AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL PROBLEM ADVISORY 1. TITLE 2. DOCUMENT NUMBER MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16-MEG X 48-BIT X 4-BANK (3-GIG), RADIATION HARDENED, SYNCHRONOUS DRAM (SDRAM), MULTICHIP MODULE – IBIS MODEL INACCURACY SPO-2014-PA-0002 4. MANUFACTURER NAME AND ADDRESS 5. MANUFACTURER POINT OF CONTACT NAME AEROFLEX COLORADO SPRINGS, INC. MICHELLE MUNDIE 4350 CENTENNIAL BOULEVARD COLORADO SPRINGS, COLORADO 80907-3486 6. MANUFACTURER POINT OF CONTACT TELEPHONE 3. DATE (Year, Month, Date) 2014, February, 28 (719) 594-8000 7. MANUFACTURER POINT OF CONTACT EMAIL [email protected] 8. CAGE CODE 9. LDC START 10. LDC END 11. PRODUCT IDENTIFICATION CODE 12. BASE PART 65342 ALL ALL QS19 UT8SDMQ64M48 14. SMD NUMBER 15. DEVICE TYPE DESIGNATOR 5962-10230 ALL 16. RHA LEVELS 17. QML LEVEL ALL ALL 18. NON QML LEVEL 19. BLANK 13. BLANK ALL 20. PROBLEM DESCRIPTION / DISCUSSION / EFFECT AEROFLEX COLORADO SPRINGS HAS IDENTIFIED THAT THE IBIS MODELS POSTED ON THE AEROFLEX WEBSITE DO NOT ACCURATELY REFLECT THE SDRAM DEVICE CHARACTERISTICS. STANDARD IBIS MODEL GENERATION METHODOLOGY IS INSUFFICIENT DUE TO THE COMPLEXITY OF THE PACKAGE. STANDARD MICROCIRCUIT DRAWING 5962-10230 DEVICE TYPE 01,02 MANUFACTURER PART NUMBER UT8SDMQ64M48 21. ACTION TAKEN / PLANNED AEROFLEX HAS REMOVED THE IBIS MODEL FROM THE AEROFLEX WEBSITE. DEVELOPMENT OF A HIGHER FIDELITY MODEL IS IN PROCESS AND IS EXPECTED TO BE AVAILABLE BY 03-31-14. WHEN THE UPDATED MODEL IS AVAILABLE, IT WILL BE POSTED ON AEROFLEX’S WEBSITE THROUGH DOWNLOAD OR A LINK/INSTRUCTION ON HOW TO OBTAIN THE MODEL. 22. DISPOSITIONARY RECOMMENDATION: 23. ADEPT REPRESENTATIVE CHECK & ☐ USE AS IS 24. SIGNATURE CONTACT MANUFACTURER Timothy L. Meade ADEPT PA FORM ☐ REMOVE & REPLACE ☒ CORRECT & ☐ USE AS SPECIFIED 25. DATE 28 February, 2014 REVISON DATE: 8/15/2013 SHEET 1 REVISION: B