STK554U3XXGEVB STK554U3xx Series Evaluation Board User'sManual http://onsemi.com Introduction EVAL BOARD USER’S MANUAL By using this board, STK554U3xx series (SIP1A / 3shunt) can be evaluated. Surface Back side Figure 1. Evaluation Board Photos Table 1. ONPN of Evaluation Board ONPN of HIC Id max STK554U362AGEVB STK554U362A−E 10 A STK554U392CGEVB STK554U392A−E 15 A STK554U3A2AGEVB STK554U3A2A−E 20 A © Semiconductor Components Industries, LLC, 2014 January, 2014 − Rev. 0 1 Publication Order Number: EVBUM2222/D STK554U3XXGEVB CIRCUIT DIAGRAM Evaluation Board 0.1 F × 3 VDD VSS 0.1 F 47 F / 50 V × 3 + − TH ITRIP + − 220 F / 35 V VS1, U LIN3 VB1 LIN2 VS2, V LIN1 VB2 HIN3 VB3 + 17 18 19 20 21 22 23 24 25 26 27 28 29 W− 16 HIN2 13 V− 10 HIN1 9 FLTEN 6 U− 5 + − 2 + − 1 VS3, W STK554U3xx series 10kΩ VSS Vext 10kΩ U VDD U− V V− W W− TH ITRIP − FLTEN 470 F / 450 V × 2 + − + − 1kΩ + 2.2 F/ 630 V Shunt resistor LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 3.3kΩ × 6 100 pF × 6 Figure 2. Circuit Diagram http://onsemi.com 2 100Ω × 6 STK554U3XXGEVB PIN DESCRIPTION STK554U3xx series W V VSS Vext U− VDD 1kΩ V− 10kΩ W− 10kΩ TH ITRIP FLTEN LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 − 100Ω 100pF 3.3kΩ Vext VSS VDD U− V− W− TH ITRIP FLTEN LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 VSS NC NC NC NC U + Evaluation Board Red line frame: Connector Brown line frame: Pull-up resistor for FLTEN and TH Pull-down resistor for ITRIP For the connection to the control part Vext terminal is connected pull−up resistor for TH and Fault pins. Please impress arbitrary voltage to this terminal. ITRIP pull−down 1 k TH pull−up 10 k FLTEN pull−up 10 k Blue line frame: Test pins For monitoring each control signal Purple line frame: Low pass filter and pulldown resistor for control terminal Green line frame: U, V, W terminal Please connect to the motor. Low pass filter is composed of resistor of 100 and capacitor of 100 pF. Orange line frame: +, - terminal Please connect to DC power supply. Figure 3. http://onsemi.com 3 STK554U3XXGEVB OPERATION PROCEDURE STK554U3xx series W Motor V U VSS Logic NC NC NC NC Vext U− VDD 1kΩ V− 10kΩ W− 10kΩ TH ITRIP FLTEN LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 − 100Ω 100pF 3.3kΩ DC 15V Vext VSS VDD U− V− W− TH ITRIP FLTEN LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 VSS + DC power supply Evaluation Board Figure 4. Step 4: By inputting signal to the logic part, HIC control is started. (Therefore, please set electric charge to the boot-strap capacitor of upper side to turn on lower side IGBT before running.) NOTE: When turning off the power supply part and the logic part, please carry out in the reverse order to above steps. Step 1: Please connect HIC, each power supply, logic parts, and the motor to the evaluation board, and confirm that each power supply is OFF at this time. Step 2: Please impress the power supply of DC 15 V. Step 3: Please perform a voltage setup according to specifications, and impress the power supply between the “+” and the “−” terminal. http://onsemi.com 4 STK554U3XXGEVB LAYOUT Length: 96 mm Side: 128 mm Thickness: 1.6 mm Rigid double−sided substrate (Material: FR−4) Both sides resist coating Copper foil thickness: 70 m Figure 5. Layout (Top View) − Surface Figure 6. Layout (Top View) − Back Side http://onsemi.com 5 STK554U3XXGEVB BILL OF MATERIALS Table 2. EVALUATION BOARD BILL OF MATERIALS Components Symbol Resistor R1−3 Capacitor SMD DIP Manufacturer Part Number Specification 3 FUKUSHIMA FUTABA ELECTRIC MPC75 0.05 J 50 m/ 5W /±5% MPC75 0.02 J Supplement 20 m/ 5W /±5% Metal plate resistor Shunt 10A:50m, 15A/20A:20m R4 1 KOA RK73H1JTTD1001F 1 k / ±1% Chip (1608 size) ITRIP pull−down R5, R6 2 KOA RK73H1JTTD1002F 10 k / ±1% Chip (1608 size) TM pull−up, FLTEN pull−up R7−12 6 KOA RK73H1JTTD1000F 100 / ±1% Chip (1608 size) Low pass filter R13−18 6 KOA RK73H1JTTD3301F 3.3 k / ±1% Chip (1608 size) Signal input pin pull−down C1, C2 2 Nippon Chemi−Con EKMM451VSN471MA50S 470 F / 450 V Aluminum electrolytic capacitor Plus−Minus C3 1 PANASONIC ECQE6225JT 2.2 F / 630 V / ±5% Film capacitor Plus−Minus, Snubber C4−C6 3 Nippon Chemi−Con EKMG500ELL470MF11D 47 F / 50 V Aluminum electrolytic capacitor VB−VS MURATA MANUFACTURING GRM188B31H104K 0.1 F / ±10% Chip (1608 size) VB−VS, VDD−VSS Nippon Chemi−Con EKMG350ELL221MHB5D 220 F / 35 V Aluminum electrolytic capacitor VDD−VSS MURATA MANUFACTURING GRM1882C1H101J 100 pF / ±5% Chip (1608 size) Low pass filter C7−C10 4 C11 C12−17 1 6 Connector CN1 1 HIROSE ELECTRIC A2−20PA−2.54DSA 20 pin / 2.54 pitch Pin (small) VSS, Vext, VDD, U−, V−, W−, TH, ITRIP, FLTEN, LIN3, LIN2, LIN1, HIN3, HIN2, HIN1, (VSS2, Minus) 15 (17) HIROSE ELECTRIC A2−20PA−2.54DSA 20 pin / 2.54 pitch Pin (large) U, V, W, +, − 5 (Sanyo stock) IC IC1 1 SANYO SEMICONDUCTOR Total By dividing the 20−pin connector into one by 1pin, please use them as small pins. (Quantity is a number in the state divided into each 1pin.) 25 STK554U3xxA−E 32 (34) SIP1A / 3shunt *Chip component size 1608: L = 1.6 mm, W = 0.8 mm http://onsemi.com 6 STK554U3XXGEVB Heat Sink Mounting First, please mount the HIC on the heat sink. Next, mount the HIC on the evaluation board. In the case of mounting the HIC on the evaluation board first, you can not mount the heat sink. Table 3. Item Recommended Condition Pitch 56.0 ± 0.1 mm (Please refer to Package Outline Diagram) Screw Diameter: M3 Bind machine screw, Truss machine screw, Pan machine screw Washer Plane washer This size is D = 7 mm, d = 3.2 mm and t = 0.5 mm (Figure 8) JIS B 1256 Heat Sink Material: copper or Aluminum Warpage (the surface that contacts H−IC): −50 to 100 m Screw holes must be countersunk. No contamination on the heat sink surface that contacts H−IC. Torque Final tightening: 0.6 to 0.9 Nm Temporary tightening: 20 to 30% of final tightening Grease Silicon grease Thickness: 100 to 200 m Uniformly apply silicon grease to whole back. (Figure 9) Figure 7. Mount HIC on a Heat Sink t D d Figure 8. Size of Washer Figure 9. About Uniformly Application Figure 10. Installation Example of the Heat Sink The heat sink of this example is assumed operation at 10 A. Heat sink thermal resistance: 2.0 deg./W http://onsemi.com 7 STK554U3XXGEVB ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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