DATA SHEET SA.31m, SA.33m, & SA.35m Quantum Miniature Atomic Clock (MAC) Miniature Rubidium Atomic Clock Features • Highest precision atomic clock • Smallest form factor (smaller than most OCXOs) • Standard quartz oscillator pinouts • Low power consumption • RoHs 6/6 compliant Applications • Stand-alone (free-run) stable frequency source (for UMTS or LTE) • Extended holdover for CDMA and WiMAX base stations • Stability for various other communication and transmission applications Microsemi invented portable atomic timekeeping with QUANTUMTM, the world’s first family of miniature and chip scale atomic clocks. Choose QUANTUMTM class for best-in-class stability, size, weight and power consumption. Newly Enhanced QuantumTM MAC SA.3X Family The Microsemi® SA.3Xm marks a major step forward in the evolution of rubidium atomic clocks. Based on a new generation of atomic clock technology, the SA.3Xm family has a unique physics package that enables unprecedented miniaturization in a rubidium clock. It is suitable for applications requiring compact design, low power consumption, extended aging and precision in an economical and easily adaptable package. Smallest Commercially Available Rubidium Clock Microsemi has leveraged significant advances in physics miniaturization and integration to design the world's first commercially available miniature atomic clock. The SA.3Xm has the physical dimensions and packaging of a small ovenized crystal oscillator (OCXO), measuring 51 mm X 51 mm (2”X 2”) and standing at a mere 18 mm (0.7”). The MAC is the world’s first commercially available Rubidium Coherent Population Trapping atomic clock. It consumes less power and has wide-spectrum temperature operation. This makes it useful for to a range of timing and synchronization applications, from wireless base station, wire line network infrastructure, defense system, and to test and measurement devices. The SA.3Xm smaller dimensions enable it to be easily PCBA mountable. SA.31m The SA.31m is targeted for applications where an economical solution for frequency stability is required, such as UMTS (WCDMA) or LTE. It can be used as an independent frequency source for base stations, and enable transition from costly TDM Backhaul transport to economic and efficient Ethernet transport. SA.33m The SA.33m has superior aging and tempco, and better stability and phase noise than the SA.31m. The SA.33m may be deployed in existing rubidium applications, such as extended holdover (for CDMA / CDMA 2000 or WiMAX). SA.35m The SA.35m is the premium grade of the entire SA.3Xm family. It has better aging, the best tempco, and greatest performance amongst all the versions of the family. The SA.35m is ideally suited for applications such as extended hold over for LTE-TDD base stations and other applications where precision frequency and long hold-over are required. Economical for its performance level, the SA.35m delivers premium performance at an excellent price. Page 1 of 3 DATA SHEET SA.31m, SA.33m & SA.35m Specifications ELECTRICAL SPECIFICATIONS Output Frequency/Waveform: 10 MHz 3.3 volt ACMOS square wave Logic Level: VL<0.5V, VH>2.7V (15pf load) Rise/Fail Time: <10 ns Duty Cycle: 50%+/-10% Phase Noise (SSB) SA.35m / SA.33m SA.31m 1Hz ≤-70 dBc/Hz ≤-65 dBc/Hz 10Hz ≤-87 dBc/Hz ≤-85 dBc/Hz 100Hz ≤-114 dBc/Hz ≤-112 dBc/Hz 1kHz ≤-130 dBc/Hz ≤-130 dBc/Hz 10kHz ≤-140 dBc/Hz ≤-140 dBc/Hz Spurious: Non-Harmonic: <-85 dBc Temperature Coeffient [peak to peak]: SA.35m SA.33m SA.31m (0 C° to 70° C) ≤7E-11 ≤1E-10 ≤7E-10 ≤1.5E-10 ≤1E-9 (-10° C to 75° C) ≤1E-10 Accuracy at shipment: <±5E-11 (25° C) Retrace: <±5E-11(on-offon: 24hr, 48hr, 12hr @25° C) Control range: With analog input: ±1E-8, 0-5v