MN101C61D, MN101C61G Type MN101C61D (under development) MN101C61G ROM (×× 8-bit) 64 K 128 K RAM (×× 8-bit) 3K Package 12 K TQFP080-P-1212D *Lead-free Minimum Instruction Execution Time 0.1 µs (at 2.5 V to 3.6 V, 20 MHz) 0.2 µs (at 2.1 V to 3.6 V, 10 MHz) 0.5 µs (at 1.8 V to 3.6 V, 4 MHz)* 125 µs (at 1.8 V to 3.6 V, 32 kHz)* Double speed: 0.1 µs (at 2.5 V to 3.6 V, 10 MHz) 0.2 µs (at 2.1 V to 3.6 V, 5 MHz) 0.5 µs (at 1.8 V to 3.6 V, 2 MHz)* 62.5 µs (at 1.8 V to 3.6 V, 32 kHz)* * The operation guarantee range for flash memory built-in type is 2.2V to 3.0 V or 2.7V to 3.6 V. Interrupts • RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • External 5 • Timer 0 • Timer 1 • Timer 2 • Timer 3 • Timer 4 • Timer 5 • Timer 6 • Time base • Serial 0 reception • Serial 0 transmission • Serial 1 reception • Serial 1 transmission • Serial 2 • Serial 3 • Automatic transfer finish • A/D conversion finish • Timer 7 (2 systems) • Key interrupts (8 lines) Timer Counter Timer counter 0 : 8-bit × 1 (square-wave/8-bit PWM output, event count, generation of remote control carrier, pulse width measurement) Clock source ····················· 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ················ coincidence with compare register 0 Standard: Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event) Clock source ····················· 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ················ coincidence with compare register 1 Timer counter 0, 1 can be cascade-connected. Timer counter 2 : 8-bit × 1 (square-wave/8-bit PWM output, event count, synchronous output event, pulse width measurement) Clock source ····················· 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ················ coincidence with compare register 2 Timer counter 3 : 8-bit × 1 (square-wave output, event count, generation of remote control carrier) Clock source ····················· 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ················ coincidence with compare register 3 Timer counter 2, 3 can be cascade-connected. Timer counter 4 : 8-bit × 1 (square-wave/8-bit PWM output, event count, pulse width measurement, serial 1 baud rate timer) Clock source ····················· 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; 1/1 of external clock input frequency Interrupt source ················ coincidence with compare register 4 Timer counter 5 : 8-bit × 1 (square-wave/8-bit PWM output, event count, pulse width measurement, serial 0 baud rate timer) Clock source ······················ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; 1/1 of external clock input frequency Interrupt source ·················· coincidence with compare register 5 MAD00009EEM MN101C61D, MN101C61G Timer Counter (Continue) Timer counter 6 : 8-bit freerun timer Clock source ····················· 1/1 of system clock frequency; 1/1, 1/4096, 1/8192 of OSC oscillation clock frequency; 1/1, 1/4096, 1/8192 of XI oscillation clock frequency Interrupt source ················ coincidence with compare register 6 Timer counter 7 : 16-bit × 1 (square-wave/16-bit PWM output, cycle / duty continuous variable, event count, synchronous output evevt, pulse width measurement, input capture) Clock source ····················· 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ················ coincidence with compare register 7 (2 lines) Time base timer (one-minute count setting) Clock source ····················· 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency Interrupt source ················ 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768 of clock source frequency Watchdog timer Interrupt source ················ 1/65536, 1/262144, 1/1048576 of system clock frequency DMA controller (automatic data transfer) Max. Transfer cycles ········ 255 Starting factor ··················· external request, various types of interrupt, software Transfer mode ··················· 1-byte transfer, word transfer, burst transfer Serial 0 : synchronous type / UART (full-duplex) × 1 Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 5; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency Serial Interface Serial 1 : synchronous type / UART (full-duplex) × 1 Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 4; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency Serial 2 : synchronous type × 1 Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency Serial 3 : synchronous type/single-master I 2C × 1 Clock source ····················· 1/2, 1/4 of system clock frequency; pulse output of timer counter 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency I/O Pins I/O 62 • Common use • Specified pull-up resistor available • Input/output selectable (bit unit) Input 6 • Common use • Specified pull-up resistor available A/D Inputs 10-Bit × 6-ch. (with S/H) Special Ports Buzzer output, remote control carrier signal output, high-current drive port See the next page for electrical characteristics, pin assignment and support tool. MAD00009EEM Electrical Characteristics Supply current Limit Parameter Symbol Condition Unit min Operating supply current typ max IDD1 fosc = 20 MHz, VDD = 3 V, (fs = fosc/2) 5 12 mA IDD2 fosc = 8.39 MHz, VDD = 3 V, (fs = fosc/2) 2 5 mA IDD3 fx = 32.768 kHz, VDD = 3 V, (fs = fx/2) 40 µA IDD4 fx = 32.768 kHz, VDD = 3 V, Ta = 25°C 8 µA IDD5 fx = 32.768 kHz, VDD = 3 V 30 µA IDD6 VDD = 3 V, Ta = 25°C 2 µA IDD7 VDD = 3 V 20 µA 4 Supply current at HALT Supply current at STOP Ta = −40°C to +85°C, VDD = 1.8 V to 3.6 V, VSS = 0 V Note) Ta = − 20°C to +70° C for a flash memory built-in version. Supply voltage range ans supply current ratings are also different from the values mentioned above. Refer to Chapter 18 “Flash EEPROM” for detailes P63/A3 P62/A2 P61/A1 P60/A0 P54/A17 P53/A16 P52/IRQ5/NCS P51/NRE P50/NWE P47/KEY7/A15 P46/KEY6/A14 P45/KEY5/A9 P44/KEY4/A8 P43/TCIO5/KEY3 P42/SBT0/KEY2 P41/RXD0/SBI0/KEY1 P40/TXD0/SBO0/KEY0 P37/TCIO4/NDKDMA P36/NSTDMA P35/NLDDMA 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 19 20 SBT1/P02 80 RXD1/SBI1/P01 P80/LED0,D0 18 79 17 P81/LED1,D1 MMOD 78 TXD1/SBO1/P00 P82/LED2,D2 16 77 XO P83/LED3,D3 15 76 14 P84/LED4,D4 XI 75 VSS P85/LED5,D5 13 74 OSC1 P86/LED6,D6 12 73 11 P87/LED7,D7 VDD 72 OSC2 P77/SDO7 10 71 VREF+ P76/SDO6 MN101C61D MN101C61G 9 70 8 P75/A13/SDO5 NC 69 OUTC P74/A12/SDO4 7 68 AN5/PA5 P73/A11/SDO3 6 67 5 P72/A10/SDO2 AN4/PA4 66 AN3/PA3 P71/SDO1 4 65 AN2/PA2 P70/SDO0 3 64 2 P67/A7 1 63 VREF- 62 P66/A6 AN1/PA1 61 P65/A5 AN0/PA0 P64/A4 60 Pin Assignment 40 NBT/P34 39 NBR/P33 38 SBT3/P32 37 SYSCLK/SBI3/P31 36 SBO3/P30 35 IRQ4/P24 34 IRQ3/P23 33 IRQ2/P22 32 ACZ/IRQ1/P21 31 IRQ0/P20 30 TCIO7/P14 29 TCIO3/P13 28 TCIO2/P12 27 TCIO1/P11 26 RMOUT/TCIO0/P10 25 NRST/P27 24 NDK/BUZZER/P06 23 SBT2/P05 22 SBI2/P04 21 SBO2/P03 TQFP080-P-1212D *Lead-free NC serves as the VPP pin in the MN101CF61G, and cannot be used as a user pin. MAD00009EEM MN101C61D, MN101C61G Support Tool In-circuit Emulator PX-ICE101C / D + PX-PRB101C61-TQFP080-P-1212-M Flash Memory Built-in Type Type MN101CF61G ROM (× 8-bit) 128 K RAM (× 8-bit) 12 K Minimum instruction execution time 0.1 µs (at 2.7 V to 3.6 V, 20 MHz) 0.2 µs (at 2.7 V to 3.6 V, 10 MHz) 0.5 µs (at 2.7 V to 3.6 V, 4 MHz) 125 µs (at 2.7 V to 3.6 V, 32 kHz) Package TQFP080-P-1212D *Lead-free Type MN101CF60G ROM (× 8-bit) 128 K RAM (× 8-bit) 12 K Minimum instruction execution time 0.1 µs (at 2.5 V to 3.0 V, 20 MHz) 0.2 µs (at 2.2 V to 3.0 V, 10 MHz) 0.5 µs (at 2.2 V to 3.0 V, 4 MHz) 125 µs (at 2.2 V to 3.0 V, 32 kHz) Package MAD00009EEM TQFP080-P-1212D *Lead-free Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP