NCV8716 D

NCV8716
80 mA Ultra-Low Iq, Wide
Input Voltage Low Dropout
Regulator
The NCV8716 is 80 mA LDO Linear Voltage Regulator. It is a very
stable and accurate device with ultra−low ground current consumption
(4.7 mA over the full output load range) and a wide input voltage range
(up to 24 V). The regulator incorporates several protection features
such as Thermal Shutdown and Current Limiting.
Features
•
MARKING
DIAGRAMS
1
WDFN6
CASE 511BR
• Operating Input Voltage Range: 2.5 V to 24 V
• Fixed Voltage Options Available:
•
•
•
•
•
•
•
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1.5 V to 5.0 V
Ultra Low Quiescent Current: Max. 4.7 mA over Temperature
±2% Accuracy over Full Load, Line and Temperature Variations
PSRR: 60 dB at 100 kHz
Noise: 200 mVRMS from 200 Hz to 100 kHz
Thermal Shutdown and Current Limit Protection
Available in wDFN6, 2x2x0.8 mm Package
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable; Device Temperature Grade 1: −40°C to
+125°C Ambient Operating Temperature Range
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
XX M
XX = Specific Device Code
M = Date Code
PIN CONNECTIONS
1
2
3
6
EXP
5
4
WDFN6 2x2 mm
(Top View)
ORDERING INFORMATION
Typical Applications
See detailed ordering, marking and shipping information on
page 16 of this data sheet.
• Portable Equipment
• Communication Systems
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 4
1
Publication Order Number:
NCV8716/D
NCV8716
IN
UVLO
BANDGAP
REFERENCE
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
EEPROM
GND
Figure 2. Simplified Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
Pin
Name
Description
6
OUT
Regulated output voltage pin. A small 0.47 mF ceramic capacitor is needed from this pin to ground to assure stability.
2
N/C
No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
3, EXP
GND
Power supply ground. Exposed pad EXP must be tied with GND pin 3.
4
N/C
No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
5
N/C
No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
1
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Output Voltage
Output Short Circuit Duration
Symbol
Value
Unit
VIN
−0.3 to 24
V
VOUT
−0.3 to 6
V
tSC
Indefinite
s
TJ(MAX)
150
°C
TA
−40 to 125
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Maximum Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latch up Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, wDFN6, 2 mm x 2 mm
Thermal Resistance, Junction−to−Air
Symbol
Value
Unit
RqJA
120
°C/W
Table 4. RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Input Voltage
VIN
2.5
24
V
Junction Temperature
TJ
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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NCV8716
Table 5. ELECTRICAL CHARACTERISTICS Voltage version 1.5 V
−40°C ≤ TJ ≤ 125°C; VIN = 3.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 5)
Test Conditions
Symbol
Min
Operating Input Voltage
IOUT ≤ 10 mA
VIN
2.5
Output Voltage Accuracy
3.0 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
1.455
Line Regulation
3.0 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Parameter
10 mA < IOUT < 80 mA
Typ
3.0
Max
Unit
24
V
24
1.5
1.545
V
RegLINE
20
25
mV
IOUT = 0 mA to 80 mA
RegLOAD
20
25
mV
(Note 6)
IOUT
Dropout voltage (Note 3)
Maximum Output Current
Ground current
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 4)
Thermal Shutdown Hysteresis (Note 4)
0 < IOUT < 80 mA, VIN = 24 V
110
mA
3.4
56
dB
VOUT = 1.5 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
120
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
f = 100 kHz
−
25
5.8
mA
IGND
PSRR
VIN = 3.0 V, VOUT = 1.5 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
−
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Not Characterized at VIN = 3.0 V, VOUT = 1.5 V, IOUT = 80 mA