into 5k Ω With digital input: ±1E-6 (with resolution ±1E-12) Warm-up time: time to <1E-9 @25° C: <7.5 min (if mounted on the developer’s kit heat sink: ≤9 min) Supply voltage/current: +5 Vdc ±0.1 Vdc, Max. current <2.8 Amps Power consumption: Warm-up: 14W max (-10°C to +75°C); Operating: 8W @ -10°C, 5W @ 25°C, 5W @ 75°C baseplate Voltage coefficient: +5 Vdc ±0.1 Vdc: Magnitude (df/f) <2E-11 peak-to-peak Test / status: Built-in self-test (BITE) ACMOS: Service / fault-unlock Serial Port: Microsemi specific serial port protocol for status and control .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. .. ENVIRONMENTAL Aging: Type SA.35m / SA.33m SA.31m Daily* ±2.5E-11 ±4E-11 Monthly* ±1E-10 ±3E-10 Yearly ±1E-9 ±1.5E-9 (*After 1 day & 1 month of operation respectively) Short Term Stability (Allan deviation): Type SA.35m / SA.33m SA.31m .. .. .. .. t=100s ≤8E-12 ≤1E-11 .. .. 7200 MDEV: SA.35m ≤7E-13 .. (not specified for SA.31m and SA.33m) .. .. Time drift in a 24-hr period .. (SA.33m & SA.35m only): <7μs over 0°C to +60°C .. MTBF: .. .. Per MIL-HDBK-217F: .. ≥20 years @ 40°C (Ground, fixed, uncontrolled, GF) .. ≥17 years @ 40°C (Ground, fixed, controlled, GB) .. .. Per Telcordia SSR 332, Issue 1: .. ≥20 years @ 40°C (Ground, fixed, uncontrolled) .. Connector: 5 Pins match standard OCXO configurations .. .. Pin 1: Input frequency control .. Pin 2*: Baseplate (connect to GND externally) .. .. Pin 3: Output signal .. Pin 4*: Ground (signal & supply) .. Pin 5: Input supply (+) .. . * Pin 2 & Pin 4 are not connected internally t=1s ≤3E-11 ≤5E-11 t=10s ≤1.6E-11 ≤2.5E-11 Three (3) additional pins for added functionality: Pin 6: BITE Pin 7: RS232 transmit (Tx) Pin 8: RS232 receive (Rx) Operating temperature: -10° C to +75° C base-plate Magnetic field sensitivity: <±7E-11/Gauss (up to ±2 Gauss) Humidity: GR-63-CORE, Issue 4, April 2012, Section 4.1.2 Vibration (operating): 7.7 grms @ 1 hr/axis per MIL-STD-810, Fig 514.7E-1, Category 24 (General Minimum Integrity Exposure). No loss of lock. Shock (operating): 30g, 11 msec half-sine pulse per MIL-STD-202, Method 213, Test Condition J. Frequency perturbation ≤ 1 e-9 momentary. Storage & transport (non operating): Temperature: -55°C to +100°C Vibration (non-operating, unpackaged): 10.9 grms @ 1 hr/axis per MIL-STD-810, Fig 514.7E-1, Cat 24. Shock (non-operating, unpackaged): PHYSICAL 50g, 11 msec half-sine pulse per MIL-STD-202, Method 213, Test Condition A. Weight: <85 gm (<3 oz) Size: 18 mm (0.7”) H X 51 mm Volume: <46.5 cm3 (< 2.8 in3) RoHS COMPLIANCE • SA.31m, SA.33m, and SA.35m are 6/6 RoHS Compliant For PCB mounted application using screws: To avoid damage to the SA.3xm use (5) custom 2-56 screws with length of 0.140" for mounting to a .06" thick PCB. Screw kits are available upon request from Microsemi Measurement in millimeters: 00.00 Measurement in inches: [0.00] Page 2 of 3 DATA SHEET SA.31m, SA.33m & SA.35m Part Number Table Part Number Description 090-44310-21 SA.31M RUBIDIUM CLOCK, AT DISABLED 090-44310-22 SA.31M RUBIDIUM CLOCK, AT ENABLED 090-44330-21 SA.33M RUBIDIUM CLOCK, AT DISABLED 090-44330-22 SA.33M RUBIDIUM CLOCK, AT ENABLED 090-44330-23 SA.33M RUBIDIUM CLOCK (AT ENABLED) ROHS 6/6 (MEASURED TIME TO LOCK <7 MIN) 090-44330-24 SA.33M RUBIDIUM CLOCK (AT DISABLED) ROHS 6/6 (MEASURED TIME TO LOCK <7 MIN) 090-44350-21 SA.35M RUBIDIUM CLOCK, AT DISABLED 090-44350-22 SA.35M RUBIDIUM CLOCK, AT ENABLED 090-44300-00 SA.3Xm Developer's Kit Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-overEthernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 email: [email protected] www.microsemi.com ©2015 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. DS/SA.3X.m/032515 900-00378-000G