MICROSEMI LX23108ALILQ

C
O N F I D E N T I A L
LX23108AL
®
TM
8 Ports LED Back Light High Voltage Driver
DATA SHEET
DESCRIPTION
The LX23108AL LED Driver enables
a wide dimming range, achieved
through a combination of LED current
amplitude and PWM duty-cycle
control. In addition, the chipset
provides a thermally robust solution
through advanced system control;
including Drain Voltage Sensing for
Open/Shorts events and per string
Thermal Protection monitoring.
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The LX23108AL LED Driver is
housed in a 32 pin, 5mmx5mm QFN •
package.
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White LED, or RGB Backlight Driver for
large size display panels
Up to 8 LED strings with ± 0.5% precision
current matching.
Wide dimming ratio with PWM duty-cycle
and LED current amplitude controls.
12 bit PWM duty-cycle resolution –
controlled by LX24132 LED Controller.
8 bit resolution for LED current setting –
controlled by LX24132 LED Controller.
Open string, short LED and OverTemperature protection per individual
channel.
W W W. Microsemi .CO M
LX23108AL - is a compact 8 Ports
White or RGB back light LED Driver,
to be used in large display notebooks,
LCD monitors, and TV sets. It is
designed to work together with the
LX24132 LED Controller as a chipset,
driving up to 32 LED strings with a
variable current of up to 200mA peak.
In addition, the LX23108AL provides
the LX24132 LED Controller with its
ports voltage samples, that facilitate the
control of the LED strings supply
voltage through an external DC/DC
converter; minimizing the power
dissipation while regulating the LED
currents for all 8 strings. Current
regulation is maintained within a ± 3
percent.
The LX23108AL LED Driver includes
8 High Bandwidth Current Limiter
Cells with PWM Control (ON/OFF
Signal).
The chip is designed to operate with
external
Sense
Resistors.
Such
configuration
provides
maximum
flexibility for system designers when
scaling up or down the LED currents for
meeting a wide range of high accuracy
application requirements.
KEY FEATURES
APPLICATIONS
LCD Monitor and TV
Large Signage Display
IMPORTANT: For the most current data, consult MICROSEMI’s website:
http://www.microsemi.com
-40 to 85
THERMAL DATA
27.5 ° C/W According to the JESD51-7
RoHS Compliant / Pb-free / MSL 1
THERMAL RESISTANCE-JUNCTION TO AMBIENT
LX23108ALILQ
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the
device/pc-board system. All of the above assume no ambient airflow.
Note: Available in Tape & Reel. Append the letters “TR” to the part number.
(i.e. LX23108ALILQ-TR)
LX23108AL
TA (°C)
PACKAGE ORDER INFO
MLPQ
Plastic 5 x5mm 32 pin
C
O N F I D E N T I A L
LX23108AL
TM
®
8 Ports LED Back Light High Voltage Driver
DATA SHEET
S0
S1
VD1
VD2
S2
S3
VD3
32
31
30
29
28
27
26
25
PWM0
1
24
PSEL_IN
PWM1
2
23
THERM_OUT
PWM2
3
22
VDMEAS
PWM3
4
21
VIO
PWM4
5
20
VREF
PWM5
6
19
VCC
PWM6
7
18
PSEL_CLK
PWM7
8
17
PSEL_OUT
14
15
16
VD4
S6
13
S4
S7
12
S5
11
VD5
10
VD6
9
VD7
Exposed Pad
Connected to AGND
W W W. Microsemi .CO M
Notes: Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of specified terminal.
PACKAGE PIN OUT
VD0
ABSOLUTE MAXIMUM RATINGS
VCC Supply Input Voltage …………………..…………-0.5V to 5.5V
VIO Supply Input Voltage …………………..………… -0.5V to 4.5V
LED Pins………………………………………………. -0.3V to 70V
All other pins ……………………………-0.5V to VIO+0.3 up to 4.5V
Operating Ambient Temperature Range…………………-40 to 85°C
Maximum Operating Junction Temperature…..……………… 150°C
ESD Protection at all I/O pins…………………………+/- 2KV HBM
Storage Temperature Range…………………..………-65°C to 150°C
Package Peak Temperature for Solder Reflow
(40 seconds maximum exposure)…….………………… 260°C(+0,-5)
(Top View)
RoHS / Pb-free Matte Tin Finish / MSL 1
© 2010 Microsemi Corp.
All rights reserved.
For support contact: [email protected]
Visit our web site at: www.microsemi.com
LX23108AL