4. Guaranteed by design and characterization.
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. Respect SOA
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NCV8716
Table 6. ELECTRICAL CHARACTERISTICS Voltage version 1.8 V
−40°C ≤ TJ ≤ 125°C; VIN = 3.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 9)
Test Conditions
Symbol
Min
Operating Input Voltage
IOUT ≤ 10 mA
VIN
2.8
Output Voltage Accuracy
3.0 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
1.746
Line Regulation
3.0 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Parameter
10 mA < IOUT < 80 mA
Typ
3.0
Max
Unit
24
V
24
1.8
1.854
V
RegLINE
15
20
mV
IOUT = 0 mA to 80 mA
RegLOAD
15
20
mV
(Note 10)
IOUT
Dropout voltage (Note 7)
Maximum Output Current
Ground current
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 8)
Thermal Shutdown Hysteresis (Note 8)
0 < IOUT < 80 mA, VIN = 24 V
110
mA
3.4
60
dB
VOUT = 1.8 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
140
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
f = 100 kHz
−
25
5.8
mA
IGND
PSRR
VIN = 3.0 V, VOUT = 1.8 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
−
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Not Characterized at VIN = 3.0 V, VOUT = 1.8 V, IOUT = 80 mA
8. Guaranteed by design and characterization.
9. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
10. Respect SOA
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NCV8716
Table 7. ELECTRICAL CHARACTERISTICS Voltage version 2.5 V
−40°C ≤ TJ ≤ 125°C; VIN = 3.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 13)
Parameter
Operating Input Voltage
Test Conditions
Symbol
Min
IOUT = 80 mA
VIN
3.5
2.45
Typ
Max
Unit
24
V
Output Voltage Accuracy
3.5 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
2.5
2.55
V
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1mA
RegLINE
15
20
mV
Load Regulation
IOUT = 0 mA to 80 mA
RegLOAD
15
20
mV
VDO = VIN – (VOUT(NOM) – 125 mV)
IOUT = 80 mA
VDO
640
mV
(Note 14)
IOUT
0 < IOUT < 80 mA, VIN = 24 V
IGND
3.4
PSRR
60
dB
VN
160
mVrms
Dropout voltage (Note 11)
Maximum Output Current
Ground current
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 12)
Thermal Shutdown Hysteresis (Note 12)
VIN = 3.5 V, VOUT = 2.5 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
VOUT = 2.5 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
400
Temperature increasing from TJ = +25°C
TSD
Temperature falling from TSD
TSDH
110
mA
5.8
°C
155
−
25
mA
−
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Characterized when VOUT falls 125 mV below the regulated voltage and only for devices with VOUT = 2.5 V
12. Guaranteed by design and characterization.
13. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
14. Respect SOA
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NCV8716
Table 8. ELECTRICAL CHARACTERISTICS Voltage version 3.0 V
−40°C ≤ TJ ≤ 125°C; VIN = 4.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 17)
Parameter
Test Conditions
Symbol
Min
Operating Input Voltage
IOUT = 80 mA
VIN
4.0
Output Voltage Accuracy
4.3 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
2.94
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Dropout voltage (Note 15)
Maximum Output Current
Ground current
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 16)
Thermal Shutdown Hysteresis (Note 16)
Max
Unit
24
V
3.0
3.06
V
RegLINE
4
10
mV
IOUT = 0 mA to 80 mA
RegLOAD
10
30
mV
VDO = VIN – (VOUT(NOM) – 150 mV)
IOUT = 80 mA
VDO
580
mV
(Note 18)
IOUT
0 < IOUT < 80 mA, VIN = 24 V
IGND
3.4
PSRR
58
dB
VOUT = 4.3 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
190
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
VIN = 4.3 V, VOUT = 3.3 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
Typ
370
110
−
mA
25
5.8
−
mA
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15. Characterized when VOUT falls 150 mV below the regulated voltage and only for devices with VOUT = 3.0 V
