- Bar
pin (Fig. 1). Address and EnableBar inputs use 5V CMOS
logic levels that are internally level shifted to +/-15 V to
drive the high voltage Analog Input switches.
The EnableBar input serves as a Chip Select pin for use in
redundant applications.
Internal delays have been
implemented in the design to give a nominal break-beforemake delay of 50 nsec (25 nsec over temperature). This
2
feature prevents inadvertent damage at system level from
multiple Analog Inputs being turned on at the same time.
Functional operation is maintained with high OFF state
impedances for over-voltage stress conditions on the 16
Analog Input and Output pins as well as on the V+ supply
pin. Any of these pins may be taken up as high as +25 V.
(While this is not a recommended long term operating
condition for this device, devices have successfully passed 1
week burn in at +150 C with this over-voltage stress with no
adverse effects noted.) Since the Analog Input switches are
PMOS transistors, Analog Input ON resistance values are
only guaranteed for an Analog Input range of -5 V to +25 V.
(Below -5 V, the gate voltage applied to the PMOS switches
is insufficient to give acceptable switch ON resistance).
High Analog Input switch OFF impedance (>100 MOhm) is
maintained for Analog Input levels between -25 V and +25V
(with a maximum voltage difference of 40 V between the
Analog Inputs / OUT pins and the supply voltage pins).
III.
PROCESS DESCRIPTION
The HV Analog Multiplexer process utilizes low voltage
(LV = 15 V) and high voltage (HV = 40 V) CMOS
transistors. All CMOS transistors have a maximum gate
electric field of < 4 MV/cm under worst case allowable overvoltage stress conditions. Minimum CMOS drain breakdown
is 28 V for LV CMOS and 55 V for HV CMOS. Bonded SOI
wafer substrates are used which provide improved transistor
to transistor isolation. All PMOS and NMOS transistors
have been placed in separate N type tubs which eliminates
the possibility of latch-up in this device (as confirmed with
heavy ion testing). A high reliability interconnect system is
used (Titanium / Aluminum / Titanium-tungsten). This same
interconnect system is employed in all NGC EEPROM
products that have over 15 years of reliable flight heritage.
In addition, long term life testing has been performed for
over 300,000 device-hours on the EEPROM product with no
failures.
Fig. 2. NGCP3580 offers 2X improvement in Analog Input ON
resistance over Intersil 1840A HV MUX.
IV. ELECTRICAL PARAMETERS
The NGCP3580 has low power dissipation across the
military temperature range for space applications - <500 uA
power supply standby current, < 500 nA Analog Input
leakage and < 5 uA Output leakage. Worst case Analog
Input switch resistance is 1500 Ohms for Inputs at 0 or +5 V
and 800 Ohms for Inputs at +15 V. This represents a
resistance improvement greater than a factor of 2 over other
commercially available devices (Fig. 2). Worst case access
time is 500 nsec.
V. RADIATION HARDNESS
Total dose (Cobalt 60) and heavy ion (Berkeley cyclotron)
radiation testing has successfully been completed. Total
dose testing was performed at the University of Maryland
Cobalt 60 facility out to 450 krad(Si) (with a 1 week at +100
C rebound anneal) in accordance with MIL-STD-883Method 1019. All parts remained spec compliant with
negligible change at 300 krad, 450 krad and after rebound
anneal (Figs. 3, 4). Data in the rest of these figures are
shown in box plot format. The boxes represent the middle
50% of the data, with a line in the middle of the box to show
the median value for the population. The whiskers on the
boxes extend to the extreme value for the data or to no more
than 1.5 times the box height. Any values beyond this are
considered outliers.
Box plots provide an excellent
comparison of groups of data comparing both central values
and the degree of scatter.
Heavy ion testing was performed by the Aerospace
Corporation on the Berkeley cyclotron at +125 C to a
maximum LET of 90 MeV-cm**2/mg with no latch-up
induced (3 parts, 2E7 ions /cm**2, 30% overvoltage). A
combinatorial logic design approach is used for this part (ie –
no data latches). This makes this part immune to any single
event upset (SEU) related failures. (Single event transients
propagate through the part without being latched.)
Fig. 3. Minimal change in Analog Input switch resistance with 450 krad(Si)
total ionizing dose and rebound anneal.
3
VI.
PRODUCT QUALIFICATION (HI REL / CLASSK)
The NGCP3580 has successfully passed an extended 1000
hour life test in accordance with MIL-STD-883G Method
1005. This test was performed at elevated temperature (+150
C vs +125 C requirement) and for an additional 500 hours. A
sample of 45 parts showed no loss of functionality and
negligible changes in all parameters with this life test. Figs.
