711AS

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN8 1.6x1.2, 0.4P
CASE 711AS
ISSUE D
SCALE 4:1
DATE 08 DEC 2015
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
A
B
8X
L1
DETAIL A
ÍÍÍ
ÍÍÍ
OPTIONAL
CONSTRUCTION
E
PIN ONE
IDENTIFIER
DIM
A
A1
b
D
D2
E
E2
e
L
L1
ÉÉ
ÉÉ
ÇÇ
EXPOSED Cu
TOP VIEW
MOLD CMPD
DETAIL B
0.10 C
OPTIONAL
CONSTRUCTION
A
DETAIL B
GENERIC
MARKING DIAGRAM*
A1
8X
MILLIMETERS
MIN
NOM
MAX
0.300 0.375 0.450
0.000 0.025 0.050
0.130 0.180 0.230
1.500 1.600 1.700
1.200 1.300 1.400
1.100 1.200 1.300
0.200 0.300 0.400
0.40 BSC
0.150 0.200 0.250
0.000 0.050 0.100
0.08 C
NOTE 3
C
SIDE VIEW
1
8X
L
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
D2
DETAIL A
8X
XXMG
G
SEATING
PLANE
4
E2
L1
8
5
e
e/2
8X
b
0.10 C A
RECOMMENDED
MOUNTING FOOTPRINT*
B
0.05 C
BOTTOM VIEW
1.44
PACKAGE
OUTLINE
8X
0.35
1.40
0.44
8X
0.26
1
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON87768E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
XDFN8, 1.6X1.2, 0.4P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON87768E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. MARIANO.
20 MAR 2013
A
REVISED TO SHOW PULL−BACK LEADS ONLY. CHANGED DIMENSION A MIN
TO 0.30MM. REQ. BY I. MARIANO.
03 SEP 2013
B
ADDED NOMINAL VALUES. REQ. BY I. MARIANO.
13 AUG 2015
C
CORRECTED DIMENSION L LABEL IN BOTTOM VIEW. REQ. BY J. SUPINA.
28 OCT 2015
D
MODIFIED DIMENSION L1 VALUES. REQ. BY J. SUPINA.
08 DEC 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2015
December, 2015 − Rev. D
Case Outline Number:
711AS