16. Guaranteed by design and characterization.
17. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
18. Respect SOA
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NCV8716
Table 9. ELECTRICAL CHARACTERISTICS Voltage version 3.3 V
−40°C ≤ TJ ≤ 125°C; VIN = 4.3 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 21)
Parameter
Test Conditions
Symbol
Min
Operating Input Voltage
IOUT = 80 mA
VIN
4.3
Output Voltage Accuracy
4.3 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
3.234
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Dropout voltage (Note 19)
Maximum Output Current
Ground current
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 20)
Thermal Shutdown Hysteresis (Note 20)
Max
Unit
24
V
3.3
3.366
V
RegLINE
4
10
mV
IOUT = 0 mA to 80 mA
RegLOAD
10
30
mV
VDO = VIN – (VOUT(NOM) – 165 mV)
IOUT = 80 mA
VDO
560
mV
(Note 22)
IOUT
0 < IOUT < 80 mA, VIN = 24 V
IGND
3.4
PSRR
60
dB
VOUT = 4.3 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
200
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
VIN = 4.3 V, VOUT = 3.3 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
Typ
350
110
−
mA
25
5.8
−
mA
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
19. Characterized when VOUT falls 165 mV below the regulated voltage and only for devices with VOUT = 3.3 V
20. Guaranteed by design and characterization.
21. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
22. Respect SOA
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NCV8716
Table 10. ELECTRICAL CHARACTERISTICS Voltage version 5.0 V
−40°C ≤ TJ ≤ 125°C; VIN = 6.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 25)
Parameter
Test Conditions
Symbol
Min
Operating Input Voltage
IOUT = 80 mA
VIN
6.0
Output Voltage Accuracy
6.0 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
4.9
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Dropout voltage (Note 23)
Maximum Output Current
Ground current
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 24)
Thermal Shutdown Hysteresis (Note 24)
Max
Unit
24
V
5.0
5.1
V
RegLINE
4
10
mV
IOUT = 0 mA to 80 mA
RegLOAD
10
30
mV
VDO = VIN – (VOUT(NOM) – 250 mV)
IOUT = 80 mA
VDO
500
mV
(Note 26)
IOUT
0 < IOUT < 80 mA, VIN = 24 V
IGND
3.4
PSRR
54
dB
VOUT = 5.0 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
220
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
VIN = 6.0 V, VOUT = 5.0 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT =10 mF
f = 100 kHz
Typ
310
110
−
mA
25
5.8
−
mA
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
23. Characterized when VOUT falls 250 mV below the regulated voltage and only for devices with VOUT = 5.0 V
24. Guaranteed by design and characterization.
25. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
26. Respect SOA
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NCV8716
TYPICAL CHARACTERISTICS
1.514
2.514
IOUT = 1 mA
CIN = COUT = 1 mF
2.510
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
1.512
1.51
1.508
VIN = (5 V − 24 V)
VIN = 3.0 V
1.506
1.504
IOUT = 1 mA
CIN = COUT = 1 mF
VIN = 3.5 V
2.506
VIN = (5 V − 24 V)
2.502
2.498
2.494
1.502
2.490
−40 −20
1.5
−40
−20
0
20
40
60
80
100
120
60
80
100
120
Figure 3. NCV8716x15xxx Output Voltage vs.
Temperature
Figure 4. NCV8716x25xxx Output Voltage vs.
Temperature
OUTPUT VOLTAGE (V)
4.995
OUTPUT VOLTAGE (V)
3.304
VIN = (4.3 V − 24 V)
3.300
3.296
3.292
IOUT = 1 mA
CIN = COUT = 1 mF
3.288
−20
0
20
40
60
IOUT = 1 mA
CIN = COUT = 1 mF
VIN = (8 V − 24 V)
4.985
VIN = 6.0 V
4.975
4.965
4.955
80
100
4.945
−40 −20
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. NCV8716x33xxx Output Voltage vs.
Temperature
Figure 6. NCV8716x50xxx Output Voltage vs.
Temperature
1.510
2.52
20 V
15 V
1.508
20 V
10 V
5.0 V
2.51
OUTPUT VOLTAGE (V)
VIN = 3.0 V
OUTPUT VOLTAGE (V)
40
TEMPERATURE (°C)
5.005
1.506
1.504
24 V
1.502
TA = 25°C
CIN = COUT = 1 mF
1.500
20
TEMPERATURE (°C)
3.308
3.284
−40
0
VIN = 3.5 V
24 V
10 V
15 V
5.0 V
2.50
2.49
2.48
TA = 25°C
CIN = COUT = 1 mF
2.47
2.46
1.498
0
10
20
30
40
50
60
OUTPUT CURRENT (mA)
70
0
80
10
20
30
40
50
60
70
OUTPUT CURRENT (mA)
Figure 7. NCV8716x15xxx Output Voltage vs.
