SPO-2014-PA-0002

AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL
PROBLEM ADVISORY
1. TITLE
2. DOCUMENT NUMBER
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16-MEG
X 48-BIT X 4-BANK (3-GIG), RADIATION HARDENED,
SYNCHRONOUS DRAM (SDRAM), MULTICHIP
MODULE – IBIS MODEL INACCURACY
SPO-2014-PA-0002
4. MANUFACTURER NAME AND ADDRESS
5. MANUFACTURER POINT OF CONTACT NAME
AEROFLEX COLORADO SPRINGS, INC.
MICHELLE MUNDIE
4350 CENTENNIAL BOULEVARD
COLORADO SPRINGS, COLORADO 80907-3486
6. MANUFACTURER POINT OF CONTACT TELEPHONE
3. DATE (Year, Month, Date)
2014, February, 28
(719) 594-8000
7. MANUFACTURER POINT OF CONTACT EMAIL
[email protected]
8. CAGE CODE
9. LDC START
10. LDC END
11. PRODUCT IDENTIFICATION CODE
12. BASE PART
65342
ALL
ALL
QS19
UT8SDMQ64M48
14. SMD NUMBER
15. DEVICE TYPE DESIGNATOR
5962-10230
ALL
16. RHA LEVELS
17. QML LEVEL
ALL
ALL
18. NON QML LEVEL
19. BLANK
13. BLANK
ALL
20. PROBLEM DESCRIPTION / DISCUSSION / EFFECT
AEROFLEX COLORADO SPRINGS HAS IDENTIFIED THAT THE IBIS MODELS POSTED ON THE
AEROFLEX WEBSITE DO NOT ACCURATELY REFLECT THE SDRAM DEVICE CHARACTERISTICS.
STANDARD IBIS MODEL GENERATION METHODOLOGY IS INSUFFICIENT DUE TO THE COMPLEXITY OF
THE PACKAGE.
STANDARD MICROCIRCUIT DRAWING
5962-10230
DEVICE TYPE
01,02
MANUFACTURER PART NUMBER
UT8SDMQ64M48
21. ACTION TAKEN / PLANNED
AEROFLEX HAS REMOVED THE IBIS MODEL FROM THE AEROFLEX WEBSITE. DEVELOPMENT OF A HIGHER
FIDELITY MODEL IS IN PROCESS AND IS EXPECTED TO BE AVAILABLE BY 03-31-14. WHEN THE UPDATED
MODEL IS AVAILABLE, IT WILL BE POSTED ON AEROFLEX’S WEBSITE THROUGH DOWNLOAD OR A
LINK/INSTRUCTION ON HOW TO OBTAIN THE MODEL.
22. DISPOSITIONARY RECOMMENDATION:
23. ADEPT REPRESENTATIVE
CHECK &
☐
USE AS IS
24. SIGNATURE
CONTACT
MANUFACTURER
Timothy L. Meade
ADEPT PA FORM
☐
REMOVE &
REPLACE
☒
CORRECT &
☐
USE AS SPECIFIED
25. DATE
28 February, 2014
REVISON DATE: 8/15/2013
SHEET 1
REVISION: B