5, 6 and 7 show typical parametric results from this testing.
All production lots are subjected to destructive SEM analysis
according to MIL-STD-883 Method 2018 as well as
environmental tests, dynamic burn in and total ionizing dose
testing.
VII.
SUMMARY
A radiation hardened CMOS / SOI high voltage 16:1
Analog Multiplexer device has successfully completed
modified hi-rel qualification and is in production. Latch-up
immune operation and >300 krad total dose hardness has
been demonstrated. With the recent successful completion of
Class K element evaluation, the NGCP3580 high-voltage
analog 16:1 MUX is now available in both die and packaged
configurations for the most demanding flight applications.
This device provides a high performance, cost effective
solution for many critical space payload applications where
the multiplexing of high voltage analog signals is required.
Fig. 5. Negligible change in NGCP3580 supply currents across military
temperature range after 500 hours and 1000 hours at +150C (45 parts).
VIII. ACKNOWLEDGMENTS
We would like to acknowledge the independent funding
support provided by Northrop Grumman Corporation for this
project.
Fig. 6. Negligible change in NGCP3580 ON resistances across military
temperature range after 500 hours and 1000 hours at +150C (45 parts).
Fig. 4. Negligible change in standby supply current with 450 krad(Si)
total ionizing dose and rebound anneal.
Fig. 7. Negligible change in NGCP3580 switch leakage currents across
military temperature range after 500 hours and 1000 hours +150C (45 parts).
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
REV
SHEET
REV
SHEET
15
16
17
REV STATUS
REV
OF SHEETS
SHEET
PMIC N/A
PREPARED BY
Steve Duncan
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
1
2
3
4
5
8
9
10
11
12
13
http://www.dscc.dla.mil/
MICROCIRCUIT, HYBRID, LINEAR,
16 CHANNEL, ANALOG MULTIPLEXER
DRAWING APPROVAL DATE
10-02-23
REVISION LEVEL
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
7
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
CHECKED BY
Greg Cecil
APPROVED BY
Charles F. Saffle
6
1 OF
5962-09230
17
5962-E416-09
14
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\



RHA
designator
(see 1.2.1)
09230
01



Device
type
(see 1.2.2)
/
K



Device
class
designator
(see 1.2.3)
X



Case
outline
(see 1.2.4)
C



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
MUX8530
02
MUX8531
Circuit function
16 channel analog multiplexer, high impedance analog
input, single output with ESD protection
16 channel analog multiplexer, high impedance analog
input, kelvin measurement configuration with ESD protection
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
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1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
See figure 1
56
Ceramic quad flat pack
X
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Positive supply voltage between +VEE and GND .......................
Negative supply voltage between -VEE and GND.......................
VREF to GND...............................................................................
Digital input overvoltage range:
VEN (pin 13) device types 01and 02 ......................................
VA (pins 14, 15, 16, and 17)....................................................
Analog input overvoltage range .................................................
Power dissipation (PD), TC = -55°C to +125°C:
Device type 01 .......................................................................
Device type 02 .......................................................................
Thermal resistance junction-to-case (θJC) ..................................
Storage temperature ..................................................................
Lead temperature (soldering, 10 seconds) ................................
+20 V dc
-20 V dc
+7.5 V dc
(< VREF + .5)V, (> GND - .5)V
(< VREF + .5)V, (> GND - .5)V
-18 V dc ≤ VIN ≤ +18 V dc
20 mW
40 mW
10°C/W 2/
-65°C to +150°C
+300°C
1.4 Recommended operating conditions.
Positive supply voltage (+VEE) 3/ ...............................................
Negative supply voltage (-VEE) 3/...............................................
VREF 3/........................................................................................
Logic low level voltage (VAL) ......................................................
Logic high level voltage (VAH) ....................................................
Case operating temperature range (TC).....................................
+15 V dc
-15 V dc
+5 V dc
+0.8 V dc
+4.0 V dc
-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
1/
2/
3/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Based on the maximum power dissipation spread over the multiplexer die.
Supply voltages must be applied simultaneously or with -VEE and VREF supplies first, followed by the +VEE supply.
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DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Switching waveform(s). The switching waveform(s) shall be as specified on figure 4.
3.2.5 Block diagram. The block diagram shall be as specified on figure 5.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
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TABLE I. Electrical performance characteristics.
Test
Symbol
Supply currents
+IEE
-IEE
+ISBY
-ISBY
Address input
currents
IAL(0-3)A
IAH(0-3)A
Enable input
current
IENL(0-15)
IENH(0-15)
Group A
subgroups
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
VEN(0-15) = VA(0-3) = 0
1,2,3
VEN(0-15) = VA(0-3) = 0
1,2,3
VEN(0-15) = 4 V, VA(0-3) = 0 3/
1,2,3
VEN(0-15) = 4 V, VA(0-3) = 0 3/
1,2,3
VA = 0 V
1,2,3
VA = 5 V
1,2,3
VEN(0-15) = 0 V
1,2,3
VEN(0-15) = 5 V
1,2,3
Device
types
Limits
Unit
Min
Max
01
0
0.5
02
0
1
01
-0.5
0
02
-1
0
01
0
0.5
02
0
1
01
-0.5
0
02
-1
0
01
-1
1
02
-2
2
01
-1
1
02
-2
2
01
-1
1
02
-2
2
01
-1
1
02
-2
2
mA
mA
mA
mA
µA
µA
µA
µA
See footnotes at end of table.
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TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
types
Limits
Unit
Min
Max
Positive input
leakage current
(CH0-CH15)
+ISOFFOUTPUT(ALL)
VIN = +10 V, VEN = 4 V, output
and all unused inputs = -10 V
4/ 5/
1,2,3
All
-100
+1000
nA
Negative input
leakage current
(CH0-CH15)
-ISOFFOUTPUT(ALL)
VIN = -10 V, VEN = 4 V, output
and all unused inputs = +10 V
4/ 5/
1,2,3
All
-100
+1000
nA
Positive output
leakage current
outputs (pin 12)
for device 01
and (pins 12 and
45) for device
type 02
+IDOFFOUTPUT(ALL)
VOUT = +10 V, VEN = 4 V, output
and all unused inputs = -10 V
5/ 6/
1,2,3
All
-100
+100
nA
Negative output
leakage current
outputs (pin 12)
for device 01
and (pins 12 and
45) for device
type 02
-IDOFFOUTPUT(ALL)
VOUT = -10 V, VEN = 4 V, output
and all unused inputs = +10 V
5/ 6/
1,2,3
All
-100
+100
nA
Input clamped
voltage
(CH0-CH15)
+VCLMP
VEN = 4 V, all unused inputs are
open 5/
1
All
18.0
23.0
V
2
18.0
23.5
3
17.5
22.5
-23.0
-18.0
2
-23.5
-18.0
3
-22.5
-17.5
-VCLMP
1
VEN = 4 V, all unused inputs are
open 5/
All
V
See footnotes at end of table.
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TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Switch ON 8/
resistance outputs
(pin 12) for device
type 01 and (pins
12 and 45) for
device type 02
Switching tests
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
types
Limits
Unit
Min
Max
RDS(ON)(0-15)A
VIN = +15 V, VEN = 0.8 V,
IOUT = -1 mA 4/ 5/ 7/
1,2,3
All
200
1000
Ω
RDS(ON)(0-15)B
VIN = +5 V, VEN = 0.8 V,
IOUT = -1 mA 4/ 5/ 7/
1,2,3
All
200
1500
Ω
RDS(ON)(0-15)C
VIN = -5 V, VEN = 0.8 V,
IOUT = +1 mA 4/ 5/ 7/
1,2,3
All
200
2500
Ω
tAHL
RL = 10 kΩ, CL = 50 pF,
See figure 4
9,10,11
All
10
1000
ns
tALH
RL = 10 kΩ, CL = 50 pF,
See figure 4
9,10,11
All
10
1000
ns
tONEN
RL = 1 kΩ, CL = 50 pF,
See figure 4
9,10,11
All
10
1000
ns
tOFFEN
RL = 1 kΩ, CL = 50 pF,
See figure 4
9,10,11
All
10
1000
ns
1/ +VEE = +15 V dc, -VEE = -15 V dc, and VREF = +5 V dc, unless otherwise specified.
2/ Measure inputs sequentially. Ground all unused inputs.
3/ If not tested, shall be guaranteed to the limits specified in table I.
4/ VIN is the applied input voltage to the input channels (CH0-CH15).
5/ VEN is the applied input voltage to the enable lines
-
.
6/ VOUT is the applied input voltage to the output lines OUTPUT(0-15) for device types 01 and 02 and CURRENT(0-15) for
device type 02.
7/ Negative current is the current flowing out of each of the pins. Positive current is the current flowing into each of the
pins.
8/ The device types 01 and 02 cannot be operated with analog inputs from -15 V to -5 V.
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Case outline X.