Output Current
Figure 8. NCV8716x25xxx Output Voltage vs.
Output Current
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80
NCV8716
3.304
5.000
3.300
4.995
3.296
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
TYPICAL CHARACTERISTICS
VIN = 4.3 V
5.0 V
3.292
3.288
10 V
TA = 25°C
CIN = COUT = 1 mF
3.284
15 V
20 V
VIN = 6.0 V
4.985
8.0 V
10 V
4.980
20 V
24 V
15 V
24 V
4.970
0
10
20
30
40
50
60
70
80
0
20
30
40
50
60
70
80
OUTPUT CURRENT (mA)
Figure 9. NCV8716x33xxx Output Voltage vs.
Output Current
Figure 10. NCV8716x50xxx Output Voltage vs.
Output Current
0.6
TA = 125°C
DROPOUT VOLTAGE (V)
CIN = COUT = 1 mF
0.5
10
OUTPUT CURRENT (mA)
0.6
DROPOUT VOLTAGE (V)
4.990
4.975
3.280
TA = 25°C
0.4
0.3
TA = −40°C
0.2
0.1
0
TA = 125°C
CIN = COUT = 1 mF
0.5
0.4
TA = 25°C
0.3
0.2
TA = −40°C
0.1
0
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
60
70
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 11. NCV8716x25xxx Dropout Voltage
vs. Output Current
Figure 12. NCV8716x33xxx Dropout Voltage
vs. Output Current
80
30
0.6
CIN = COUT = 1 mF
0.5
QUIESCENT CURRENT (mA)
DROPOUT VOLTAGE (V)
TA = 25°C
CIN = COUT = 1 mF
TA = 125°C
0.4
TA = 25°C
0.3
0.2
TA = −40°C
0.1
TA = 25°C
CIN = COUT = 1 mF
25
20
15
10
IOUT = 80 mA
5
IOUT = 0
0
0
10
20
30
40
50
60
70
0
80
0
5
10
15
20
OUTPUT CURRENT (mA)
INPUT VOLTAGE (V)
Figure 13. NCV8716x50xxx Dropout Voltage
vs. Output Current
Figure 14. NCV8716x15xxx Ground Current vs.
Input Voltage
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25
NCV8716
TYPICAL CHARACTERISTICS
40
TA = 25°C
CIN = COUT = 1 mF
25
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
30
20
15
10
IOUT = 80 mA
5
IOUT = 0
0
30
25
20
15
10
IOUT = 80 mA
5
IOUT = 0
0
0
5
10
15
20
25
0
5
10
15
20
25
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 15. NCV8716x25xxx Ground Current vs.
Input Voltage
Figure 16. NCV8716x50xxx Ground Current vs.
Input Voltage
5.5
30
TA = 25°C
CIN = COUT = 1 mF
25
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
TA = 25°C
CIN = COUT = 1 mF
35
20
15
10
IOUT = 80 mA
5
5.0
IOUT = 0
CIN = COUT = 1 mF
4.5
VIN = 24 V
4.0
VIN = 10 V
3.5
VIN = 3.0 V
3.0
IOUT = 0
0
0
5
10
15
20
2.5
−40
25
0
20
40
60
80
100
120
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 17. NCV8716x33xxx Ground Current vs.
