AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL PRODUCT INFORMATION NOTICE 1. TITLE 2. DOCUMENT NUMBER MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 4MEG X 39BIT(160M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE SPO-2013-PIN-0002 3. DATE (Year, Month, Date) 2013, JAN, 22 4. MANUFACTURER NAME AND ADDRESS 5. MANUFACTURER POINT OF CONTACT NAME AEROFLEX COLORADO SPRINGS, INC. MIKE LESLIE 4350 CENTENNIAL BOULEVARD COLORADO SPRINGS, COLORADO 80907-3486 6. MANUFACTURER POINT OF CONTACT TELEPHONE (719) 594-8148 7. MANUFACTURER POINT OF CONTACT EMAIL [email protected] 8. CAGE CODE 9. BLANK 10. PRODUCT IDENTIFICATION CODE 11. BASE PART 65342 QS15 UT8R4M39 12. BLANK 13. SMD NUMBER 14. DEVICE TYPE DESIGNATOR 10207 01, 02 15. RHA LEVELS 16. QML LEVEL R ALL 17. NON QML LEVEL 18. BLANK HiRel 19. DESCRIPTION (FOR NEW PRODUCTS, PROVIDE AVAILABILITY DATE AND LEAD TIME) This notification serves to inform our customers of the reduced dynamic ambient burn-in temperature (TA) used in the manufacturing process (reference MIL-STD-883 method 1015 test condition D) for the Aeroflex Colorado Springs SMD products listed above. The combined effects of thermal impedance from die junction to the burn-in ambient environment (Theta-JA) and the aggregate thermal power dissipation of the eight (8) dice contained in each module, require Aeroflex to use a 115°C ambient burn-in temperature to keep the die junctions below their rated absolute maximum temperature of 150°C. Although Aeroflex applies burn-in TA at 115⁰C, the burn-in temperature exceeds the device’s rated operating case temperature (TC) of 105°C, ensuring significant stress margin compared to the use condition. Furthermore, Aeroflex applies the MIL-STD-883, Method 1015 regression table to determine the appropriate burn-in duration for TA = 115°C. The final result is a burn-in stress condition that is well above the use conditions and a stress that is applied to each Device Under Test (DUT) for a significantly longer duration than military temperature rated devices burned-in at TA = 125°C will receive. Also note that section 4.2.1 Additional criteria for device classes Q and V in the Standard Microcircuit Drawing 5962-10207 indicates the 115⁰C ambient burn-in temperature. NOTE: THIS DOCUMENT IS PUBLISHED FOR INFORMATION PURPOSES AND MAY PROVIDE FORWARD LOOKING STATEMENTS THAT ARE SUBJECT TO CHANGE. THE USERS SHOULD CONTACT THEIR LOCAL AEROFLEX SALES OFFICE FOR ANY ACTIONABLE CONTENT DESCRIBED HEREIN. 20. ADEPT REPRESENTATIVE Timothy L. Meade ADEPT PIN FORM 21. SIGNATURE 22. DATE 23 January 2013