FIGURE 1. Case outline(s).
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Case outline X - Continued.
FIGURE 1. Case outline(s) - Continued.
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Case outline X - Continued.
Inches
Symbol
Min
Millimeters
Max
A
Min
Max
.190
A1
.139
4.83
.170
3.53
4.32
A2
.005
.011
0.13
0.28
b
.0135
.0195
0.34
0.50
c
.005
.008
0.13
0.20
D/E
.790
.810
20.07
20.57
D1
.645
.655
16.38
16.64
e
.050 BSC
1.27 BSC
F
.200 TYP
5.08 TYP
J
.035 TYP
0.89 TYP
L
2.490
2.510
L1
63.25
63.75
2.580
65.53
L2
1.700
1.740
43.18
44.20
L3
2.090
2.110
53.09
53.59
L4
.650 TYP
16.51 TYP
N
56
56
S1
.030 TYP
0.76 TYP
S2
.015 TYP
0.38 TYP
NOTES:
1. Pin 1 is indicated by an ESD triangle on top of the package and by an index on the bottom of the package.
2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
3. N equals 56, the total number of leads on the package.
4. Pin numbers are for reference only.
FIGURE 1. Case outline(s) - Continued.
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Device types
01 and 02
Case outline
Terminal
number
Terminal symbol
X
Terminal
number
Terminal symbol
1
CH0
29
NC
2
CH1
30
NC
3
CH2
31
NC
4
CH3
32
NC
5
CH4
33
NC
6
CH5
34
NC
7
GND
35
GND
8
GND
36
GND
9
CH6
37
NC
10
CH7
38
NC
11
CASE GND
39
VREF
12
OUTPUT(0-15)
40
NC
13
EN (0 − 15)
41
NC
14
A0
42
NC
15
A1
43
NC
16
A2
44
NC
17
A3
45
See Note 1
18
+VEE
46
-VEE
19
CH15
47
NC
20
CH14
48
NC
21
GND
49
GND
22
GND
50
GND
23
CH13
51
NC
24
CH12
52
NC
25
CH11
53
NC
26
CH10
54
NC
27
CH9
55
NC
28
CH8
56
NC
NOTE:
1. No connect for device type 01 and CURRENT(0-15) for device type 02.
2. NC is a no connect pin. NC pins should be grounded to eliminate or minimize electrostatic
discharge (ESD) or static buildup.
3. Package lid is internally connected to circuit ground (Pins 7, 8, 11, 21, 22, 35, 36, 49, and 50).
FIGURE 2. Terminal connections.
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Truth table (CH0-CH15)
A3
A2
A1
A0
EN (0-15)
"ON" Channel 1/
X
X
X
X
H
None
L
L
L
L
L
L
L
H
L
L
CH0
CH1
L
L
L
L
H
H
L
H
L
L
CH2
CH3
L
L
H
H
L
L
L
H
L
L
CH4
CH5
L
L
H
H
H
H
L
H
L
L
CH6
CH7
H
H
L
L
L
L
L
H
L
L
CH8
CH9
H
H
L
L
H
H
L
H
L
L
CH10
CH11
H
H
H
H
L
L
L
H
L
L
CH12
CH13
H
H
H
H
H
H
L
H
L
L
CH14
CH15
1/ Between (CH0-CH15) and OUTPUT(0-15) for device type 01, and between (CH0-CH15) and
OUTPUT(0-15) and CURRENT(0-15) for device type 02.
FIGURE 3. Truth table.
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NOTE: f = 10 kHz, duty cycle = 50%.
FIGURE 4. Switching test waveform(s).
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FIGURE 5. Block Diagram.
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FIGURE 5. Block diagram - Continued.
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TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
1, 9
Final electrical parameters
1*, 2, 3, 9, 10, 11
Group A test requirements
1, 2, 3, 9, 10, 11
Group C end-point electrical
parameters
1, 2, 3, 9, 10, 11
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
Not applicable
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in test method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, 7, and 8 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
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4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in test method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)
692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
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STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 10-02-23
Approved sources of supply for SMD 5962-09230 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded
by the next dated revisions of MIL-HDBK-103 and QML-38534. DSCC maintains an online database of all current
sources of supply at http://www.dscc.dla.mil/Programs/Smcr/.
1/
2/
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-0923001KXC
88379
MUX8530-201-1S
5962-0923002KXC
88379
MUX8531-201-1S
The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
88379
Vendor name
and address
Aeroflex Plainview Incorporated,
(Aeroflex Microelectronics Solutions)
35 South Service Road
Plainview, NY 11803-4193
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.