Input Voltage
Figure 18. NCV8716x15xxx Quiescent Current
vs. Temperature
5.5
5.5
IOUT = 0
CIN = COUT = 1 mF
5.0
4.5
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
−20
VIN = 24 V
4.0
VIN = 10 V
3.5
VIN = 3.5 V
3.0
2.5
−40
−20
0
20
40
60
80
100
5.0
IOUT = 0
CIN = COUT = 1 mF
4.5
VIN = 24 V
4.0
VIN = 10 V
3.5
VIN = 4.3 V
3.0
2.5
−40 −20
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 19. NCV8716x25xxx Quiescent Current
vs. Temperature
Figure 20. NCV8716x33xxx Quiescent Current
vs. Temperature
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NCV8716
TYPICAL CHARACTERISTICS
100
IOUT = 0
CIN = COUT = 1 mF
5.0
VIN = 24 V
4.5
4.0
VIN = 10 V
3.5
VIN = 6.0 V
IOUT = 10 mA
60
40
IOUT = 80 mA
20
3.0
2.5
−40
0
−20
0
20
40
60
80
100
120
0.1
1.0
10.0
100.0
TEMPERATURE (°C)
FREQUENCY (kHz)
Figure 21. NVP716x50xxx Quiescent Current
vs. Temperature
Figure 22. NCV8716x15xxx PSRR vs.
Frequency
1000.0
100
100
VIN = 3.5 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
IOUT = 1 mA
60
40
60
IOUT = 1 mA
40
IOUT = 10 mA
IOUT = 80 mA
IOUT = 80 mA
20
VIN = 4.3 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
80
PSRR (dB)
80
PSRR (dB)
VIN = 3.0 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
IOUT = 1 mA
80
PSRR (dB)
QUIESCENT CURRENT (mA)
5.5
20
IOUT = 10 mA
0
0
0.1
1
10
100
1000
0.1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 23. NCV8716x25xxx PSRR vs.
Frequency
Figure 24. NCV8716x33xxx PSRR vs.
Frequency
1000
1.6
100
VIN = 6.0 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
1.2
60
IOUT = 1 mA
IOUT = 10 mA
40
1.0
0.8
0.6
0.4
IOUT = 80 mA
20
IOUT = 80 mA
TA = 25°C
VIN = 3.0 V
1.4
mV/sqrt (Hz)
80
PSRR (dB)
1
COUT = 4.7 mF
0.2
0
0.1
1
10
100
1000
COUT = 10 mF
0
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 25. NCV8716x50xxx PSRR vs.
Frequency
Figure 26. NCV8716x15xxx Output Spectral
Noise Density vs. Frequency
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12
NCV8716
TYPICAL CHARACTERISTICS
4.0
5.0
4.0
3.5
mV/sqrt (Hz)
mV/sqrt (Hz)
3.0
IOUT = 80 mA
TA = 25°C
VIN = 4.3 V
4.5
IOUT = 80 mA
TA = 25°C
VIN = 3.5 V
3.5
2.5
2.0
1.5
3.0
2.5
2.0
1.5
1.0
COUT = 4.7 mF
0.5
1.0
COUT = 10 mF
0
0.01
0.1
1
10
COUT = 4.7 mF
0.5
0
100
1000
COUT = 10 mF
0.01
0.1
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 27. NCV8716x25xxx Output Spectral
Noise Density vs. Frequency
Figure 28. NCV8716x33xxx Output Spectral
Noise Density vs. Frequency
8
IOUT = 80 mA
TA = 25°C
VIN = 6.0 V
7
6
mV/sqrt (Hz)
1000
5
4
3
2
COUT = 4.7 mF
1
COUT = 10 mF
0
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 29. NCV8716x50xxx Output Spectral
Noise Density vs. Frequency
Figure 30. Load Transient Response
Figure 31. Load Transient Response
Figure 32. Load Transient Response
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13
NCV8716
TYPICAL CHARACTERISTICS
Figure 33. Load Transient Response
Figure 34. Line Transient Response
Figure 35. Line Transient Response
Figure 36. Line Transient Response
Figure 37. Line Transient Response
Figure 38. Input Voltage Turn−On Response
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14
NCV8716
TYPICAL CHARACTERISTICS
Figure 40. Input Voltage Turn−On Response
Figure 39. Input Voltage Turn−On Response
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15
NCV8716
APPLICATIONS INFORMATION
Power Dissipation and Heat sinking
The NCV8716 is the member of new family of Wide Input
Voltage Range Low Dropout Regulators which delivers
Ultra Low Ground Current consumption, Good Noise and
Power Supply Rejection Ratio Performance.
