STK551U3XXGEVB STK551U3xx Series Evaluation Board User'sManual Introduction http://onsemi.com By using this board, STK551U3xx series (SIP1A / 1shunt) can be evaluated. EVAL BOARD USER’S MANUAL Surface Back side Figure 1. Evaluation Board Photos Table 1. ONPN of Evaluation Board ONPN of HIC Id max STK551U362AGEVB STK551U362A−E 10 A STK551U362CGEVB STK551U362C−E 10 A STK551U392AGEVB STK551U392A−E 15 A © Semiconductor Components Industries, LLC, 2014 January, 2014 − Rev. 0 1 Publication Order Number: EVBUM2220/D STK551U3XXGEVB CIRCUIT DIAGRAM Evaluation Board TH RCIN ISD VDD VSS 0Ω 0.1 F + − ISO 220 F / 35 V + − 2.2 F 630 V 0.1 F × 3 Fault VS1, U LIN3 VS2, V LIN2 VB2 47 F / 50 V × 3 − LIN1 VS3, W + 16 17 18 19 20 21 22 23 24 25 26 27 28 29 HIN3 13 HIN2 9 10 HIN1 6 VB1 5 + − 2 + − 1 VB3 STK551U3xx series 10kΩ 10kΩ U VDD ISD W − Vext ISO V + VSS RCIN + − TH + − 470 F / 450 V × 2 FAULT LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 3.3kΩ × 6 100 pF × 6 Figure 2. Circuit Diagram http://onsemi.com 2 100Ω × 6 STK551U3XXGEVB PIN DESCRIPTION STK551U3xx series W V U VSS FAULT LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 VSS NC NC NC NC Vext VDD ISO ISD RCIN TH FAULT 100Ω 0Ω 10kΩ 10kΩ LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 − 100pF 3.3kΩ Vext VSS VDD ISO ISD RCIN TH NC Evaluation Board Red line frame: Connector Brown line frame: Pull-up resistor for Fault and TH Pull-down resistor for ISD For the connection to the control part Vext terminal is connected pull−up resistor for TH and Fault pins. Please impress arbitrary voltage to this terminal. ISD pull−down 0 TH pull−up 10 k Blue line frame: Test pins Fault pull−up 10 k For monitoring each control signal Purple line frame: Low pass filter and pulldown resistor for control terminal Green line frame: U, V, W terminal Please connect to the motor. Low pass filter is composed of resistor of 100 and capacitor of 100 pF. Orange line frame: +, - terminal Please connect to DC power supply. Figure 3. http://onsemi.com 3 + STK551U3XXGEVB OPERATION PROCEDURE STK551U3xx series W Motor V U VSS Logic TH NC FAULT LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 VSS NC NC NC NC Vext VDD ISO ISD RCIN TH FAULT 100Ω 0Ω 10kΩ 10kΩ LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 − 100pF 3.3kΩ DC 15V Vext VSS VDD ISO ISD RCIN + DC power supply Evaluation Board Figure 4. Step 4: By inputting signal to the logic part, HIC control is started. (Therefore, please set electric charge to the boot-strap capacitor of upper side to turn on lower side IGBT before running.) NOTE: When turning off the power supply part and the logic part, please carry out in the reverse order to above steps. Step 1: Please connect HIC, each power supply, logic parts, and the motor to the evaluation board, and confirm that each power supply is OFF at this time. Step 2: Please impress the power supply of DC 15 V. Step 3: Please perform a voltage setup according to specifications, and impress the power supply between the “+” and the “−” terminal. http://onsemi.com 4 STK551U3XXGEVB LAYOUT Length: 96 mm Side: 128 mm Thickness: 1.6 mm Rigid double−sided substrate (Material: FR−4) Both sides resist coating Copper foil thickness: 70 m Figure 5. Layout (Top View) − Surface Figure 6. Layout (Top View) − Back Side http://onsemi.com 5 STK551U3XXGEVB BILL OF MATERIALS Table 2. EVALUATION BOARD BILL OF MATERIALS Components Symbol SMD Manufacturer Part Number Specification Resistor R4 1 KOA RK73Z1JTTD 0 Chip (1608 size) ISD pull−down R5, R6 2 KOA RK73H1JTTD1002F 10 k / ±1% Chip (1608 size) TM pull−up, Fault pull−up R7−12 6 KOA RK73H1JTTD1000F 100 / ±1% Chip (1608 size) Low pass filter R13−18 6 KOA RK73H1JTTD3301F 3.3 k / ±1% Chip (1608 size) Signal input pin pull−down Capacitor DIP Supplement C1, C2 2 Nippon Chemi−Con EKMM451VSN471MA50S 470 F / 450 V Aluminum electrolytic capacitor Plus−Minus C3 1 PANASONIC ECQE6225JT 2.2 F / 630 V / ±5% Film capacitor Plus−Minus, Snubber C4−C6 3 Nippon Chemi−Con EKMG500ELL470MF11D 47 F / 50 V Aluminum electrolytic capacitor VB−VS MURATA MANUFACTURING GRM188B31H104K 0.1 F / ±10% Chip (1608 size) VB−VS, VDD−VSS Nippon Chemi−Con EKMG350ELL221MHB5D 220 F / 35 V Aluminum electrolytic capacitor VDD−VSS MURATA MANUFACTURING GRM1882C1H101J 100 pF / ±5% Chip (1608 size) Low pass filter C7−C10 4 C11 C12−17 1 6 Connector CN1 1 HIROSE ELECTRIC A2−20PA−2.54DSA 20 pin / 2.54 pitch Pin (small) VSS, Vext, VDD, ISO ISD, RCIN, TH, FAULT LIN3, LIN2, LIN1, HIN3 HIN2, HIN1, (VSS2, Minus) 14 (16) HIROSE ELECTRIC A2−20PA−2.54DSA 20 pin / 2.54 pitch Pin (large) U, V, W, +, − 5 (Sanyo stock) IC IC1 1 SANYO SEMICONDUCTOR Total By dividing the 20−pin connector into one by 1pin, please use them as small pins. (Quantity is a number in the state divided into each 1pin.) 25 STK551U3xxA−E 28 (30) SIP1A / 1shunt *Chip component size 1608: L = 1.6 mm, W = 0.8 mm http://onsemi.com 6 STK551U3XXGEVB Heat Sink Mounting First, please mount the HIC on the heat sink. Next, mount the HIC on the evaluation board. In the case of mounting the HIC on the evaluation board first, you can not mount the heat sink. Table 3. Item Recommended Condition Pitch 56.0 ± 0.1 mm (Please refer to Package Outline Diagram) Screw Diameter: M3 Bind machine screw, Truss machine screw, Pan machine screw Washer Plane washer This size is D = 7 mm, d = 3.2 mm and t = 0.5 mm (Figure 8) JIS B 1256 Heat Sink Material: copper or Aluminum Warpage (the surface that contacts H−IC): −50 to 100 m Screw holes must be countersunk. No contamination on the heat sink surface that contacts H−IC. Torque Final tightening: 0.6 to 0.9 Nm Temporary tightening: 20 to 30% of final tightening Grease Silicon grease Thickness: 100 to 200 m Uniformly apply silicon grease to whole back. (Figure 9) Figure 7. Mount HIC on a Heat Sink t D d Figure 8. Size of Washer Figure 9. About Uniformly Application Figure 10. Installation Example of the Heat Sink The heat sink of this example is assumed operation at 10 A. Heat sink thermal resistance: 2.0 deg./W http://onsemi.com 7 STK551U3XXGEVB ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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