The maximum power dissipation supported by the device
is dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCV8716 can handle is given by:
Input Decoupling (CIN)
It is recommended to connect at least 0.1 mF Ceramic X5R
or X7R capacitor between IN and GND pin of the device.
This capacitor will provide a low impedance path for any
unwanted AC signals or Noise superimposed onto constant
Input Voltage. The good input capacitor will limit the
influence of input trace inductances and source resistance
during sudden load current changes.
Higher capacitance and lower ESR Capacitors will
improve the overall line transient response.
P D(MAX) +
ƪTJ(MAX) * TAƫ
(eq. 1)
R qJA
The power dissipated by the NCV8716 for given
application conditions can be calculated from the following
equations:
P D [ V INǒI GND(I OUT)Ǔ ) I OUTǒV IN * V OUTǓ
(eq. 2)
or
Output Decoupling (COUT)
The NCV8716 does not require a minimum Equivalent
Series Resistance (ESR) for the output capacitor. The device
is designed to be stable with standard ceramics capacitors
with values of 0.47 mF or greater up to 10 mF. The X5R and
X7R types have the lowest capacitance variations over
temperature thus they are recommended.
V IN(MAX) [
P D(MAX) ) ǒV OUT
I OUTǓ
I OUT ) I GND
(eq. 3)
For reliable operation, junction temperature should be
limited to +125°C maximum.
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV8716, and
make traces as short as possible.
ORDERING INFORMATION
Voltage Option
Marking
Package
Shipping†
NCV8716MT15TBG
1.5 V
7C
wDFN6, 2x2 mm
(Pb−Free)
3000 / Tape & Reel
NCV8716MT18TBG
1.8 V
7D
wDFN6, 2x2 mm
(Pb−Free)
3000 / Tape & Reel
NCV8716MT25TBG
2.5 V
7E
wDFN6, 2x2 mm
(Pb−Free)
3000 / Tape & Reel
NCV8716MT30TBG
3.0 V
7F
wDFN6, 2x2 mm
(Pb−Free)
3000 / Tape & Reel
NCV8716MT33TBG
3.3 V
7G
wDFN6, 2x2 mm
(Pb−Free)
3000 / Tape & Reel
NCV8716MT50TBG
5.0 V
7H
wDFN6, 2x2 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
16
NCV8716
PACKAGE DIMENSIONS
WDFN6 2x2, 0.65P
CASE 511BR
ISSUE B
D
ÇÇ
ÉÉ
A
B
A1
0.10 C
0.10 C
MOLD CMPD
ALTERNATE B−2
DETAIL B
ALTERNATE
CONSTRUCTIONS
E
L
L
TOP VIEW
ALTERNATE A−1
ALTERNATE A−2
DETAIL A
A3
ALTERNATE
CONSTRUCTIONS
A
6X
0.05 C
A1
NOTE 4
C
SIDE VIEW
SEATING
PLANE
1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
2.00 BSC
1.50
1.70
2.00 BSC
0.90
1.10
0.65 BSC
0.40
0.20
--0.15
RECOMMENDED
MOUNTING FOOTPRINT*
D2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. FOR DEVICES CONTAINING WETTABLE FLANK
OPTION, DETAIL A ALTERNATE CONSTRUCTION
A-2 AND DETAIL B ALTERNATE CONSTRUCTION
B-2 ARE NOT APPLICABLE.
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
L1
DETAIL B
0.05 C
ÉÉ
ÇÇ
EXPOSED Cu
ALTERNATE B−1
ÍÍÍ
ÍÍÍ
ÍÍÍ
PIN ONE
REFERENCE
A3
1.72
L
3
6X
0.45
E2
1.12
6
4
6X
e
BOTTOM VIEW
2.30
b
0.10
M
C A
0.05
M
C
B
PACKAGE
OUTLINE
NOTE 3
6X
1
0.40
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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17
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For additional information, please contact your local
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NCV8716/D